EMS provider for electronic assemblies and devices – from SMD/THT assembly to the finished device including testing
IVP Group Germany GmbH
Buchenbach (DE) · Shenzhen (CN) · Simi Valley, CA (US)New on Amplifa
About IVP Group Germany
IVP Group Germany GmbH is an EMS provider (Electronic Manufacturing Services) and manufactures small, medium and large series of electronic assemblies and devices. The range of services covers SMD, THT and mixed-components assembly, BGA processing, cable assembly, coating as well as the assembly of complete electronic devices – from the procurement of individual components to delivery of the finished device including housing, packaging and accessories. Production takes place on several high-speed SMD lines with automatic placement machines, high-speed optical inspection (AOI) and subsequent test processes such as ICT, function test and high-voltage test; manufacturing is carried out to IPC Class 2 in RoHS-compliant processing. The company is represented with its own branches and production sites in Europe, Asia and the USA and coordinates all EMS services centrally. Qualified project managers and sales staff accompany projects from development through samples and prototypes to series production. The headquarters with administration is located in Buchenbach near Freiburg.
- Site
- Buchenbach
- Processes
- SMD assembly (SMD-Bestückung), THT assembly (THT-Bestückung), Mixed components assembly, BGA Ball Grid Arrays, Cable assembly, Assembly of electronics devices, Samples and prototypes, Coating (Beschichtung)
- Materials
- SMD assembly, THT assembly, BGA Ball Grid Arrays, IPC Class 2 manufacturing, Cable assembly, Coating, LCD processing, High Speed Optical Inspection
- Certificates
- ISO 9001, ISO 14001, IPC 2
- Industries
- Electronics, Electrical applications
- 01
Component procurement
- 02
Creation of manufacturing documentation and programming of placement machines
- 03
SMD/THT/mixed assembly
- 04
Cable assembly & coating
- 05
AOI, ICT, function test, high-voltage test
- 06
Device assembly incl. housing, packaging and accessories
- 07
Delivery
Manufacturing Processes & Procedures
SMD assembly
Highly automated assembly on several high-speed lines with 136 feeder inputs and a maximum PCB size of 20×25 inches.
THT assembly
Through-hole technology for robust and powerful electronic connections.
BGA Ball Grid Arrays
Processing of BGAs for assemblies with high component density.
IPC Class 2 manufacturing
Manufacturing according to IPC standard Class 2 in RoHS-compliant processing.
Cable assembly
Production of customer-specific cable sets and connections.
Coating
Protective coating of assemblies against moisture and environmental influences.
LCD processing
Installation and processing of LCD displays in device assemblies.
High Speed Optical Inspection
Automatic optical inspection for gap-free process monitoring.
Locations
Buchenbach
DEHeadquarters/Administration
Shenzhen
CNProduction site (IVP Electronics Ltd.)
- Automatic placement machines
- High-speed lines
- AOI
Simi Valley, CA
USBranch (IVP Inc. USA)
Assemblies & Devices
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMD assembly (SMD-Bestückung)Assembly | – | Max PCB size 20x25″ | – | 50 units – 5000 units | PCB |
| THT assembly (THT-Bestückung)Assembly | – | – | – | 50 units – 5000 units | PCB |
| Mixed components assemblyAssembly | – | – | – | 50 units – 5000 units | PCB |
| BGA Ball Grid ArraysAssembly | – | – | – | 50 units – 5000 units | PCB |
| Cable assemblyAssembly | – | – | – | – | – |
| Assembly of electronics devicesAssembly | – | – | – | – | – |
| Samples and prototypesAssembly | – | – | – | – | – |
| Coating (Beschichtung)Surface | – | – | – | – | – |
| AOI (High Speed Optical Inspection)Testing | – | – | – | – | – |
| ICT (In-Circuit Test)Testing | – | – | – | – | – |
| Function testTesting | – | – | – | – | – |
| High tension testTesting | – | – | – | – | – |
| RoHS conform handlingAssembly | – | – | – | – | – |
3 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Automatic placement machines (automatic placement machines, high-speed lines) | – | – | – | – | – |
| High Speed Optical Inspection (AOI) | – | – | – | – | – |
| SMD assembly line with 136 feeder inputs | – | – | – | – | – |
Additional services
Quality & Certification
Production is carried out according to IPC Class 2 in RoHS-compliant processing. Gap-free process monitoring via AOI as well as ICT, function test and high-voltage test; final inspection includes error statistics and analyses with highly precise test units.
| Evidence | Buchenbach | Shenzhen |
|---|---|---|
| ISO 9001 | ||
| ISO 14001 | ||
| IPC 2 |