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Intectiv – Fertigung

European PCB manufacturer for HDI, HDI/SBU, Rigid-Flex and multilayer boards up to 36 layers.

IN

Intectiv d.o.o.

Kranj, SloveniaNew on Amplifa

more than 50 yearsMarket presence
Kranj, SloveniaSite
up to 36 layersMultilayer PCBs
< 0.15 mmLaser drilling diameter

About Intectiv

Intectiv d.o.o., based in Kranj, Slovenia, is a PCB manufacturer which, according to its own statements, has been active for more than 50 years and is regarded as the largest producer of printed circuit boards in Slovenia. The product range includes HDI and HDI/SBU boards, complex multilayer boards up to 36 layers as well as hybrid and rigid-flex boards. Manufacturing covers the entire process chain: CAM data preparation, multilayer lamination, mechanical and laser CNC drilling (microdrilling below 0.15 mm), X-RAY positioning, electroplating, via filling, photolithographic circuit pattern formation with direct laser exposure, solder mask printing, surface finishing (ENIG, electroless silver, hard Ni/Au, OSP, lead-free HAL), electrical testing as well as CNC milling and scoring. Materials used include laminates from Panasonic, Kingboard, Ventec, Rogers, EMC and Göttle. The company supplies the European market, in particular applications with requirements for miniaturisation and high PCB density.

Site
Kranj
Processes
CAM data processing, Multilayer lamination (pressing of multilayer boards), Mechanical CNC drilling, Laser CNC drilling (laser drilling, diameter below 0.15 mm), X-RAY positioning of multilayer boards, Electroplating (electroless copper DOW, electrolytic copper Atotech TLC, tin Schlötter, pulsed, Filling of blind vias and through-holes (via filling / plugging), Circuit pattern formation photolithography/etching with direct
Materials
Laminates (laminate manufacturers), Panasonic R-1787, Panasonic MC100, Panasonic R-1755M, Panasonic R-1755V, Panasonic R-1566W, Panasonic R-5775K(G), Kingboard KB-6160A
Certificates
ISO 9001, ISO 14001
Industries
Electronics/PCB (HDI, HDI/SBU, Rigid-Flex, multilayer up to 36 layers, hybrid)
  1. 01

    CAM data processing

  2. 02

    Multilayer lamination

  3. 03

    X-RAY positioning

  4. 04

    CNC drilling (mechanical/laser)

  5. 05

    Electroplating & via filling

  6. 06

    Circuit pattern (photolithography/etching)

  7. 07

    AOI

  8. 08

    Silk-screen printing

  9. 09

    Surface finishing

  10. 10

    Electrical test

  11. 11

    CNC milling/scoring

  12. 12

    Laboratory testing

Materials & Processes

R-1787

Panasonic R-1787

Laminate for multilayer and HDI PCBs.

KB-6160A

Kingboard KB-6160A

FR-4 laminate for standard and multilayer applications.

VT-901

Ventec VT-901

Laminate for PCB manufacturing.

RO4003C

Rogers RO4003C

High-frequency laminate for RF PCBs.

RO4350B

Rogers RO4350B

High-frequency laminate for RF PCBs.

EM-825

EMC EM-825

Laminate for high-quality multilayer boards.

Cu

Copper (anodes)

Copper anodes for electroplating processes.

LDI

Laser direct imaging

Direct exposure of the circuit pattern on the board for HDI/SBU.

ViaFill

Via filling

Filling of blind vias and through-holes with double vacuum chamber (THP 35).

ENIG

Surface finishing

Electroless Ni/Au, electroless Ag, hard Ni/Au, OSP, lead-free HAL.

Sites

Kranj

SI

Production/Headquarters

Materials
Laminate (Panasonic, Kingboard, Ventec, Rogers, EMC, Göttle), copper
  • 2 electric lamination presses BIEFFEBI HML
  • 2 oil-hydraulic lamination presses Bürkle
  • CNC drilling/milling machines SCHMOLL
  • Laser drilling machine Combi 500
  • X-RAY positioning system SCHMOLL XRA3 DH160
  • Via filling system THP 35
  • Laser direct imaging system (LDI)
  • AOI system
  • Electrical test system ATG A7a
  • CNC scoring machine SCM 412 with Robi-flex handling
  • Automated electroplating lines Ni/Au, Ag, hard Ni/Au, OSP

Parts

Printed circuit board (PCB)
Printed circuit board (PCB)Multilayer/HDI · Electronics
Printed circuit board (PCB)
Printed circuit board (PCB)Multilayer/HDI · Electronics
Printed circuit board (PCB)
Printed circuit board (PCB)Multilayer/HDI · Electronics

