Manufacture of 3D-MID components: injection-molded plastic carriers with LDS-structured electronic conductor traces.
HARTING 3D-MID (HARTING Technology Group)
3D-MID Production (HARTING Technology Group)New on Amplifa
About HARTING 3D-MID
HARTING 3D-MID is part of the HARTING Technology Group and specializes in the manufacture of Mechatronic Integrated Devices (3D-MID). The technology combines electronic and mechanical functions in a three-dimensional plastic component: The plastic carriers are produced by injection molding as needed and are then given electronic conductor traces using the Laser Direct Structuring (LDS) process. By utilizing the three-dimensional space, the technology enables high integration density, space savings and miniaturization. The solution portfolio includes injection molding, LDS structuring, assembly as well as testing and qualification processes. Customer industries include Medical, Automotive, Industrial and Consumer Electronics. Sales and business languages are German and English; the company also delivers to North America.
- Site
- 3D-MID Production (HARTING Technology Group)
- Processes
- 3D-MID (Mechatronic Integrated Devices) - Injection Molding + Laser Direct Structuring (LDS), Laser Direct Structuring (LDS) for electronic conductor traces, 3D-MID Manufacturing (Mechatronic Integrated Devices), Injection Molding of Plastic Parts, Laser Direct Structuring (LDS), Assembly with Electronic Conductor Traces, Testing and Qualification Processes
- Materials
- Plastic (3D-MID Carrier), Laser Direct Structuring (LDS)
- Industries
- Medical, Automotive, Industrial, Consumer Electronics
- 01
Engineering and Product Development
- 02
Injection Molding of Plastic Carriers
- 03
Laser Direct Structuring (LDS)
- 04
Assembly with Electronic Conductor Traces
- 05
Testing and Qualification Processes
Materials and Processes
Plastic (3D-MID Carrier)
Injection-molded, LDS-capable plastic carriers form the basis for three-dimensional electronic conductor traces.
Laser Direct Structuring (LDS)
Process for structuring electronic conductor traces on three-dimensional plastic parts.
Sites
3D-MID Production
3D-MID Production (HARTING Technology Group)
- Materials
- Plastic (MID Carrier)
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| 3D-MID (Mechatronic Integrated Devices) - Injection Molding + Laser Direct Structuring (LDS)Plastic | – | – | – | – | Plastic (injection-molded MID carriers) |
| Laser Direct Structuring (LDS) for electronic conductor tracesSurface | – | – | – | – | Plastic (LDS-capable MID carriers) |
Additional services