EMS provider for high-quality electronics manufacturing: SMD/THT assembly, assemblies and complete devices from Braunschweig.
Ihlemann GmbH
BraunschweigNew on Amplifa
About Ihlemann GmbH
Ihlemann GmbH is an EMS provider (Electronic Manufacturing Services) based in Braunschweig that manufactures complex electronic assemblies and devices for medium-sized companies with high demands on quality, delivery reliability and process reliability. Its range of services covers the entire value chain: electronics development (hardware and FPGA design, embedded, high-current, IoT), Design for Manufacturing/Testability/Cost, prototype construction in EMS series quality, SMD and THT assembly, selective soldering, BGA placement including Package-on-Package, in-house conformal coating, device assembly as well as test and support services. Materials processed include FR4 printed circuit boards from 0.5 mm to 4.5 mm thickness, flexible polyimide films from 0.1 to 0.25 mm and HDI PCBs with package sizes from 01005 and micro-BGA with pitches of 0.4 to 0.6 mm. SMD assembly achieves up to 96,000 components per hour with a placement precision of 38 µm. Since 2008, production has been converted to one-piece flow using lean/value stream design, which reduced lead times in some areas by up to 90%. Customer industries include industrial and automation technology, image processing/embedded systems, environmental and building technology as well as medical technology, complemented by automotive elements such as PPAP/PPF.
- Site
- Braunschweig
- Processes
- SMD assembly, THT assembly (Through Hole Technology), PCB assembly (high-end), BGA placement, Package-on-Package technology (PoP), Pin-in-Paste process / Through-hole reflow (THR), Selective soldering (automated), Wave soldering
- Materials
- FR4 printed circuit boards (thin from 0.5 mm, thick 3.2 mm and 4.5 mm), Polyimide films (flexible PCBs, 0.1–0.25 mm), HDI PCB (High Density Interconnect), Solder paste / solder, FR4 printed circuit boards, Polyimide films (flexible PCBs), Solder paste and solder
- Certificates
- DIN EN ISO 13485, DIN EN ISO 9001, DIN EN ISO 14001, DIN ISO 45001, ISO 9001, ISO 13485, ISO 14001, ISO 45001
- Industries
- Industrial and automation technology, Image processing / embedded systems, Environmental and building technology, Medical technology, Automotive (PPAP/PPF), Automotive (elements from IATF 16949 such as PPAP/PPF)
- 01
Electronics development (hardware, FPGA, embedded, IoT)
- 02
Design for Manufacturing / Testability / Cost (DfX)
- 03
Prototype construction and pilot series
- 04
SMD assembly including paste printing and reflow
- 05
THT assembly, selective soldering, wave soldering
- 06
In-house conformal coating
- 07
Testing (3D-SPI, 3D-AOI, ICT, flying probe, X-ray, functional test)
- 08
Device assembly and complete device manufacturing
- 09
Logistics, traceability and after-sales service
Materials and Processes
FR4 printed circuit boards
Thin versions from 0.5 mm to thick boards of 3.2 mm and 4.5 mm for high-current applications.
Polyimide films (flexible PCBs)
Flexible circuit carriers from 0.1 to 0.25 mm for tight housing contours.
HDI PCB (High Density Interconnect)
Multilayer boards with high packing density for BGA and PoP placement.
Solder paste and solder
For reflow, wave, selective and robotic soldering processes.
