Cooperation for assembly and interconnection technology: equipment, process services and test technology for semiconductor and power electronics manufacturing
ISA – International Semiconductor Alliance
Berlin · Germany (member companies)New on Amplifa
About the ISA
The ISA – International Semiconductor Alliance is a cooperation founded in 2023 by Tresky GmbH, budatec GmbH, Berliner Nanotest und Design GmbH and Bond Pulse GmbH, offering the entire manufacturing chain of assembly and interconnection technology from a single source. The spectrum ranges from bonding, soldering and sintering to inspection and quality analysis. Core services are sinter paste dispensing and SiC MOSFET/IGBT placement, power module assembly, vacuum soldering and the sintering of semiconductor chips. In addition, consulting, evaluations, feasibility studies in joint application laboratories, prototyping and small-series production as well as batch size 1 are offered as contract services. Berliner Nanotest und Design GmbH provides failure analysis and thermal characterization from single measurements through to inline testing. Customers come from the electronics industry from RF to high power, the automotive and aerospace sectors, power electronics, laser manufacturing, medical technology and the solar industry. The systems are used worldwide.
- Site
- Berlin
- Processes
- Sinter paste dispensing and SiC MOSFET/IGBT placement, Power module assembly, Vacuum soldering, Sintering of semiconductor chips, Assembly and connection technology (bonding, soldering, sintering), Failure analysis, Thermal characterization, Reliability testing / aging investigations / inline testing
- Materials
- SiC (Silicon Carbide), IGBT (semiconductor chips), Sinter paste, SiC (silicon carbide), IGBT semiconductor chips
- Certificates
- Certifications
- Founded
- 2023
- Industries
- Semiconductor industry, Power electronics, Automotive, Aerospace, Electronics industry (RF to high power), Laser manufacturing
- 01
Consulting on assembly and interconnection technology
- 02
Feasibility studies in application laboratories
- 03
Sinter paste dispensing and SiC MOSFET/IGBT placement
- 04
Vacuum soldering
- 05
Sintering of semiconductor chips
- 06
Power module assembly
- 07
Inspection and quality analysis
- 08
Failure analysis and thermal characterization
- 09
Project management
Materials & Processes
SiC (silicon carbide)
Semiconductor chips for power modules, processed during sinter paste dispensing and SiC MOSFET/IGBT placement.
IGBT semiconductor chips
Are placed and joined as part of power module assembly and standard packaging technologies.
Sinter paste
Joining material for the sintering of semiconductor chips as an alternative to soldering.
Locations & Equipment
Berlin
DEbudatec GmbH – equipment manufacturer for the semiconductor and solar industry (vacuum soldering systems, sintering
- Materials
- Semiconductor chips, power electronics components
- Vacuum soldering systems
- Sintering systems for semiconductor chips
- Thermal systems from small-series to fully automated production systems
Germany (member companies)
DETresky, Nanotest, Bond Pulse – high-precision placement systems, laboratory/engineering, process development
- Lot size
- Prototype, small series, batch size 1
- Materials
- SiC, silicon
- TRESKY high-precision placement systems (Made in Germany)
- Stand-alone systems for failure analysis and thermal characterization
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Sinter paste dispensing and SiC MOSFET/IGBT placementAssembly | – | – | – | – | SiC, silicon |
| Power module assemblyAssembly | – | – | – | – | – |
| Vacuum solderingJoining | – | – | – | – | – |
| Sintering of semiconductor chipsJoining | – | – | – | – | SiC, silicon |
| Assembly and connection technology (bonding, soldering, sintering)Joining | – | – | – | – | – |
| Failure analysisTesting | – | – | – | – | – |
| Thermal characterizationTesting | – | – | – | – | – |
| Reliability testing / aging investigations / inline testingTesting | – | – | – | – | – |
| Inspection and quality analysisTesting | – | – | – | – | – |
| Consulting / process selection and parametersEngineering | – | – | – | – | – |
| Evaluations (process developments, structure- and process optimizations)Engineering | – | – | – | – | – |
| Feasibility studies in application laboratoriesEngineering | – | – | – | – | – |
| Batch production, prototyping and batch size 1 as contract serviceAssembly | – | – | – | – | – |
| Project management for manufacturing processesEngineering | – | – | – | – | – |
| Development and validation of processes and products (Bond Pulse)Engineering | – | – | – | – | – |
| Standard packaging technologies (die bonding / placement, multi-chip modules)Assembly | – | – | – | – | – |
5 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Placement system / bonder (high-precision die placement) | Tresky GmbH | – | – | – | Germany (Made in Germany) |
| Vacuum soldering system | budatec GmbH | – | – | – | Berlin |
| Sintering system for semiconductor chips | budatec GmbH | – | – | – | Berlin |
| Small batch systems to fully automated production systems (thermal systems) | budatec GmbH | – | – | – | Berlin |
| Stand-alone systems for failure analysis and thermal characterization (single measurements to | Berliner Nanotest und Design GmbH | – | – | – | Berlin |
Additional services
Quality
Berliner Nanotest und Design GmbH offers failure analysis, thermal characterization, reliability investigations and inline testing; the ISA members cover inspection and quality analysis as part of the entire manufacturing chain.
| Evidence | Germany |
|---|---|
| Certifications |
History
- 1980
The name TRESKY has stood for high-precision placement systems since 1980; over 40 years of experience in the semiconductor industry.
- 2023
Foundation of the International Semiconductor Alliance by Tresky GmbH, budatec GmbH, Berliner Nanotest und Design GmbH and Bond Pulse in late summer; first presentation at productronica 2023.
- 2024
Joint ISA stand at PCIM Europe 2024 in Nuremberg.