Microelectronics assembly and micro-assembly of electronic components from prototypes to large-scale production.
Hybrid SA
CH-2025 Chez-le-BartNew on Amplifa
About Hybrid SA
Hybrid SA is a microelectronics-specialized contract manufacturer (µ-EMS) based in Chez-le-Bart, Switzerland. For over 30 years, the company has focused on the assembly and micro-assembly of electronic components and offers processes such as SMT, Die Bonding, Wire Bonding, Glob Top, Screen Printing, Gold Bumping, Flip-Chip as well as Product Finishing and electronic testing. Its manufacturing covers the entire lot size spectrum – from prototypes to large-scale production with more than 100,000 units per year. Customer industries include the watch industry, sensor manufacturers, general industry, medical technology and pharma, aerospace, security, and academic research. The company is certified to ISO 9001:2015 and ISO 13485:2016.
- Site
- CH-2025 Chez-le-Bart
- Processes
- SMT (Surface Mount Technology), Die Bonding, Wire Bonding, Glob Top, Screen Printing, Product Finishing, Gold Bumping, Flip-Chip
- Materials
- Gold, Surface Mount Technology, Die Bonding, Wire Bonding, Glob Top, Screen Printing, Gold Bumping, Flip-Chip
- Certificates
- ISO 9001:2015, ISO 13485:2016, Electronic testing
- Founded
- 1989
- Industries
- Watch industry, Sensor technology, Industry, Medical technology/Pharma, Aerospace, Security
- 01
Screen Printing
- 02
SMT / Die Bonding
- 03
Wire Bonding
- 04
Flip-Chip / Gold Bumping
- 05
Glob Top
- 06
Product Finishing
- 07
Test
- 08
Shipping
Processes & Materials
Gold
Bonding material for Wire Bonding and Gold Bumping.
Surface Mount Technology
Automated placement of electronic components from prototypes to large-scale production.
Die Bonding
Attachment of chip dies onto substrates as a core element of hybrid assembly.
Wire Bonding
Electrical connection of dies and substrates using bonding wires.
Glob Top
Encapsulation of chips and bond connections to protect against environmental influences.
Screen Printing
Screen printing processes for microelectronics manufacturing.
Gold Bumping
Application of gold bumps as contact formation for flip-chip assembly.
Flip-Chip
Direct chip mounting via bump contacts for compact high-density modules.
Product Finishing
Finishing and surface treatment of the completed modules.
Test
Electronic functional testing of the assembled assemblies.
Sites
Chez-le-Bart
CHHeadquarters / Production
- Lot size
- Prototypes to large-scale production >100,000 units/year
- Materials
- Electronic components, gold (bonding)
- SMT
- Die Bonding
- Wire Bonding
- Glob Top
- Screen Printing
- Gold Bumping
- Flip-Chip
- Test
Components & Modules
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMT (Surface Mount Technology)Assembly | – | – | large-scale production exceeding | – | – |
| Die BondingAssembly | – | – | – | – | – |
| Wire BondingAssembly | – | – | – | – | Gold |
| Glob TopAssembly | – | – | – | – | – |
| Screen PrintingAssembly | – | – | – | – | – |
| Product FinishingSurface | – | – | – | – | – |
| Gold BumpingAssembly | – | – | – | – | Gold |
| Flip-ChipAssembly | – | – | – | – | – |
| Test (electronic testing)Testing | – | – | – | – | – |
Additional services
Quality & Certifications
Hybrid SA is certified to ISO 9001:2015 and ISO 13485:2016 and performs electronic testing of the assembled assemblies in its own test area.
| Evidence | Chez-le-Bart |
|---|---|
| ISO 9001:2015 | |
| ISO 13485:2016 | |
| Electronic testing |
History
- 1989
Founding of Hybrid SA.
- 2024
Feature on BFM Business (July 15, 2024).