Development and distribution of TLP, VF-TLP, HBM, HMM and CC-TLP test systems for the semiconductor industry
High Power Pulse Instruments GmbH
Haar (Stadlerstrasse 6A, 85540)New on Amplifa
About High Power Pulse Instruments
High Power Pulse Instruments (HPPI) GmbH, based in Haar near Munich, develops and distributes measurement and test systems for the electrostatic characterization of semiconductor devices. The product portfolio includes Transmission-Line-Pulse (TLP) systems up to 160 A and 43 kV HMM, VF-TLP systems, HBM test systems according to ANSI/ESDA/JEDEC JS-001, CC-TLP solutions for CDM investigation based on a method from Fraunhofer EMFT, as well as the fully automatic ATS-8300G probing system for package and wafer level. The offering is complemented by probes, probe arm kits, bias tees, load resistors, pulse modules, current sensors, calibration substrates, software and ESD consulting. The systems are used, among other things, for recording high-current I-V characteristics, turn-on/off transients, breakdown investigations and SOA characterization of RF LDMOS, DMOS, CMOS and BJT devices. Customers come from semiconductor device development, ESD protection as well as RF and microwave applications.
- Site
- Haar
- Processes
- TLP (Transmission Line Pulse) characterization, VF-TLP characterization, HBM testing (ANSI/ESDA/JEDEC JS-001), HMM testing (Human Metal Model, up to 15 kV / 43 kV), CC-TLP (CDM investigation according to Fraunhofer EMFT), Wafer-level calibration (TLP/VF-TLP/HMM/HBM), On-wafer measurements with high-performance TLP probes, Temperature measurements (thermal chuck, up to 300 mm probe stations)
- Materials
- Transmission Line Pulse (TLP), Very Fast TLP, Human Body Model (ANSI/ESDA/JEDEC JS-001), Human Metal Model (IEC 61000-4-2 Systemlevel), Contactless CDM (Fraunhofer EMFT)
- Certificates
- ANSI/ESDA/JEDEC JS-001 (HBM)
- Industries
- Semiconductor industry, Semiconductor device development, ESD protection, RF & Microwave, ESD protection solutions, RF & Microwave (ARMMS)
- 01
Development of the test systems
- 02
Manufacturing of the hardware (pulse generators, probing systems, accessories)
- 03
Software development
- 04
Calibration (wafer level)
- 05
Distribution and support
- 06
ESD consulting
Products and Measurement Methods
Transmission Line Pulse (TLP)
High-current I-V characterization under pulsed operation with pulse widths from 1 ns to 1.6 µs.
Very Fast TLP
Investigation of fast ESD events with rise times from 30 ps.
Human Body Model (ANSI/ESDA/JEDEC JS-001)
Standard-compliant ESD testing from 30 V to 10 kV, individually or as a 30-pin matrix.
Human Metal Model (IEC 61000-4-2 Systemlevel)
System-level ESD tests up to 43 kV.
Contactless CDM (Fraunhofer EMFT)
Contactless investigation of Charged-Device-Model events with DC test option.
