Insenso develops and manufactures MEMS pressure sensor dies, sensor modules and transmitters for industrial, medical and automotive applications.
Insenso GmbH
Rudower Chaussee 29, 12489 BerlinNew on Amplifa
About Insenso
Insenso GmbH was founded in Berlin in 2020 and brings more than 30 years of sensor experience within its core team. The company researches, develops and produces high-precision MEMS pressure sensor dies, sensor modules and pressure transmitters as well as integrated sensor solutions. MEMS chip manufacturing is based on silicon wafers with a piezoresistive Wheatstone bridge, buried-cavity technology and a glass backplate; the smallest die (IPD53) measures 0.48 x 0.48 mm. The product range includes sensor dies, module systems such as the IPM10 (measuring ranges 40 mbar to 40 bar) and transmitter assemblies. The technologies are used in oil and gas, chemical process engineering, metallurgy, construction materials, industrial automation, IoT, automotive, medical technology and HVAC. In addition to standard products, Insenso develops custom sensing solutions and offers application support; the products are intended for industrial applications worldwide.
- Site
- Berlin
- Processes
- Manufacture of MEMS pressure sensor dies (piezoresistive Wheatstone bridge, buried-cavity, Assembly/sale of pressure sensor modules (e.g. IPM10), Manufacture of pressure transmitters, Development and adaptation of sensing solutions for specific customer/industry requirements, Development and production of MEMS pressure sensor dies, Sensor modules, Pressure transmitters, Application support
- Materials
- Silicon (MEMS chip, piezoresistive Wheatstone bridge), Glass (backplate), Silicon (MEMS chip)
- Founded
- 2020
- Industries
- Oil and gas, Chemical process engineering, Metallurgy, Construction materials, Industrial automation, IoT
- 01
Wafer fabrication (MEMS)
- 02
Die separation and wafer handling
- 03
Packaging (tape & frame / waffle pack)
- 04
Assembly into sensor modules
- 05
Assembly of pressure transmitters
- 06
Development of custom solutions and application support
Materials & Processes
Silicon (MEMS chip)
Piezoresistive Wheatstone bridge in buried-cavity technology as the sensing element of the pressure sensor dies.
Glass (backplate)
Serves as a glass backplate for connecting the piezoresistive silicon bridge.
Site
Berlin
DEDevelopment and MEMS manufacturing
- Part weight / size
- Die 0.48 x 0.48 mm
- Materials
- Silicon, glass
- MEMS production equipment (wafer fabrication)
- Wafer handling
- Tape & frame
- Waffle pack packaging
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Manufacture of MEMS pressure sensor dies (piezoresistive Wheatstone bridge, buried-cavityEngineering | – | 0.48 mm × 0.48 mm | – | – | Silicon, Glass (backplate) |
| Assembly/sale of pressure sensor modules (e.g. IPM10)Assembly | – | – | – | – | Silicon, Glass |
| Manufacture of pressure transmittersAssembly | – | – | – | – | Silicon, Glass |
| Development and adaptation of sensing solutions for specific customer/industry requirementsEngineering | – | – | – | – | Silicon, Glass |
2 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| MEMS production equipment (wafer fabrication) | Insenso | – | – | – | Berlin |
| Wafer handling / tape & frame / waffle pack packaging | – | – | – | – | Berlin |
Additional services
History
- 2020
Founding of Insenso GmbH; core team with over 30 years of experience in sensor technology