Swiss manufacturer of custom microelectronics: thin-film substrates, HiCoFlex® flexible circuits, cryogenic cables and resistor networks.
Hightec MC AG
Olten (CH) · Headquarters, development and production (cleanroom)New on Amplifa
About Hightec MC AG
Hightec MC AG is an independent Swiss manufacturer of custom microelectronics based in Olten. The company produces thin-film circuits and structured substrates (4" to 12"), multilayer substrates (MCM) with up to four layers and integrated NiCr resistors, ultra-thin flexible HiCoFlex® circuits from 20 µm total thickness, micro cables for catheters and endoscopes, superconducting cryogenic cables down to 50 mK, and laser-trimmed resistor networks made of NiCr and TaN. The value chain includes thin-film coating (sputtering, electroplating), photolithography down to line/space 10/10 µm (LDI) or 5 µm resolution (mask aligner), assembly with pick & place, flip-chip and wire bonding, as well as electrical testing and screening tests per MIL-STD 883 – all entirely in Switzerland from a single source. Base materials are Al2O3, AlN, molybdenum, steel and polyimide; metallizations are done with Cu, Ni, Au, Ti, Cr, Pd, Pt, Sn, Nb and Al. Customer industries include medical technology, aerospace, industrial, defense, RF technology and quantum computing. In 2024 the company moved into a new cleanroom in Olten.
- Site
- Olten
- Processes
- Thin-film coating (sputtering) of structured substrates 4" to 12", Electroplating (Cu, Ni, Au, Pt), Photolithography /(additive process) fine structuring down to line/space 10/10 µm (LDI), 5 µm, MCM multilayer substrates (up to 4 layers) with additive thin-film technology and integrated, HiCoFlex® ultra-thin flexible multilayer circuits (from 20 µm, up to 5 metal layers, up to 12" x 12", Micro cables for catheters/endoscopes, lengths up to 1500 mm, 2-128 traces, trace widths, SC HiCoFlex® superconducting cryogenic cables down to 50 mK, Laser trimming of NiCr and TaN thin-film resistor networks with accuracy down to 1‰
- Materials
- Aluminum oxide (Al2O3), Aluminum nitride (AlN), Molybdenum, Steel, Polyimide, Copper (Cu), Nickel (Ni), Gold (Au)
- Certificates
- 100 % electrical testing (flying probe, C-Tester), Testing per MIL-STD 883, Quality certificates on customer request
- Founded
- 1992
- Industries
- Medical technology, Aerospace, Industrial, Defense, RF technology, Quantum computing
- 01
Development & Design (CAD, feasibility study)
- 02
Prototyping & pre-production
- 03
Thin-film coating (sputtering, electroplating)
- 04
Photolithography & etching
- 05
Assembly & integration (pick & place, flip-chip, wire bonding, soldering)
- 06
Laser trimming
- 07
Curing & testing
Sites
Olten
CHHeadquarters, development and production (cleanroom)
- Part weight / size
- Substrates 4"–12", HiCoFlex® up to 12" x 12", micro cables
- Lot size
- Prototype to large series (> 1'000 pcs.)
