Develops Copper-MIMO interconnect technology and chiplet solutions for powerful, energy-efficient AI infrastructure.
Kandou Bus S.A.
Saint-Sulpice (CH) · Santa Clara (US) · East Kilbride (UK) · Reading (UK) · Dortmund (DE) · Hyderabad (IN) · Taipei (TW)New on Amplifa
About Kandou AI
Kandou Bus S.A. (Kandou AI) was founded in 2011 at EPFL in Saint-Sulpice (Switzerland) and develops high-speed chip-to-chip connectivity solutions based on its proprietary Copper-MIMO technology (Chord Signaling). The company designs semiconductor products such as chiplet interconnect IP (Glasswing), PCIe retimers and PCIe switches, USB4 retimers, and connectivity solutions for GPU, memory, network, and rack scaling in AI systems. The products are developed as silicon designs and produced in manufacturing partnerships; customers and partners include, among others, Marvell, AMD, and major hyperscalers. To date, more than 27 million silicon units have been shipped. In addition to its headquarters in Saint-Sulpice, Kandou maintains offices in the USA, the United Kingdom, Germany, India, and Taiwan. The company's aim is to make AI infrastructure more accessible through significantly more scalable, more efficient, and more affordable data transmission.
- Site
- Saint-Sulpice
- Processes
- GPU Connectivity, Memory Connectivity, Network Connectivity, Rack Connectivity, Chiplet Interconnect IP
- Materials
- Copper MIMO (Chord Signaling), Chiplet Interconnect IP, Field Repairable Near Package Optics
- Founded
- 2011
- Industries
- AI infrastructure, Semiconductors, Data centers, Hyperscalers
- 01
Chip design and IP development
- 02
Tape-out at manufacturing partners
- 03
PVT testing and validation
- 04
Design wins and volume delivery to customers
Technology & Processes
Copper MIMO (Chord Signaling)
Uses crosstalk-induced disturbances in copper channels as information to increase the reach and efficiency of copper links.
Chiplet Interconnect IP
IP solution for chiplet connectivity, e.g. the Glasswing product.
Field Repairable Near Package Optics
Improves thermal design, reliability, and repair times of optical components.
Locations
Saint-Sulpice
CHHeadquarters
Santa Clara
USBranch office
East Kilbride
UKBranch office
Reading
UKBranch office
Dortmund
DEBranch office
Hyderabad
INBranch office
Taipei
TWBranch office
Products
Inside the production
Industries
Additional services
Reference customers
History
- 2011
Founded at EPFL
- 2015
First tape-out of the Glasswing interconnect chiplet
- 2016
Second generation of Glasswing
- 2017
First design win with a global leader in network infrastructure
- 2018
First deliveries to Marvell with Glasswing
- 2021
Tape-out of an industry-leading USB4 retimer and design win with AMD
- 2022
13 million silicon units shipped
- 2024
Tape-out of a first-of-its-kind PCIe chiplet; 21 million cumulative silicon units; PVT testing with major hyperscaler customers
- 2025
Founding of Kandou AI
- 2026
More than 27 million units shipped cumulatively