Sales and service of inspection, analysis and characterization systems for the semiconductor industry.
JP Kummer Semiconductor Technology GmbH
Augsburg · Marlborough · LissesNew on Amplifa
About JP Kummer Semiconductor Technology
JP Kummer Semiconductor Technology is a provider of inspection, analysis and characterization solutions specialized in the semiconductor and microelectronics industry. The company sells systems in Europe for Scanning Acoustic Microscopy (SAM), fault localization and failure analysis, optical probe card inspection, AOX/AOI inspection, AFM-in-SEM characterization, and sample preparation including micro milling and SEM/EDX analysis. In addition, it offers solutions for sintering and wafer lamination, slot-die coating, roll-to-roll processing and ultrasonic testing systems as well as software for factory automation and Industry 4.0. The foundation is long-term partnerships with manufacturers such as AMX, SEMICAPS, SOLARIUS, VISCOM, NenoVision, eInnoSys, infinityPV, The Ultran Group and ULTRA TEC. Customers come from the semiconductor industry, power electronics, photovoltaics/new energy, life science and aerospace. The company maintains three branch offices: the headquarters in Augsburg (Germany) as well as sales offices in Marlborough (United Kingdom) and Lisses (France).
- Site
- Augsburg
- Processes
- Scanning Acoustic Microscopy (SAM, table-top and in-line), Sintering (wafer/power module), Wafer lamination, AFM-in-SEM (LiteScope) – in-situ nanoscale electrical and topographic characterization, AOX/AOI inspection systems, Slot-die coating, Roll-to-roll processing, Ultrasonic analysis (ultrasonic testing systems for web lines, partial production,
- Materials
- SiC (silicon carbide), Semiconductors (wafers/chips), Perovskites, Silicon carbide (SiC)
- Industries
- Semiconductor industry, Power electronics, Photovoltaics / new energy, Life science, Aerospace, Aerospace (radiation test relevance)
- 01
Needs analysis and consulting
- 02
Sales of inspection and analysis equipment
- 03
Application support and sample preparation
- 04
Failure analysis / characterization
- 05
Service and software for factory automation
Materials and Applications
Semiconductors (wafers/chips)
Subject of investigation for SAM, failure analysis, fault localization and characterization.
Silicon carbide (SiC)
Focus of sample preparation, SEM/EDX analysis and radiation test investigations, e.g. on SiC MOSFETs.
Perovskites
Material class in the new energy sector, addressed together with partner infinityPV.
Locations
Augsburg
DEHeadquarters / sales
- Materials
- Semiconductors, SiC
- Table-top SAM and in-line SAM (AMX)
- AFM-in-SEM LiteScope (NenoVision)
- AOX/AOI inspection systems (VISCOM)
- Scanning Optical Microscope SEMICAPS 1300
- Optical probe card inspection systems (SOLARIUS)
- Micro Milling Tool (ULTRA TEC)
- Ultrasonic transducers and analysis systems (The Ultran Group)
Marlborough
GBSales office UK
Lisses
FRSales office France
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Scanning Acoustic Microscopy (SAM, table-top and in-line)Testing | – | – | – | – | – |
| Sintering (wafer/power module)Joining | – | – | – | – | – |
| Wafer laminationJoining | – | – | – | – | – |
| AFM-in-SEM (LiteScope) – in-situ nanoscale electrical and topographic characterizationTesting | – | – | – | – | Semiconductors |
| AOX/AOI inspection systemsTesting | – | – | – | – | – |
| Slot-die coatingSurface | – | – | – | – | – |
| Roll-to-roll processingSurface | – | – | – | – | – |
| Ultrasonic analysis (ultrasonic testing systems for web lines, partial production,Testing | – | – | – | – | – |
| Failure analysis / fault localization (photon emission, thermal emission, OBIRCH, TIVA, LIVA, OBIC,Testing | – | – | – | – | Semiconductors |
| Optical probe card inspection (non-contact surface inspection, measurement and analysis)Testing | – | – | – | – | – |
| Sample preparation with micro milling toolMachining | – | – | – | – | SiC |
| SEM with EDX analysisTesting | – | – | – | – | SiC |
| Radiation testing for device qualification (space, avionics, nuclear)Testing | – | – | – | – | SiC |
| Factory & assembly automation / equipment software / Industry 4.0 / predictive maintenanceEngineering | – | – | – | – | – |
8 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Table-top SAM (Scanning Acoustic Microscope) | AMX | – | – | – | Augsburg (sales) |
| In-line SAM | AMX | – | – | – | Augsburg (sales) |
| AFM-in-SEM | NenoVision LiteScope | – | – | – | Augsburg (sales) |
| AOX/AOI inspection system | VISCOM | – | – | – | Augsburg (sales) |
| Scanning Optical Microscope (dual column upright) | SEMICAPS SEMICAPS 1300 | – | – | – | Augsburg (sales) |
| Optical inspection systems for probe cards | SOLARIUS | – | – | – | Augsburg (sales) |
| Micro Milling Tool (sample preparation) | ULTRA TEC | – | – | – | Augsburg (sales) |
| Ultrasonic transducers and analysis systems | The Ultran Group | – | – | – | Augsburg (sales) |
Additional services
History
- 2023
Partnerships with SEMICAPS (fault localization microscopes) and SOLARIUS (optical probe card inspection); JPK supported an ISTFA technical paper on the failure analysis of SiC MOSFETs with sample preparation via ULTRA TEC.
- 2025
New partnerships with eInnoSys, The Ultran Group (USA), infinityPV, NenoVision and VISCOM for the DACH region.
- 2026
Partnership with AMX for Scanning Acoustic Microscopy; participation in SEMICON Europa in Munich (Hall B1, booth 772).