Inside the production

Intectiv production
Intectiv production
Intectiv production
Intectiv production
Scoring machine SCM 412 with YASKAWA robot arm
Scoring machine SCM 412 with YASKAWA robot arm
Laser drilling machine Combi 500
Laser drilling machine Combi 500

Industries

Electronics/PCB (HDI, HDI/SBU, Rigid-Flex, multilayer up to 36 layers, hybrid)

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
CAM data processingEngineering–––––
Multilayer lamination (pressing of multilayer boards)Joining––––Laminates, Copper anodes
Mechanical CNC drillingMachining–––––
Laser CNC drilling (laser drilling, diameter below 0.15 mm)MachiningDiameter below 0.15 mm––––
X-RAY positioning of multilayer boardsTesting–––––
Electroplating (electroless copper DOW, electrolytic copper Atotech TLC, tin Schlötter, pulsedSurface–––––
Filling of blind vias and through-holes (via filling / plugging)Surface–––––
Circuit pattern formation photolithography/etching with directSurface––––Photoresist
AOI (automated optical inspection, traces/isolation from 25µm)Testingfrom 25µm––––
Printing (solder mask, temporary solder mask, assembly printing, carbon paste)Surface––––Solder mask
Surface finishes: electroless Ni/Au, electroless Ag, hard Ni/Au (electroplated), OSP, lead-free HALSurface–––––
Electrical testingTesting–––––
CNC millingMachining–––––
CNC scoring (V-nut)Machining–––––
Laboratory: microsection, solder joint testing, insulation resistance test, thermal tests,Testing–––––
HDI and HDI/SBU PCB manufacturingEngineering–––––
Multilayer PCBs up to 36 layersJoining–––––
Hybrid and rigid-flex PCBsJoining–––––
Blind/buried/stacked/staggered vias, backdrilling with controlled depth, plugging Type 7 accordingJoining–––––

14 Anlagen & Maschinen

MachineManufacturer / modelQuantityWorking areaYear builtSite
Electric lamination press (multilayer press)BIEFFEBI HML2––Kranj, Slovenia
Oil-hydraulic lamination pressBürkle2––Kranj, Slovenia
CNC drilling/milling machineSCHMOLL–––Kranj, Slovenia
Laser CNC drilling machineCombi 5001–2020Kranj, Slovenia
X-RAY positioning system for multilayerSCHMOLL Type XRA3 DH1601–2023Kranj, Slovenia
Via filling system with double vacuum chamberTHP 351––Kranj, Slovenia
Laser direct imaging system (LDI) for circuit pattern––––Kranj, Slovenia
AOI system (automated optical inspection)––––Kranj, Slovenia
Automated electrical test systemATG A7a1––Kranj, Slovenia
CNC milling machine for PCBs (with CCD camera)Schmoll–––Kranj, Slovenia
CNC scoring machine with robot handlingSCM 4121–2019Kranj, Slovenia
Robot arm for loading and unloading (scoring machine)YASKAWA1––Kranj, Slovenia
Automated electroplating line for electroless Ni/Au and electroless Ag––––Kranj, Slovenia
Automated electroplating line for hard Ni/Au, combined manual line for OSP––––Kranj, Slovenia

Additional services

CAM data processingMultilayer pressingMechanical CNC drillingLaser CNC drillingX-RAY positioningElectroplatingFilling of blind vias and through-holesPhotolithography/etchingAOISilk-screen printingSurface finishing (ENIG, Ag, hard Ni/Au, OSP, lead-free HAL)Electrical testingCNC millingCNC scoring/V-scoringLaboratory tests (microsection, solderability, insulation resistance, thermal tests)Cooling water reconditioning

Quality

Quality assurance includes AOI inspection (traces/isolation from 25 µm), automated electrical testing (ATG A7a) as well as a laboratory for microsection, solderability, insulation resistance and thermal tests including layer thickness measurement.

EvidenceKranj
ISO 9001
ISO 14001

History

  1. 1997

    Obtained ISO 9001 certification

  2. 2007

    Obtained ISO 14001 certification

  3. 2019

    New CNC scoring machine with YASKAWA robot arm commissioned

  4. 2020

    New laser drilling machine Combi 500 commissioned

  5. 2022

    New scoring machine SCM 412 with Robi-flex handling

  6. 2023

    New SCHMOLL X-RAY positioning system type XRA3 DH160 commissioned

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