- Materials
- Al2O3, AlN, molybdenum, steel, polyimide, Cu, Ni, Au
- Mask aligner (up to 6" x 6", 5 µm)
- Laser Direct Imaging (up to 12" x 12", 10/10 µm)
- Sputtering system
- Electroplating system
- Automatic screen printing machine
- Pick-and-place machines
- Soldering furnace with defined atmosphere
- Al wedge-wedge bonder
- Au ball bonder
- Flying probe tester
- C-Tester
- Laser trimming system
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Thin-film coating (sputtering) of structured substrates 4" to 12"Surface | – | 12" | – | Large series > 1'000 pcs. | Al2O3, AlN, molybdenum, steel, polyimide, rigid carriers |
| Electroplating (Cu, Ni, Au, Pt)Surface | – | – | – | – | Cu, Ni, Au, Pt |
| Photolithography /(additive process) fine structuring down to line/space 10/10 µm (LDI), 5 µmSurface | Line/space 10/10 µm; resolution down to 5 µm | 12" x 12" | – | – | Al2O3, AlN, polyimide, metals |
| MCM multilayer substrates (up to 4 layers) with additive thin-film technology and integratedEngineering | – | – | – | – | Cu/Ni, Au, AuSn, polyimide, NiCr |
| HiCoFlex® ultra-thin flexible multilayer circuits (from 20 µm, up to 5 metal layers, up to 12" x 12"Additive | – | 12" x 12" × 20-50 µm total thickness | – | Large series | polyimide (up to 350 °C), Cu, Ni, Au |
| Micro cables for catheters/endoscopes, lengths up to 1500 mm, 2-128 traces, trace widthsAdditive | – | 1500 mm | – | – | Cu/Ni/Au |
| SC HiCoFlex® superconducting cryogenic cables down to 50 mKAdditive | – | – | – | – | superconducting materials, polyimide |
| Laser trimming of NiCr and TaN thin-film resistor networks with accuracy down to 1‰Testing | 1‰ | – | – | – | NiCr, TaN (tantalum nitride) |
| Assembly & integration: conductive epoxy paste (screen printing), pick & place, flip-chip, wireAssembly | – | – | – | – | epoxy paste, Al, Au |
| Electrical testing (flying probe, C-Tester), optical inspection, burn-in, temperature shock,Testing | – | – | – | – | – |
| Development & Design: CAD layout, feasibility studies, prototyping, pre-productionEngineering | – | – | – | < 100 pcs. – > 1'000 pcs. | – |
| RF microstrip, stripline and waveguide structures in thin-film technologyEngineering | – | – | – | – | Cu, Ni, Au |
| Etching for structuringSurface | – | 4", 6", 12" | – | – | Al2O3, AlN, metals, polyimide |
12 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Mask aligner | – | – | Substrates up to 6" x 6", resolution down to 5 µm | – | Olten |
| Laser Direct Imaging (LDI) | – | – | Substrates up to 12" x 12", line/space 10/10 µm | – | Olten |
| Sputtering system | – | – | Substrates 4"-12" | – | Olten |
| Electroplating system | – | – | – | – | Olten |
| Automatic screen printing machine (conductive epoxy paste) | – | – | – | – | Olten |
| Manual and automatic pick-and-place machines | – | – | – | – | Olten |
| Computer-controlled soldering furnace (defined atmosphere) | – | – | – | – | Olten |
| Al wedge-wedge bonder | – | – | – | – | Olten |
| Au ball bonder | – | – | – | – | Olten |
| Flying probe tester | – | – | – | – | Olten |
| C-Tester | – | – | – | – | Olten |
| Laser trimming system | – | – | – | – | Olten |
Additional services
Quality
Every product leaves the premises electrically tested: flying probe and C-testers as well as optical inspection ensure compliance with customer specifications. In addition, burn-in, temperature shock and accelerated tests per MIL-STD 883 as well as quality certificates are offered on request.
| Evidence | Olten |
|---|---|
| 100 % electrical testing (flying probe, C-Tester) | |
| Testing per MIL-STD 883 | |
| Quality certificates on customer request |
History
- 1979
Start of thin-film production on 4" carriers under BBC (today ABB).
- 1992
Founding of Hightec MC AG as an independent Swiss company.
- 1998
First HiCoFlex® circuits produced on 6" panels.
- 2003
First use of HiCoFlex® as an implant in medical technology.
- 2010
Completion of the large-format production line based on state-of-the-art semiconductor technology.
- 2011
Start of HiCoFlex® large-format series production.
- 2012
First single-layer superconducting HiCoFlex® cryogenic cables produced.
- 2014
HiCoFlex® with double-sided metallization realized.
- 2018
First multilayer superconducting HiCoFlex® cryogenic cables produced.
- 2024
Move into a new cleanroom in Olten.