Locations
Haar
DEHeadquarters, development and distribution
- ATS-8300G (320 mm × 320 mm)
- HBM-TS10-A
- TLP-8010C Advanced
- TLP-3010C
- TLP-16010C
- PS-5026B
- CCTLP-DC
- 30-Pin HBM Matrix Tester
Test Systems and Accessories
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| TLP (Transmission Line Pulse) characterizationTesting | – | 320 mm × 320 mm | – | – | – |
| VF-TLP characterizationTesting | – | – | – | – | – |
| HBM testing (ANSI/ESDA/JEDEC JS-001)Testing | – | – | – | – | – |
| HMM testing (Human Metal Model, up to 15 kV / 43 kV)Testing | – | – | – | – | – |
| CC-TLP (CDM investigation according to Fraunhofer EMFT)Testing | – | – | – | – | – |
| Wafer-level calibration (TLP/VF-TLP/HMM/HBM)Testing | – | 24 mm × 24 mm | – | – | – |
| On-wafer measurements with high-performance TLP probesTesting | – | – | – | – | – |
| Temperature measurements (thermal chuck, up to 300 mm probe stations)Testing | – | 300 mm | – | – | – |
| DC-tested CC-TLP probing measurementsTesting | – | – | – | – | – |
| Characterization of semiconductor devices under pulsed operation (I-V characteristics, SOA,Testing | – | – | – | – | – |
21 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Automated test/probing system (TLP, VF-TLP, HBM, HMM, CC-TLP) | HPPI ATS-8300G | 1 | 320 mm x 320 mm | – | – |
| HBM test system (10 kV, ANSI/ESDA/JEDEC) | HPPI HBM-TS10-A | 1 | – | – | – |
| VF-TLP/TLP system (80 A) with 15 kV HMM, optional 6 kV HBM | HPPI TLP-8010C Advanced | 1 | – | – | – |
| TLP/VF-TLP/HMM test system (30 A) | HPPI TLP-3010C | 1 | – | – | – |
| High voltage 50 Ω pulse generator (160 A, up to 43 kV HMM) | HPPI TLP-16010C | 1 | – | – | – |
| Portable wafer probe station for TLP/VF-TLP/HMM/HBM | HPPI PS-5026B | 1 | – | – | – |
| 30-pin HBM matrix tester (30 V to 10 kV) | HPPI | 1 | – | – | – |
| Solid-state 2-pin HBM pulser (±30 V to ±10 kV) | HPPI | 1 | – | – | – |
| CC-TLP probing system with DC test | HPPI CCTLP-DC | 1 | – | – | – |
| CC-TLP probe | HPPI CC-TLP-50-A1 | 1 | – | – | – |
| TLP probes (high-performance VF-TLP/TLP on-wafer) | HPPI HP-T26A | 1 | – | – | – |
| Probe arm kit (TLP/VF-TLP/HMM picoprobe) | HPPI PHD-4001A | 1 | – | – | – |
| Pulse force/sense probe (GGB picoprobe model 10) with touchdown force sensors | HPPI PHD-3001A-FS | 1 | – | – | – |
| Pulse current sensor (160 A in 150 ps, 3 GHz bandwidth) | HPPI CS-0V5-A | 1 | – | – | – |
| Calibration substrate (wafer level) | HPPI CAL-04A | 1 | 24 mm x 24 mm, pitch 50 µm to 3 mm | – | – |
| Wafer-level calibration substrate | HPPI | 1 | – | – | – |
| Flexible pitch GND fixture (GND clamps) | HPPI GF-A | 1 | – | – | – |
| Bias tee (1 kV, 10 A, 4 GHz) for DC-biased TLP/VF-TLP/HMM/RF measurements | HPPI BT-101000B | 1 | – | – | – |
| 15 kV 50 Ω coaxial load resistor (100 W, DC to 3.5 GHz) | HPPI | 1 | – | – | – |
| 30 ps rise-time pulse module with pick-off and DUT switch | HPPI | 1 | – | – | – |
| Pulse width extender | HPPI TLP-3011C / TLP-8012A5 | – | – | – | – |
Additional services
Reference customers
Quality and Standards
The systems comply with recognized standards such as ANSI/ESDA/JEDEC JS-001 (HBM) and IEC 61000-4-2 (system-level ESD); wafer-level calibration substrates such as CAL-04A support measurement accuracy. No documented ISO certificates are available.
| Evidence | Haar |
|---|---|
| ANSI/ESDA/JEDEC JS-001 (HBM) |
History
- 2012
Publication 'High Current TLP Characterisation' at the ARMMS conference (November 19–20, 2012, Wyboston Lakes, UK)
- 2013
First products (TLP-3010C, PS-5026B, accessories) published on the website
- 2014
Release of the software and calibration products 'Accurate Sub-ns Timing' and 'Accurate Calibration'
- 2026
Launch of ATS-8300G, CC-TLP-50-A1, TLP-16010C, CCTLP-DC and further new products