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Hotoprint – Fertigung

German PCB manufacturing: multilayers up to 12 layers, flex, rigid-flex, IMS and RFID printed circuit boards including prototypes from 3 working days.

Hotoprint Logo

HOTOPRINT Elektronik GmbH & Co. KG

LamspringeNew on Amplifa

1974Founded
31195 LamspringeLocation
12 layersMultilayer max.
from 3 working daysPrototypes/Express

About Hotoprint

Hotoprint Elektronik is a family-owned manufacturer of high-precision printed circuit boards founded in 1974 and based in Lamspringe (Lower Saxony). Its manufacturing range covers single- and double-sided printed circuit boards, multilayers up to 12 layers, fine-line boards with micro vias, blind vias, buried vias and plugging, as well as flexible, rigid-flex and semiflex boards on a polyimide basis. In addition, IMS boards with an aluminium core and boards with an integrated RFID module for traceability and anti-counterfeiting are manufactured. The entire value chain takes place in Germany – from CAD/CAM via MDI direct imaging with UV-LED, drilling, electroplating, solder mask coating and surface finishing through to milling, screen printing, AOI inspection and electrical testing. Surface finishes include hot-air leveling, chemical tin and nickel-palladium-gold. Prototypes and express services are deliverable from 3 working days; the standard lead time for double-/multilayer boards is currently 10 working days.

Site
Lamspringe
Processes
Single-sided printed circuit boards, Double-sided printed circuit boards, Multilayers up to 12 layers, Micro vias / blind vias / buried vias / plugging, Flexible printed circuit boards, Rigid-flex & semiflex printed circuit boards, IMS boards (aluminium core), Printed circuit boards with integrated RFID module
Materials
Copper, FR4, Polyimide, Aluminium (aluminium core), Tin (chemical), Nickel-Palladium-Gold, Chemical tin, Hot-Air-Leveling
Certificates
DIN ISO 9001:2015, ISO 9001
Founded
1974
Industries
Electronics
  1. 01

    CAD/CAM

  2. 02

    MDI direct imaging (circuit pattern)

  3. 03

    Drilling

  4. 04

    Desmear/shadow process

  5. 05

    Electroplating

  6. 06

    Stripping/etching

  7. 07

    Solder mask coating

  8. 08

    Surface finishing

  9. 09

    Screen printing

  10. 10

    Milling

  11. 11

    AOI inspection

  12. 12

    Electrical testing

Materials & Processes

FR4

FR4

Standard base material for single- and double-sided printed circuit boards as well as multilayers.

PI

Polyimide

Base material for flexible as well as rigid-flex and semiflex printed circuit boards.

Alu

Aluminium (aluminium core)

Core material for IMS boards with improved heat dissipation.

Cu

Copper

Conductor material for all board types, also in electroplating.

Sn

Chemical tin

Surface finish as a solder-friendly finish.

Ni-Pd-Au

Nickel-Palladium-Gold

Surface finish for the highest requirements on contact reliability.

HAL

Hot-Air-Leveling

Proven hot-air finishing process for printed circuit board surfaces.

Sites

Standort Lamspringe

Lamspringe

DE

Manufacturing / Headquarters

Lot size
Prototypes to series (lot size from 1)
Materials
FR4, polyimide, aluminium, copper
  • Electroplating line
  • CNC drilling/milling machines
  • MDI direct imaging with UV-LED

Components

Multilayer printed circuit board
Multilayer printed circuit boardPCB manufacturing · Electronics
Printed circuit board with surface finish
Printed circuit board with surface finishSurface finishing · Electronics
Printed circuit board
Printed circuit boardPCB manufacturing · Electronics

Inside the production

MDI direct imaging with UV-LED
MDI direct imaging with UV-LED
Screen printing
Screen printing
Express service
Express service
Research and development
Research and development
50 years of quality printed circuit boards
50 years of quality printed circuit boards
Business meeting
Business meeting

Industries

Electronics

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
Single-sided printed circuit boardsPCB manufacturing––––Copper, FR4
Double-sided printed circuit boardsPCB manufacturing––––Copper, FR4
Multilayers up to 12 layersPCB manufacturing––––Copper, FR4
Micro vias / blind vias / buried vias / pluggingPCB manufacturing–––––
Flexible printed circuit boardsPCB manufacturing––––Polyimide, Copper
Rigid-flex & semiflex printed circuit boardsPCB manufacturing––––Polyimide, Copper, FR4
IMS boards (aluminium core)PCB manufacturing––––Aluminium, Copper
Printed circuit boards with integrated RFID modulePCB manufacturing–––––
Prototypes & express service (from 3 working days)PCB manufacturing–––1–
Multilayer pressing/laminationPCB manufacturing–––––
DrillingPCB manufacturing–––––
Desmear / shadow processPCB manufacturing–––––
Photolithography – circuit pattern (MDI direct imaging with UV-LED)PCB manufacturing–––––
ElectroplatingSurface––––Copper
Stripping / etchingPCB manufacturing––––Copper
Optical inspection / AOITesting–––––
Solder mask coatingSurface–––––
Surface finishing (hot-air leveling, chemical tin, nickel-palladium-gold)Surface––––Tin, Nickel, Palladium, Gold
MillingPCB manufacturing––––FR4, Aluminium, Polyimide
Screen printingSurface–––––
Electrical testingTesting–––––
CAD / CAMEngineering–––––
Direct printing and integration of optical short-range networksPCB manufacturing–––––

3 Anlagen & Maschinen

MachineManufacturer / modelQuantityWorking areaYear builtSite
Electroplating line––––Lamspringe
CNC drilling/milling machines––––Lamspringe
MDI direct imaging with UV-LED––––Lamspringe

Additional services

Prototypes & express service (from 3 working days)CAD/CAMElectrical testingAOI inspectionSurface finishing (hot-air leveling, chemical tin, nickel-palladium-gold)MDI direct imaging with UV-LEDScreen printingMillingElectroplating

Quality

PCB manufacturing is safeguarded by AOI inspection and electrical testing. The company is re-certified according to DIN ISO 9001:2015.

EvidenceLamspringe
ISO 9001

History

  1. 1974

    Company founded; over 50 years of experience in PCB manufacturing.

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