Manufacturing of high-precision printed circuit boards – multilayer, flex, rigid-flex, IMS aluminum and RFID PCBs, entirely in Germany.
HOTOPRINT Elektronik GmbH & Co. KG
Lamspringe (DE)New on Amplifa
About Hotoprint
Hotoprint Elektronik is a family-owned manufacturer of high-precision printed circuit boards, established in 1974 and based in Lamspringe. The company produces single- and double-sided PCBs, multilayers up to 12 layers, fine-line PCBs with micro vias, blind vias, buried vias and plugging as well as flexible, rigid-flex and semiflex PCBs. Further product areas include IMS aluminum PCBs with aluminum core, PCBs with integrated RFID module including serialization and anti-counterfeiting protection, as well as antenna manufacturing. The entire value chain from CAD/CAM via direct imaging (MDI with UV-LED), electroplating and solder mask coating through to surface finishing is carried out in the company's own production facility in Germany. Materials used are copper, FR4, polyimide and aluminum; surface finishes are hot air leveling, chemical tin and nickel-palladium-gold. Hotoprint offers prototypes and rush orders from 3 working days; the standard delivery time for double-sided and multilayer boards is currently 10 working days. Customers include the electronics industry and RFID applications.
- Site
- Lamspringe
- Processes
- Single- & double-layer PCBs, Multilayer PCBs up to 12 layers, Fine-line PCBs / micro vias / blind vias / buried vias / plugging, Flexible PCBs, Rigid-flex & semiflex PCBs, IMS aluminum PCBs (aluminum core), RFID PCBs / PCBs with integrated RFID module, Antenna manufacturing
- Materials
- Copper, Aluminum (IMS aluminum core), Polyimide (Flex), FR4, Tin (chemical), Nickel-Palladium-Gold, Hot Air Leveling, Chemical Tin
- Certificates
- ISO 9001:2015
- Founded
- 1974
- Industries
- Electronics, RFID applications
Technologies & Materials
FR4
Base material for single- and double-sided PCBs and multilayers up to 12 layers.
Polyimide (Flex)
Base material for flexible as well as rigid-flex and semiflex PCBs.
Aluminum (IMS aluminum core)
Aluminum core for IMS PCBs with improved heat dissipation.
Copper
Conductor material for all PCB types, processed by electroplating, etching and drilling.
Hot Air Leveling
Surface finish for solderable PCB surfaces.
Chemical Tin
Flat, lead-free final surface for assembly applications.
Nickel-Palladium-Gold
High-quality surface finish for requirements on contacting and durability.
Locations
Lamspringe
DEManufacturing and administration
- Materials
- Copper, FR4, polyimide, aluminum
- CNC drilling/milling machines (CNC drilling/milling department)
- Automatic electroplating line
- MDI direct imaging with UV-LED
- AOI system
Printed Circuit Boards
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Single- & double-layer PCBsPCB manufacturing | – | – | – | – | Copper, FR4 |
| Multilayer PCBs up to 12 layersPCB manufacturing | – | – | – | – | Copper, FR4 |
| Fine-line PCBs / micro vias / blind vias / buried vias / pluggingPCB manufacturing | – | – | – | – | Copper |
| Flexible PCBsPCB manufacturing | – | – | – | – | Polyimide, Copper |
| Rigid-flex & semiflex PCBsPCB manufacturing | – | – | – | – | Polyimide, FR4, Copper |
| IMS aluminum PCBs (aluminum core)PCB manufacturing | – | – | – | – | Aluminum, Copper |
| RFID PCBs / PCBs with integrated RFID modulePCB manufacturing | – | – | – | – | Copper |
| Antenna manufacturingPCB manufacturing | – | – | – | – | – |
| Prototypes / rush services (from 3 working days)PCB manufacturing | – | – | – | – | – |
| CAD / CAMEngineering | – | – | – | – | – |
| Multilayer pressing/laminationPCB manufacturing | – | – | – | – | FR4, Copper |
| DrillingPCB manufacturing | – | – | – | – | – |
| Desmear / shadow processSurface | – | – | – | – | – |
| Photo process – circuit pattern (MDI direct imaging with UV-LED)PCB manufacturing | – | – | – | – | – |
| ElectroplatingSurface | – | – | – | – | Copper |
| Stripping / etchingPCB manufacturing | – | – | – | – | Copper |
| Optical inspection / AOITesting | – | – | – | – | – |
| Solder mask coatingSurface | – | – | – | – | – |
| Surface finishing (hot air leveling, chemical tin, nickel-palladium-gold)Surface | – | – | – | – | Tin, Nickel, Palladium, Gold |
| MillingPCB manufacturing | – | – | – | – | – |
| Screen printingSurface | – | – | – | – | – |
| Electrical testingTesting | – | – | – | – | – |
| Direct printing and integration of optical short-range networksPCB manufacturing | – | – | – | – | – |
4 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| CNC drilling/milling machines (CNC drilling/milling department) | – | – | – | – | Lamspringe |
| Automatic electroplating line | – | – | – | – | Lamspringe |
| MDI direct imaging with UV-LED | – | – | – | – | Lamspringe |
| AOI system (optical inspection) | – | – | – | – | Lamspringe |
Additional services
Quality
Production is safeguarded by automatic optical inspection (AOI) and electrical testing; MDI direct imaging with UV-LED enables high-precision circuit patterns.
| Evidence | Lamspringe |
|---|---|
| ISO 9001:2015 |
Company History
- 1974
Foundation; over 50 years of experience in PCB manufacturing
- 2025
Re-certification according to DIN ISO 9001:2015