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Swiss-made electronics manufacturing: development, assembly, testing and final assembly of PCBs and electronic devices.

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Hemar Electronic AG (Hemargroup)

Nesselnbach · Mendrisio · Riazzino · Alamosa, CO · Denver, CONew on Amplifa

1974Founded (Hemar Electronic AG)
4000+ m²Production space Mendrisio
1.9+ millionassembled components per day
1 – 1 million unitsLot size range

About Hemargroup

Hemargroup is a Swiss Electronic Manufacturing Services (EMS) company that develops and produces electronic assemblies and complete devices from idea to series production. Its core competence is SMD and THT assembly of printed circuit boards (PCBA) on FR4, aluminium, flex and PTFE material with automated assembly lines, reflow, wave and selective soldering. In addition, hardware, software and firmware development, prototyping, ICT and functional testing, X-ray inspection, mechanical final assembly, cabling as well as warehousing and logistics are offered. The manufacturing facility in Mendrisio covers more than 4000 m² of production space and places more than 1.9 million components per day; lot sizes range from prototype to one million units. The group serves industries such as aerospace, medical technology, defence, industrial and consumer electronics, IoT and telecommunications. The group comprises Hemar Electronic AG (headquarters Nesselnbach), SEFA SA (manufacturing Mendrisio) and HSCS Sagl (engineering Mendrisio).

Site
CH-5524 Nesselnbach
Processes
SMD electronics assembly, THT electronics assembly, Wave soldering, Selective soldering, Pulse heat soldering, Reflow soldering, BGA rework / repairs and upgrades, Automated optical inspection (AOI)
Materials
FR4 printed circuit board, ALU/metal printed circuit board, Flex printed circuit board, PTFE (Teflon) printed circuit board
Certificates
ISO 9001:2015, ISO 14001:2015, AQAP 2110:2016, ISO 13485:2016
Founded
1974
Industries
Aerospace, Medical Technology, Defence, Industrial Electronics, Consumer Electronics, Green Tech
  1. 01

    Engineering (hardware, software, firmware)

  2. 02

    Material and component sourcing

  3. 03

    Prototyping & 0-series

  4. 04

    SMD/THT assembly and soldering

  5. 05

    Testing and programming (AOI, ICT/FCT, X-ray)

  6. 06

    Mechanical final assembly and integration

  7. 07

    Packaging, warehousing and logistics

Materials & Processes

FR4

FR4 printed circuit board

Standard PCBs in single-sided, double-sided and multilayer versions for SMD and THT assembly.

ALU

ALU/metal printed circuit board

Metal-core PCBs for thermally demanding applications such as high-power LED modules.

FLEX

Flex printed circuit board

Flexible PCBs for compact and movable assemblies.

PTFE

PTFE (Teflon) printed circuit board

High-frequency PCBs for RF and telecommunications applications.

Locations

Nesselnbach

CH

Headquarter (Hemar Electronic AG)

Mendrisio (SEFA SA)

CH

Manufacturing

Lot size
Prototype to 1 million units
Materials
FR4, ALU, Flex, PTFE
  • 1x SMD-AOI-THT-AOI high-flow assembly line
  • 2x SMD-AOI high-speed lines
  • 1x SMD line for special dimensions with automatic dispensing
  • 1x SMD assembly cell for prototypes and small series
  • 4x reflow ovens (20/16 zones)
  • 2x THT-AOI assembly lines
  • 4x wave soldering machines
  • 1x selective soldering system
  • Pulse heat soldering machine
  • 18x ICT/FCT test stations
  • X-ray inspection system
  • BGA rework station

Mendrisio (HSCS Sagl)

CH

Engineering

Riazzino

CH

Test Systems

Alamosa, CO

US

Engineering & Production

Denver, CO

US

Office

Industries

AerospaceMedical TechnologyDefenceIndustrial ElectronicsConsumer ElectronicsGreen TechSmart HomeSmart BuildingSmart WearablesTelecommunicationsIoT & SensorsLightingAerospaceDefense & MilitaryIndustrial ElectronicsMedicalTelecommunicationIoT & SensorsLighting

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
SMD electronics assemblyAssembly–1600 mm × 600 mm–1 unit – 1 million unitsFR4, ALU, Flex, PTFE (Teflon)
THT electronics assemblyAssembly–1600 mm × 600 mm–1 unit – 1 million unitsFR4, ALU, Flex, PTFE (Teflon)
Wave solderingJoining––––FR4, ALU, Flex, PTFE (Teflon)
Selective solderingJoining––––FR4, ALU, Flex, PTFE (Teflon)
Pulse heat solderingJoining–––––
Reflow solderingJoining––––FR4, ALU, Flex, PTFE (Teflon)
BGA rework / repairs and upgradesAssembly–––––
Automated optical inspection (AOI)Testing–––––
X-ray inspectionTesting–––––
In-circuit test (ICT)Testing–––––
Functional test (FCT)Testing–––––
Programming of electronic assembliesTesting–––––
Mechanical final assembly, cabling and complex product integrationAssembly–––––
Electronic prototyping & 0-seriesEngineering––––FR4, ALU, Flex, PTFE (Teflon)
PCB layout and routing, schematics, hardware/software/firmware designEngineering–––––
EMC design supportEngineering–––––

12 Anlagen & Maschinen

MachineManufacturer / modelQuantityWorking areaYear builtSite
SMD-AOI-THT-AOI high-flow fully automatic assembly line–1––Mendrisio, CH
SMD-AOI high-speed assembly line–2––Mendrisio, CH
SMD assembly line for special dimensions with automatic dispensing–1––Mendrisio, CH
SMD assembly cell for prototypes and small series–1––Mendrisio, CH
Reflow oven (20/16 zones)–4––Mendrisio, CH
THT-AOI automatic assembly line–2––Mendrisio, CH
Wave soldering machine–4––Mendrisio, CH
Selective soldering system–1––Mendrisio, CH
Pulse heat soldering machine––––Mendrisio, CH
ICT/FCT test station–18––Mendrisio, CH
X-ray inspection system––––Mendrisio, CH
BGA rework station––––Mendrisio, CH

Additional services

SMD and THT electronics assemblyPCBAHardware/software/firmware developmentPrototyping & 0-seriesSmall-scale and mass productionTesting and programming (ICT/FCT, X-ray, functional testing)Rework, repairs and upgradesMechanical and final assemblyCabling, product integration, enclosures & packagingMaterial and component sourcingEMC design supportReverse engineering and obsolescence managementDedicated warehousing and logistics (B2B/B2C)After salesStartup supportMarketing servicesPatent and certification support (CE)

Quality & Certifications

All production processes are ISO and IPC certified; every component receives a QR code for seamless unit-level traceability from warehouse to finished product. An intelligent BI infrastructure continuously monitors the processes.

EvidenceNesselnbachMendrisio
ISO 9001:2015
ISO 14001:2015
ISO 13485:2016
AQAP 2110:2016

History

  1. 1972

    Foundation of SEFA SA in Mendrisio (electronics assembly).

  2. 1974

    Foundation of Hemar Electronic AG as a component importer.

  3. 2010

    Hemar Electronic AG acquires SEFA SA.

  4. 2019

    Hemargroup acquires HSCS Sagl (engineering).

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