Development and manufacturing of application-specific mixed-signal ICs, sensor ICs and custom modules for sensor technology and automation.
iC-Haus GmbH
Bodenheim · Málaga · ShenzhenNew on Amplifa
About iC-Haus
iC-Haus GmbH develops and produces application-specific integrated circuits (ASIC/ASSP) as well as mixed-signal ICs and systems-on-chip (SoC) for sensor, motion and lighting applications. Focus areas include magnetic and optical encoder ICs for position sensing, driver circuits for semiconductor lasers and LEDs, and components for industrial sensor communication. With BiSS, the company has created a globally established open-source interface for real-time communication between sensors, actuators and controllers. The technology portfolio includes mixed-signal CMOS, power BCD, high-voltage and bipolar processes; with optional photosensitive or Hall structures, monolithic microsystems with integrated sensors are created. In addition to standard plastic packages, iC-Haus manufactures and tests customer-specific modules based on PCB and flex PCB in its own back-end packaging line with a cleanroom. The products find application in industrial automation, robotics, motor technology, automotive and medical technology. The headquarters with production, development and sales is located in Bodenheim near Mainz; a design center in Málaga and representative offices, among others in Shenzhen, complement the presence.
- Site
- Bodenheim
- Processes
- Development and manufacturing of application-specific integrated circuits (ASIC/ASSP),, Mixed-signal CMOS process, Power BCD process, High-voltage and bipolar processes, Monolithic microsystems with integrated photosensitive or Hall sensor structures, Back-end packaging (plastic packages, custom modules on PCB/flex PCB) in own cleanroom, Automated device handling and testing (100% inspection over a wide temperature range), Product qualification via stress tests and continuous lot screening
- Materials
- Silicon (integrated circuits), PCB, Flex-PCB, Plastic (standard packages), Silicon (wafers), Plastic (packages)
- Certificates
- ISO 9001 (DIN ISO 9001), ISO 9001
- Founded
- 1984
- Employees
- 350
- Industries
- Industrial automation, Robotics, Motor technology, Automotive, Medical technology, Position sensing/encoders
- 01
IC design (ASIC/ASSP, mixed-signal, SoC)
- 02
Wafer manufacturing in semiconductor processes
- 03
Back-end packaging in own cleanroom
- 04
Module manufacturing on PCB/flex PCB
- 05
Automated testing across the temperature range
- 06
Sales and technical support
Materials & Processes
Silicon (wafers)
Base material of the integrated circuits in CMOS, BCD and bipolar processes.
PCB
Substrate material for customer-specific modules in the in-house production line.
Flex-PCB
Flexible printed circuit boards for custom modules with integrated iCs.
Plastic (packages)
Material for standard packages in back-end packaging.
Sites
Bodenheim
DEHeadquarters with production (including cleanroom), development and sales
- Lot size
- Volume production
- Materials
- Silicon, PCB, Flex-PCB, Plastic
- Cleanroom (back-end packaging)
- Production and logistics facility (55,000 sq ft, 2012)
Málaga
ESDesign center (iC-Málaga S.L.)
Shenzhen
CNRepresentative office iC-Haus China
Components
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Development and manufacturing of application-specific integrated circuits (ASIC/ASSP),Engineering | – | – | – | – | Silicon (wafers) |
| Mixed-signal CMOS processEngineering | – | – | – | – | – |
| Power BCD processEngineering | – | – | – | – | – |
| High-voltage and bipolar processesEngineering | – | – | – | – | – |
| Monolithic microsystems with integrated photosensitive or Hall sensor structuresEngineering | – | – | – | – | – |
| Back-end packaging (plastic packages, custom modules on PCB/flex PCB) in own cleanroomAssembly | – | – | – | – | PCB, Flex-PCB, Plastic (packages) |
| Automated device handling and testing (100% inspection over a wide temperature range)Testing | – | – | – | – | – |
| Product qualification via stress tests and continuous lot screeningTesting | – | – | – | – | – |
2 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Cleanroom (back-end packaging) | – | 1 | – | – | Bodenheim |
| Production and logistics facility | – | 1 | – | 2012 | Bodenheim |
Additional services
Quality
iC-Haus pursues a zero-defect strategy (Zero Defect Quality, Zero Defects in Product Lifetime, Zero Redesigns) based on a quality management system according to DIN ISO 9001. All products undergo automated handling, functional testing over wide temperature ranges, qualification via stress tests, and continuous lot screening.
| Evidence | Bodenheim |
|---|---|
| ISO 9001 |
History
- 1984
Founded by Dr. Heiner Flocke and Manfred Herz in Bodenheim
- 1985
First iC in production
- 1990
First basic patent on opto-iCs filed
- 1992
Volume production of automotive iCs begins
- 1993
Move into the first own building
- 1994
Sale of ASSPs begins, international partners appointed
- 1998
Winner of the RLP Innovation Award for airbag iCs
- 2002
Introduction of the open-source sensor interface BiSS; opening of the design center iC-Málaga in Spain
- 2006
Extension for 250 employees inaugurated
- 2009
25th company anniversary
- 2012
AMA Innovation Award for Energy Harvesting Multiturn Encoder; Entrepreneur of the Year; opening of the 55,000 sq ft production and logistics facility in Bodenheim
- 2017
RLP Innovation Award for EncoderBlue®; founding of BiSS Association e.V.
- 2019
Expansion of the Bodenheim production facility
- 2021
Opening of the representative office iC-Haus China in Shenzhen; revenue exceeds 100 Mio. € for the first time
- 2022
350 employees, five building sections in Bodenheim with 18.800 m²
- 2023
Company of the Year in the Mainz/Bingen district
- 2024
40 years of innovation and continuity