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iCuTech – Fertigung

Development and manufacture of power electronics modules with patented solder-free laser welding technology.

iCuTech Logo

iCuTech GmbH

Lauf an der Pegnitz (headquarters with production) · Nuremberg (technology area)New on Amplifa

2022Founded
12+International patents (granted and applied for)
ISO 9001Certified quality management

About iCuTech

iCuTech GmbH develops and produces power electronics modules based on SiC and GaN technology. The core of the technology platform is a patented laser welding technology (LWT) that replaces conventional soldering processes with solder-free Cu/Cu connections featuring low thermal stress. Using the Discrete-to-Module approach (D2M), iCuTech integrates qualified standard SMD power semiconductors into module architectures; via the Customized Power Layout (CPL), an additional PCB layer is integrated directly into the power module. The company supports customers from the concept phase through pilot production to industrialization. Applications lie in industrial power electronics, renewable energies, the automotive sector, transport and integrated motor solutions. Founded in 2022 and headquartered in Lauf an der Pegnitz (Nuremberg Metropolitan Region), the company is ISO 9001 certified and holds more than twelve international patents.

Site
Lauf a.d. Pegnitz
Processes
Laser welding (Laser Welding Technology, solder-free Cu/Cu connection), Discrete to Module (D2M) – integration of standard SMD power semiconductors into, Customized Power Layout (CPL) – integration of an additional PCB layer into the power module, Development of power modules based on SiC and GaN technology (concept phase to, Development of power modules (SiC/GaN), Customized Power Layout, Discrete to Module Integration, Laser Welding Technology
Materials
Copper (Cu/Cu connection), SiC (silicon carbide), GaN (gallium nitride), Laser Welding Technology, Discrete to Module, Customized Power Layout, Copper, Silicon Carbide
Certificates
ISO 9001
Founded
2022
Industries
Industry, Renewable Energies, Automotive, Transport, Integrated Motor Solutions
  1. 01

    Engineering of power modules (concept phase to design)

  2. 02

    Customized Power Layout (CPL)

  3. 03

    Integration of qualified standard SMD components (D2M)

  4. 04

    Laser welding (solder-free Cu/Cu connection, LWT)

  5. 05

    Pilot production

  6. 06

    Industrialization and production

Technologies & Materials

LWT

Laser Welding Technology

Patented laser welding process for solder-free Cu/Cu connections with low thermal stress and high precision.

D2M

Discrete to Module

Integration of tested and qualified standard SMD power semiconductors into module architectures with high yield.

CPL

Customized Power Layout

Integration of an additional PCB layer into the power module for optimized electrical performance.

Cu

Copper

Material of the solder-free contacting and connection structures.

SiC

Silicon Carbide

Chip technology for 1200-V power modules with high efficiency.

GaN

Gallium Nitride

Semiconductor technology for high power-density module concepts.

Sites

Lauf an der Pegnitz

DE

Headquarters with production

Materials
Copper, SiC, GaN

Nuremberg

DE

Technology area / founding site

Power Modules

Power module iCu600MB12I2 (FHB housing, 1200 V)
Power module iCu600MB12I2 (FHB housing, 1200 V)LWT / D2M · Power electronics

Inside the production

Power electronics – application area of iCuTech modules
Power electronics – application area of iCuTech modules
Modern electronics manufacturing in the power modules area
Modern electronics manufacturing in the power modules area
Technology development for power electronics
Technology development for power electronics

Industries

IndustryRenewable EnergiesAutomotiveTransportIntegrated Motor Solutions

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
Laser welding (Laser Welding Technology, solder-free Cu/Cu connection)Joining––––Copper
Discrete to Module (D2M) – integration of standard SMD power semiconductors intoAssembly––––SiC, GaN, Copper
Customized Power Layout (CPL) – integration of an additional PCB layer into the power moduleEngineering–––––
Development of power modules based on SiC and GaN technology (concept phase toEngineering––––SiC, GaN

Additional services

Development of power modules (SiC/GaN)Customized Power LayoutDiscrete to Module IntegrationLaser Welding TechnologySupport from concept phase to industrializationPilot productionProduction of power electronics modules

Quality & Compliance

iCuTech operates an ISO 9001-certified quality management system with structured development and production processes as well as continuous monitoring and improvement. Components and processes are qualified, with a focus on robust connection technologies for safety-critical applications.

EvidenceLauf an der Pegnitz
ISO 9001

Company History

  1. 2022

    Founding of iCuTech Anlagenbau GmbH (February); opening of the technology area on the AEG site in Nuremberg (May)

  2. 2023

    ISO 9001 certification and patenting of the laser welding technology in Nuremberg

  3. 2024

    Establishment of a pilot production

  4. 2026

    Relocation to Lauf an der Pegnitz with new production capacities (January); renaming to iCuTech GmbH (May)

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