Sites
Braunschweig
DEManufacturing site (SMD/THT production, assembly, testing)
- Lot size
- Small series to large series (high/low volume)
- Materials
- FR4, polyimide films, HDI PCB
- SMD placement machines (96,000 components/h, 300+ setup positions, 38 µm precision)
- Screen printers (paste printing)
- Reflow ovens
- Wave soldering system
- Selective soldering system (nitrogen, ultrasonic nozzle)
- Soldering robots
- Coating machine (conformal coating)
- 3D-AOI inline paste inspection
- 3D-AOI (8/12 cameras)
- Flying-probe tester
- X-ray inspection system
- In-circuit tester
- BGA rework station (camera-supported)
- 3D printer
- Labeling machine
Components
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMD assemblyAssembly | – | – | – | small to large quantities | FR4, polyimide, printed circuit boards |
| THT assembly (Through Hole Technology)Assembly | – | – | – | – | printed circuit boards |
| PCB assembly (high-end)Assembly | Processing of smallest package sizes 0201 and 01005 | – | – | – | FR4, polyimide films (flexible PCBs), thin FR4 PCBs from 0.5 mm, printed circuit boards up to 3.2 mm and 4.5 mm thickness, HDI PCB |
| BGA placementAssembly | Micro-BGA pitch 0.4 to 0.6 mm | 60 mm (assembly example 60 x 16 mm) | – | – | multilayer boards, HDI PCB |
| Package-on-Package technology (PoP)Assembly | – | – | – | – | BGA packages |
| Pin-in-Paste process / Through-hole reflow (THR)Assembly | – | – | – | – | wired THT components, printed circuit boards |
| Selective soldering (automated)Joining | Channel spacing between components down to 2 mm | – | – | – | THT components, printed circuit boards with thick copper layers |
| Wave solderingJoining | – | – | – | – | printed circuit boards |
| Reflow solderingJoining | – | – | – | – | SMD components, printed circuit boards |
| Hand solderingJoining | – | – | – | – | THT components |
| Soldering with soldering robotsJoining | – | – | – | – | THT components |
| BGA desoldering / BGA rework (camera-supported)Joining | – | – | – | – | BGA components, printed circuit boards |
| Conformal coating (selective, in-house)Surface | Coating application accuracy 1 mm; clearances < 3 mm | – | – | – | assembled printed circuit boards, coating layers |
| 3D printing (fixture construction, component trays/auxiliary tools)Additive | – | – | – | – | plastic (trays, feeders) |
| Prototype construction for printed circuit boards in EMS series qualityAssembly | – | – | – | – | printed circuit boards |
| Electronics development (hardware design, FPGA design, embedded, high-current, IoT, PCB layout)Engineering | – | – | – | – | – |
| Design for Manufacturing / Design for Testability / Design for Cost (design evaluation, DfX)Engineering | – | – | – | – | – |
| Device assembly / complete device assembly / device and system assemblyAssembly | – | – | – | – | – |
| Flying-probe test (FPT)Testing | testable at component spacings below 0.1 mm | – | – | – | assemblies |
| 3D-AOI inline paste inspection (3D-SPI)Testing | – | – | – | – | printed circuit boards with solder paste |
| 3D-AOI test (8 or 12 cameras)Testing | – | – | – | – | BGA, QFN, connectors, assemblies |
| X-ray inspection / X-ray checksTesting | – | – | – | – | circuit boards, BGA solder joints |
| In-circuit test (ICT) with test adapter developmentTesting | – | – | – | – | assembled printed circuit boards |
| RF testTesting | – | – | – | – | – |
| Functional and special tests (customer-specific)Testing | – | – | – | – | – |
| Burn-in/run-in as well as temperature and climate testingTesting | – | – | – | – | – |
| Optical SMD sensor placement on flexible circuit carriersAssembly | < 1.0 degrees in rotation and tilt | – | – | – | flexible circuit carriers |
14 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMD placement machine | – | – | 96,000 components per hour; 300+ setup positions; precision 38 µm; components 01005 to BGA | – | Braunschweig |
| Wave soldering system | – | – | – | – | Braunschweig |
| Selective soldering system | – | – | Nitrogen gas flow, ultrasonic nozzle for flux | – | Braunschweig |
| 3D-AOI inline paste inspection (behind screen printers) | – | – | – | – | Braunschweig |
| 3D-AOI placement inspection (8/12 cameras) | – | – | – | – | Braunschweig |
| Flying-probe tester | – | – | Assemblies with component spacings below 0.1 mm testable | – | Braunschweig |
| X-ray inspection system (X-ray) | – | – | – | – | Braunschweig |
| BGA rework station (camera-supported) | – | – | – | – | Braunschweig |
| Coating machine (conformal coating) | – | – | – | – | Braunschweig |
| 3D printer | – | – | Production of component trays/feeders | – | Braunschweig |
| Soldering robot | – | – | – | – | Braunschweig |
| Screen printer (paste printing) | – | – | – | – | Braunschweig |
| Reflow oven | – | – | – | – | Braunschweig |
| Labeling machine (labeling) | – | – | – | – | Braunschweig |
Additional services
Reference customers
Quality and Certifications
The zero-defect strategy is based on close integration of design and manufacturing (DfX), modern production technology and high test coverage: 100% optical inspection of printed circuit boards via 3D-AOI, 3D paste inspection, X-ray inspection of BGA solder joints as well as flying-probe, ICT, functional and climate tests.
| Evidence | Braunschweig |
|---|---|
| ISO 9001 | |
| ISO 13485 | |
| ISO 14001 | |
| ISO 45001 |
History
- 2008
Restructuring of production using lean/value stream design, conversion to one-piece flow.
- 2009
Comprehensive re-adjustment of the production method according to the flow principle in view of the economic crisis.
- 2014
Bernd Richter as board member of Ihlemann AG mentioned in technical publications on the processing of atypical components.