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III/V-Reclaim – Fertigung

Recycling of compound semiconductor wafers, backside thinning and development of chemomechanical processes

III/V-Reclaim Logo

III/V-Reclaim

New on Amplifa

1991Founded
Active worldwideSales markets

About III/V-Reclaim

Founded in 1991, III/V-Reclaim is a medium-sized company specializing in the recycling of semiconductor wafers. Its service portfolio includes the reclamation (reclaim) of compound semiconductor wafers of the III/V classes, backside thinning of wafers, and the development and optimization of chemomechanical processes. In addition, the company carries out customer-specific process developments. With around 35 years of experience, III/V-Reclaim is active worldwide and supplies customers from the semiconductor industry, in particular from the III/V compound semiconductor sector. The combination of wafer reclaim, thinning and customized process development forms the company's distinctive profile.

Processes
Recycling of compound semiconductor wafers (wafer reclaim), Backside thinning, Development and optimization of chemomechanical processes, Customer-specific process developments, Recycling of semiconductor wafers (wafer reclaim)
Materials
Compound semiconductor (III/V) wafers, Semiconductor wafers
Founded
1991
Industries
Semiconductor industry, Compound semiconductors (III/V semiconductors)
  1. 01

    Acceptance of used compound semiconductor wafers

  2. 02

    Wafer reclaim (restoration of the wafer surface)

  3. 03

    Backside thinning (backside grinding)

  4. 04

    Chemomechanical process development according to customer specification

Materials & Processes

III/V

Compound semiconductor (III/V) wafers

Compound semiconductor wafers that are reconditioned and reused in the reclaim process.

Wafer

Semiconductor wafers

Substrate wafers for backside thinning.

Services & Parts

Reclaimed III/V compound semiconductor wafer
Reclaimed III/V compound semiconductor waferWafer reclaim · Semiconductor industry

Industries

Semiconductor industryCompound semiconductors (III/V semiconductors)

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
Recycling of compound semiconductor wafers (wafer reclaim)Surface––––III/V compound semiconductor wafers
Backside thinningMachining––––Semiconductor wafers
Development and optimization of chemomechanical processesEngineering––––Semiconductor wafers
Customer-specific process developmentsEngineering–––––

Additional services

Recycling of semiconductor wafers (wafer reclaim)Backside thinningDevelopment and optimization of chemomechanical processesCustomer-specific process developments

History

  1. 1991

    Founding of the company; since then growth into a well-known medium-sized company active worldwide.

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