Manufactures solder materials, sinter pastes and thick-film pastes for electronics packaging and power electronics.
Heraeus Electronics GmbH & Co. KG
HanauNew on Amplifa
About Heraeus Electronics
Heraeus Electronics is a manufacturer of materials for the assembly and packaging of electronic components. The company develops material solutions for the automotive, power electronics and advanced semiconductor packaging markets at eight development and production centers in Asia, the USA and Europe; the headquarters with EMEA sales is located in Hanau. The product portfolio comprises solder pastes, solder wires and solder preforms (Microbond®) based on vertically integrated solder powder production with controlled purity and narrow particle size distribution, pressureless and pressure/pressureless silver sinter pastes (mAgic), as well as thick-film conductor, resistor, dielectric, resinate, fuel cell and polymer pastes (PriElex®) for printed electronics. Application methods such as screen printing, spraying, dipping or tape casting are supported on substrates such as alumina, glass, LTCC, stainless steel, aluminum and polymer films; for SOFC applications the company offers paste optimization and contract manufacturing. Customer industries include automotive, industrial, medical technology, telecommunications, new energies and consumer electronics. Batch sizes range from grams to tons.
- Site
- Hanau
- Processes
- Sintering without pressure (pressureless sinter paste mAgic DA295A, dispensing/die attach), Sinter paste manufacturing (pressureless sinter pastes), Pressure sintering (mAgic pressure sinter pastes), Solder paste manufacturing (SMT, die attach, advanced packaging, mini-LED, Type 3–8 and higher), Solder wire manufacturing (extrusion process, flux-free soft solder wires with solid core,, Solder preform manufacturing (Microbond® solder preforms, pick-and-place, reflow in, Thick-film conductor paste manufacturing (screen printing, brushing, spraying, tape casting, pad, Thick-film resistor paste manufacturing (milliohms to gigaohms, adjustable TCR)
- Materials
- Silver (micro Ag), SAC305, ULA SAC305, Innolot®, Innolot® 2.0, HT1, PbSn5Ag2.5, PbSn1Ag1.5
- Industries
- Automotive industry / electric and hybrid vehicles, Power electronics, Advanced Semiconductor Packaging, New energies (solar, wind power), Industrial, Medical devices
- 01
Solder powder manufacturing (vertically integrated)
- 02
Paste formulation and composition
- 03
Solder wire extrusion / solder preform manufacturing
- 04
Screen printing prototyping and firing (belt furnaces, box furnaces)
- 05
Rheology and printability evaluation
- 06
Technical support and toll manufacturing
Materials & Processes
Silver (mAgic sinter pastes, micro Ag)
Pressureless pressure-sinter paste DA295A with 82 % Ag content, sinters from 200 °C for die attach in power electronics.
SAC305 / ULA SAC305
Lead-free solder alloy for SMT, die attach and advanced packaging solder pastes.
Innolot® (SnAg3.8Cu0.7Ni0.1Sb1.5Bi3)
High-reliability solder alloy with low melting point for Microbond® solder preforms in power module attach.
Innolot® 2.0
More cost-efficient variant with reduced silver content at comparable reliability.
HT1
High-reliability solder alloy for solder pastes and solder preforms.
Lead-containing solder alloys
Solder wires and alloys (e.g. PbSn5Ag2.5, PbSn10Ag2) for high-temperature die attach applications.
Precious metal thick-film pastes
Conductor pastes made of Ag, AgPd, AgPt, Au, AuPt, Pt, Pd and Cu for hybrid circuits, capacitors and sensors.
RuO2 resistor pastes
Resistance values from milliohms to gigaohms with adjustable temperature coefficient.
Ceramic and glass substrates
Pastes compatible with Al2O3, BeO, ZrO2, TiO2, LTCC, glass, steatite, porcelain and PZT.
PriElex® polymer pastes / electronic inks
Silver, carbon, PTC and Ag/AgCl inks for printed electronics on PET, polyimide and PC.
SOFC fuel cell pastes
Pastes for anodes, electrolytes, cathodes, interconnects and sealing glasses, including contract manufacturing.
