Development and series production of Solid State Power Modules (SSPC) and Remote Power Distribution Units (RPDU) for the aerospace industry.
HS Elektronik Systeme GmbH
Nördlingen (Anton-Jaumann-Industrial Park)New on Amplifa
Company
HS Elektronik Systeme GmbH is an electronics technology company with more than 100 employees at its Nördlingen site. The company develops and produces Solid State Power Modules (SSPC) and Remote Power Distribution Units (RPDU) for electrical power distribution in aircraft. SSPCs are programmable, maintenance-free and pluggable modules for electrical power distribution that cover DC and AC applications as well as digital and analog inputs for data acquisition. RPDUs contain multiple SSPCs and are deployed decentrally at individual points of the aircraft. Manufacturing is based, among other things, on a patent-protected Chip-On-Board (COB) technology in automated high-volume production, as well as on thick-film hybrid microcircuits and plastic hybrid components. Development and series production are bundled at the site; customers include Airbus, Boeing, Bombardier, Embraer and Comac. The company is part of Collins Aerospace as an independent subsidiary and thus of Raytheon Technologies Corporation.
- Site
- Nördlingen
- Processes
- Thick-film hybrid microcircuits (development and production), Chip-On-Board technology (COB), automated high-volume production, Plastic hybrid components (manufacture/introduction), Solid State Power Module (SSPC) – development and series production, Remote Power Distribution Units (RPDU) – development and series production, Development, Series production, Chip-On-Board technology (COB)
- Materials
- Plastic, Chip-On-Board Technology, Thick-Film Hybrid Microcircuits, Plastic Hybrid Components
- Founded
- 1987
- Employees
- >100
- Industries
- Aerospace (civil and military)
- 01
Development
- 02
Thick-film hybrid microcircuits
- 03
Chip-On-Board technology (COB)
- 04
Plastic hybrid components
- 05
Series production
- 06
Assembly
Technologies and Materials
Chip-On-Board Technology
Patent-protected assembly technology for automated high-volume production with savings in cost, weight and size.
Thick-Film Hybrid Microcircuits
Original manufacturing focus for electronic components, further developed into programmable power circuits.
Plastic Hybrid Components
Used to achieve significant cost and weight savings in aviation.
Locations
Nördlingen
DEHeadquarters with development and production
- Materials
- Plastic
- Development laboratories
- Automated COB high-volume production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Thick-film hybrid microcircuits (development and production)Assembly | – | – | – | – | – |
| Chip-On-Board technology (COB), automated high-volume productionAssembly | – | – | – | – | – |
| Plastic hybrid components (manufacture/introduction)Assembly | – | – | – | – | Plastic |
| Solid State Power Module (SSPC) – development and series productionEngineering | – | – | – | – | – |
| Remote Power Distribution Units (RPDU) – development and series productionEngineering | – | – | – | – | – |
Additional services
Reference customers
History
- 1987
Founded as part of LRE Relais und Elektronik GmbH
- 1990
Construction of a production facility with 2,400 m² in Nördlingen
- 1999
Acquired by United Technologies Corporation
- 2003
Renamed HS Elektronik Systeme GmbH
- 2013
Opening of a new production facility with 4,900 m² in the Anton-Jaumann-Industrial Park, Nördlingen
- 2018
Subsidiary of Collins Aerospace following UTC's acquisition of Rockwell Collins Corporation
- 2020
Part of Raytheon Technologies Corporation (merger of UTC/RTX)
- 2023
10th site anniversary in the Anton-Jaumann-Industrial Park