Electronics from Dresden: radio modules, UWB positioning systems and PCB manufacturing from schematic to series production.
In-Circuit Solutions GmbH
Dresden · Development and ManufacturingNew on Amplifa
About In-Circuit Solutions
In-Circuit Solutions GmbH has been developing and manufacturing electronics in Dresden since 2004. The focus is on industrial radio modules and system solutions, in particular for positioning and distance measurement using Ultra-Wideband (UWB). The company offers the entire spectrum from concept, schematic, EMC-compliant and impedance-controlled PCB layout, embedded software and firmware through to enclosure design and its 3D printing using the HP Jet Fusion process. Manufacturing takes place in-house: an SMT assembly line for printed circuit boards and an HP Jet Fusion 3D printing system enable short lead times from prototype to series production. Proprietary product families are the UWB positioning systems ICPROX (collision protection) and ICTRAC (real-time positioning), the radino radio modules, ICnova ARM computing modules as well as ICfly avionics. Customers come from Industry 4.0, intralogistics, vehicle and AGV safety, avionics and general industrial electronics.
- Site
- Dresden
- Processes
- SMT assembly (PCB population), Printed circuit board manufacturing line, Contract manufacturing of electronic assemblies (development, production and testing), PCB layout (EMC-compliant, impedance-controlled), Hardware/software/mechanical co-design, schematic development, firmware, Antenna design and tuning, Industrial 3D printing (HP Jet Fusion, Multi Jet Fusion), Enclosure design including 3D printing of enclosures
- Materials
- PA12 (HP 3D High Reusability PA 12), Printed circuit board material (PCB), HP Jet Fusion (Multi Jet Fusion), Ultra-Wideband (UWB)
- Certificates
- ISO 9001:2015
- Founded
- 2004
- Industries
- Industry 4.0, Intralogistics / Warehousing, Vehicle and AGV Safety, Avionics, Industrial Electronics/OEM
- 01
Concept and hardware/software/mechanical co-design
- 02
Schematic, EMC-compliant and impedance-controlled PCB layout
- 03
Embedded software, firmware and cloud connectivity
- 04
Enclosure design
- 05
SMT assembly and PCB manufacturing
- 06
3D printing of enclosures (HP Jet Fusion, PA12)
- 07
Testing and series production
Processes and Materials
HP Jet Fusion (Multi Jet Fusion)
Industrial 3D printing for robust enclosures and functional components from one-off pieces to small series, without tooling costs.
PA12 (HP 3D High Reusability PA 12)
Polyamide with high isotropy and nearly 100 percent density, suitable for enclosures, complex assemblies and functionally stressed parts.
Printed circuit board material (PCB)
The basis of SMT assembly and impedance-controlled, EMC-compliant PCB manufacturing.
Ultra-Wideband (UWB)
Radio technology for centimeter-accurate positioning and distance measurement in ICPROX, ICTRAC and radino modules.
Locations
Dresden
DEDevelopment and Manufacturing
- Lot size
- One-off pieces to series production (high mix)
- Materials
- PCB, PA12
- HP Jet Fusion 3D printing system (Multi Jet Fusion)
- SMT assembly line for printed circuit boards
Products and Assemblies
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMT assembly (PCB population)Assembly | – | – | – | Series production / high-mix | Printed circuit boards (PCB) |
| Printed circuit board manufacturing lineAssembly | – | – | – | – | Printed circuit boards (PCB) |
| Contract manufacturing of electronic assemblies (development, production and testing)Assembly | – | – | – | – | Electronics |
| PCB layout (EMC-compliant, impedance-controlled)Engineering | – | – | – | – | – |
| Hardware/software/mechanical co-design, schematic development, firmwareEngineering | – | – | – | – | – |
| Antenna design and tuningEngineering | – | – | – | – | – |
| Industrial 3D printing (HP Jet Fusion, Multi Jet Fusion)Additive | – | – | – | One-off pieces – Small series | PA12 |
| Enclosure design including 3D printing of enclosuresEngineering | – | – | – | – | PA12 |
| Protective coating (conformal coating, on request)Surface | – | – | – | – | – |
| Embedded software and cloud connectivityEngineering | – | – | – | – | – |
2 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| HP Jet Fusion 3D printing system (Multi Jet Fusion) | HP | – | – | – | Dresden |
| Printed circuit board manufacturing line (SMT assembly line) | – | – | – | – | Dresden |
Additional services
Quality
The quality management system is certified to ISO 9001:2015 (No. Q-23-25093) and covers the development, production and testing of electronic assemblies and systems. Traceability down to the individual batch and continuous improvement of processes are central components.
| Evidence | Dresden |
|---|---|
| ISO 9001:2015 |
History
- 2004
Founded in Dresden; development and manufacturing at the same location ever since