100 % recycled tin
Solder alloys with recycled tin according to RMI and ISO 14021 for CO2 reduction.
Sites
Hanau
DEHeadquarters and EMEA Sales
- Materials
- Solder materials, sinter pastes, thick-film pastes
- Continuous belt furnaces
- Box furnaces
- Belt furnaces with alternating atmosphere
Components & Products
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Sintering without pressure (pressureless sinter paste mAgic DA295A, dispensing/die attach)Joining | – | – | – | – | Silver (micro Ag sinter paste, 82 % Ag content, particle |
| Sinter paste manufacturing (pressureless sinter pastes)Plastics | – | – | – | – | Silver |
| Pressure sintering (mAgic pressure sinter pastes)Joining | – | – | – | – | Silver |
| Solder paste manufacturing (SMT, die attach, advanced packaging, mini-LED, Type 3–8 and higher)Plastics | – | – | – | – | SAC305, ULA SAC305, high-reliability solder alloys, low-temperature solder alloys, Innolot®, HT1, 100 % recycled tin |
| Solder wire manufacturing (extrusion process, flux-free soft solder wires with solid core,Plastics | – | – | – | – | PbSn1Ag1.5, PbSn2Ag2.5, PbSn5Ag1.5, PbSn5Ag2.5, PbSn10Ag2, PbSn5, PbIn5Ag5, SnSb5, SnAg20, SnAg25Sb10, lead-containing solder alloys, lead-free solder alloys |
| Solder preform manufacturing (Microbond® solder preforms, pick-and-place, reflow inJoining | – | – | – | – | Innolot® (SnAg3.8Cu0.7Ni0.1Sb1.5Bi3), Innolot® 2.0 (SnAg1.5Cu0.7Sb1.5Bi3xx), Cu, Ag |
| Thick-film conductor paste manufacturing (screen printing, brushing, spraying, tape casting, padPlastics | – | – | – | – | – |
| Thick-film resistor paste manufacturing (milliohms to gigaohms, adjustable TCR)Plastics | – | – | – | – | RuO2, Ag, AgPd, AgPt, oxide ceramics, nitride ceramics, stainless steel, aluminum, dielectrics |
| Thick-film dielectric/insulating paste manufacturing (screen printing technology)Plastics | – | – | – | – | ceramics, stainless steel, aluminum, glass, oxide ceramics, nitride ceramics |
| Resinate paste manufacturing (metal-organic pastes for thin films)Plastics | – | – | – | – | – |
| Fuel cell paste manufacturing (SOFC: anodes, electrolytes, cathodes, current collectors,Plastics | – | – | – | Grams – Tons | precious metal powders, glass powders, ceramic powders, oxides, binary alloys, organic binders |
| Polymer thick film (PTF) pastes / electronic inks (PriElex®, screen printing, gravure printing,Plastics | – | – | – | – | Ag (silver inks), Ag/AgCl, carbon (carbon resistor inks), PTC inks, UV-curable anisotropic ink (Z-904), water-based inks (WB-1078), PET/polyimide/PC |
| Screen printing prototyping (thick film)Surface treatment | – | – | – | – | – |
| Firing (continuous belt furnaces, box furnaces, alternate atmosphere belt furnaces)Heat treatment | – | – | – | – | thick-film pastes, ceramics, steel |
| Laser etching for RF manufacturingSurface treatment | – | – | – | – | – |
| Solder powder manufacturing (vertically integrated, narrow particle size distribution)Plastics | – | – | – | – | tin alloys, SAC305, Innolot® |
3 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Continuous belt furnace | Heraeus | – | – | – | Heraeus Thick Film Production |
| Chamber furnace (box furnace) | Heraeus | – | – | – | Heraeus Thick Film Production |
| Belt furnace with alternating atmosphere (alternate atmosphere belt furnace) | Heraeus | – | – | – | Heraeus Thick Film Production |
Additional services
History
The thick-film division of Heraeus Precious Metals has been formulating pastes, precious metal powders and glass powders for over 40 years.