Industrial agency and trading of sputter targets, coating materials, as well as development and manufacturing of thick-film and hybrid circuits
Hubert Heusner Industrievertretungen und Handel
RodgauNew on Amplifa
About Hubert Heusner
Hubert Heusner is a company specializing in industrial agency and trading, based in Rodgau. The portfolio comprises sputter targets and coating materials for PVD and CVD processes (sputtering and electron beam evaporation) as well as special materials ON DEMAND from lot size 1, including alloys, nitrides, oxides, carbides, borides, silicides, sulfides, tellurides and titanates. In addition, Advanced Ceramics (including AlN, Si3N4, WC, SiC, TiB2) are offered as semi-finished parts, as well as self-lubricating composite materials based on Cu-Sn, developed among others for the ESA project BepiColombo. Another pillar is the development and manufacturing of thick-film and hybrid circuits from technology development through to volume production – with screen printing in a Class 10,000 cleanroom, wire bonding, SMT assembly, chip on board, laser resistor trimming and 100% functional testing. The offering is rounded off by bonding of targets onto copper backplates and warehousing for short delivery times. Suppliers come from Germany, Austria, England, Spain and China.
- Site
- Rodgau
- Processes
- Supply/manufacture of sputter targets (PVD coating material), Supply of coating material for electron beam evaporation (CVD/PVD), Special materials ON DEMAND (sputter targets, alloys, ceramics), Manufacture/supply of advanced ceramics (high-performance ceramics), Self-lubricating composite materials (Self Lubricating Composites) based on Cu-Sn, Thick-film/hybrid circuits: screen printing (thick-film technology), Wire bonding (Au and Al wire bonding), SMT assembly (Surface Mount Technology)
- Materials
- Titanium Aluminum (TiAl 33/67, 50/50, 60/40 at%), Aluminum Chromium (AlCr 50/50, 70/30 at%), Nickel Vanadium (NiV 93/7 wt%), Tungsten Titanium (WTi 90/10 wt%), Chromium (Cr), Zirconium (Zr), Titanium (Ti), Nickel (Ni)
- Certificates
- ISO 9001, ISO/TS 16949, Quality manual Mil-STD-883, 100% functional test/ICT, Lot traceability & FMEA
- Industries
- Automotive supplier industry, Electronics industry, PVD/CVD coating industry, Thin-film photovoltaics (CIGSe, aSi, CdTe), Aerospace, Medical technology
- 01
Consulting and development consulting
- 02
Procurement from suppliers (DE, AT, UK, ES, CN)
- 03
Manufacturing of special materials and targets
- 04
Target bonding onto copper backplates
- 05
Development and manufacturing of thick-film/hybrid circuits
- 06
Functional test and ICT (100% inspection)
- 07
Delivery from warehousing
Location
Rodgau
DEBusiness office; manufacturing of thick-film and hybrid circuits at supplier
- Lot size
- Lot size 1 to volume production
- Materials
- Sputter materials, ceramics, Al2O3/AlN/stainless steel substrates
- Screen printing systems (Class 10,000 cleanroom)
- Fully automatic assembly lines (SMT placer, Class 100,000 cleanroom)
- Bonding equipment (Au and Al wire bonding)
- Laser trimmers
- Fully automatic inline potting system
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Supply/manufacture of sputter targets (PVD coating material)Surface | – | – | – | Lot size 1 – Volume production | – |
| Supply of coating material for electron beam evaporation (CVD/PVD)Surface | – | – | – | Lot size 1 – Volume production | – |
| Special materials ON DEMAND (sputter targets, alloys, ceramics)Surface | – | – | – | Lot size 1 | – |
| Manufacture/supply of advanced ceramics (high-performance ceramics)Plastics | – | 250 mm × 250 mm | – | – | AlN, Si3N4, WC, SiC, TiB2, AlMgB14 |
| Self-lubricating composite materials (Self Lubricating Composites) based on Cu-SnPlastics | – | – | – | – | Cu-Sn composite material |
| Thick-film/hybrid circuits: screen printing (thick-film technology)Engineering | – | 152.4 mm × 101.6 mm | – | Prototype – Volume production | Al2O3, AlN, Stainless steel, Ag, AgPd, Pt, Au, PtPd |
| Wire bonding (Au and Al wire bonding)Assembly | – | – | – | – | Au, Al |
| SMT assembly (Surface Mount Technology)Assembly | – | – | – | – | FR4, Ceramic (Al2O3, AlN), IMS |
| Chip on Board technology (COB) with pottingAssembly | – | – | – | – | Au, Al, Epoxy |
| Laser resistor trimmingTesting | – | – | – | – | – |
| Functional test and ICT (In-Circuit Test)Testing | – | – | – | – | – |
| Encapsulation potting (fully automatic inline potting system)Assembly | – | – | – | – | Potting material (epoxy) |
| Technology development / development consulting for hybrid circuitsEngineering | – | – | – | – | – |
| Bonding of targets onto copper backplates (round, planar and tube targets)Joining | – | – | – | – | Cu, Sputter materials |
5 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Bonding equipment (various bonding processes) | – | – | – | – | Rodgau (manufacturing at supplier) |
| Fully automatic assembly lines (SMT placers) | – | – | Class 100,000 cleanroom | – | – |
| Laser trimmers | – | 1 | Class 100,000 cleanroom | – | – |
| Fully automatic inline potting system | – | – | – | – | – |
| Screen printing systems (Class 10,000 cleanroom) | – | – | Substrates 4" x 6" (101.6 mm x 152.4 mm) | – | – |
Additional services
Quality
The thick-film and hybrid circuits are certified to ISO 9001 and ISO/TS 16949; the quality manual is based on the Mil-STD-883 standard. All PCB assemblies and hybrid modules are 100% tested by functional test and ICT in a Class 100,000 cleanroom, supplemented by lot traceability and FMEA.
| Evidence | Rodgau |
|---|---|
| ISO 9001 | |
| ISO/TS 16949 | |
| Quality manual Mil-STD-883 | |
| 100% functional test/ICT | |
| Lot traceability & FMEA |
History
- 2020
Launch of the website hubertheusner.de (first publication July 2020)