Semiconductor devices and solutions for power, RF, memory, MCU, sensor and security applications
Infineon Technologies AG
Dresden · Neubiberg (Headquarters)New on Amplifa
About Infineon
Infineon Technologies AG is an internationally active semiconductor manufacturer that develops and produces devices and system solutions for power supply, high frequency, memory, microcontrollers, sensor technology and security. The portfolio includes power semiconductors based on silicon (Si), silicon carbide (SiC) and gallium nitride (GaN), microcontroller families such as AURIX™, PSOC™, TRAVEO™ and XMC™, memory devices (including F-RAM, NOR flash, SRAM), sensors (radar, pressure, MEMS and image sensors), security controllers as well as custom ASIC and SoC/SiP/FPGA solutions. For defense, space and NewSpace, Infineon offers a high-reliability portfolio with radiation-hardened components as well as custom services: sales of high-reliability dies and wafers, up-screening services, silicon-based RF foundry services and a supply longevity program. Manufacturing takes place, among others, in own fabs, including the front-end site in Dresden with cleanroom production. Customer industries are automotive, industrial, defense, space, NewSpace and government ID. Communication is conducted in German, English, Chinese and Japanese.
- Site
- Dresden
- Processes
- RF foundry services, High-reliability up-screening services, High-reliability die and wafer sales, ASIC Solutions / SoC & SiP & FPGA, Semiconductor device manufacturing (Power, RF, Memory, MCU, Sensor, Security ICs), Supply longevity program
- Materials
- Silicon (Si), Silicon carbide (SiC), Gallium nitride (GaN)
- Certificates
- Up-screening services
- Industries
- Automotive, Defense, Space, NewSpace, Industrial, Government ID
- 01
Wafer fabrication (front end, cleanroom)
- 02
Chip development (ASIC/SoC/SiP)
- 03
Up-screening and testing
- 04
Die and wafer sales
- 05
RF foundry services
- 06
Long-term supply (Supply Longevity)
Material systems and processes
Silicon (Si)
Base material for power, RF, memory and logic devices as well as RF foundry services.
Silicon carbide (SiC)
Wide-bandgap semiconductor material for high-performance power and diode/thyristor products.
Gallium nitride (GaN)
Material for GaN power semiconductors, including radiation-hardened variants for space.
Sites
Dresden
DEFront-end fab (cleanroom wafer fabrication)
- Materials
- Si, SiC
- Cleanroom front-end fab
Neubiberg
DECompany headquarters
Devices
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| RF foundry servicesEngineering | – | – | – | – | Silicon |
| High-reliability up-screening servicesTesting | – | – | – | – | – |
| High-reliability die and wafer salesEngineering | – | – | – | – | Silicon |
| ASIC Solutions / SoC & SiP & FPGAEngineering | – | – | – | – | – |
| Semiconductor device manufacturing (Power, RF, Memory, MCU, Sensor, Security ICs)Engineering | – | – | – | – | – |
Additional services
Quality
The high-reliability products undergo defined up-screening services through which standard components are qualified for demanding applications in defense and space.
| Evidence | Dresden |
|---|---|
| Up-screening services |