ODM/EMS full-service provider for electronics: development, PCBA (SMT/THT), box-build, surface protection and test systems from Grassau.
KATEK GmbH
Grassau (DE) · Győr (HU) · Horní Suchá (CZ)New on Amplifa
About KATEK
KATEK GmbH, headquartered in Grassau (Upper Bavaria), is an ODM/EMS provider of electronic assemblies and devices and part of the ODM/EMS division Electronics² of the Kontron Group. The company offers end-to-end services from hardware, software and mechanics development through layout, prototyping and sourcing to series production of PCB assembly (SMT and THT), box-build assembly, cable integration, press-fit technology and system integration. A key focus is surface protection with coating, nano-coating and void-free potting. Production covers small, medium and large series, with the Grassau, Győr (Hungary) and Horní Suchá (Czech Republic) sites jointly providing SMT capacity of 19 lines. Manufacturing targets industries such as industrial electronics, medical technology, automotive, energy, automation and IoT, including renewable energies and eMobility. Quality assurance follows a zero-defect strategy with in-house test infrastructure including AOI, ICT, boundary scan, X-ray and high-voltage testing, as well as Class-8 cleanroom production in Grassau.
- Site
- Grassau
- Processes
- SMT Assembly (Surface Mount Technology), THT Assembly (Through-Hole Technology), Reflow Soldering, Wave Soldering, Selective Soldering, Solder Paste Printing with Stainless Steel Stencil, Solder Paste Inspection (SPI), Automated Optical Inspection (AOI)
- Materials
- Printed circuit boards (PCB), Solder, Solder paste, Stainless steel (stencils), Plastics, Metal, Printed Circuit Boards, SMT Assembly
- Certificates
- ISO 9001, Medical Technology Standards, Automotive Standards
- Founded
- 1986
- Employees
- ~3.700 (KATEK Group
- Industries
- Industrial Electronics, Medical Technology, Automotive, Energy, Automation, IoT
- 01
Design & Development (Hardware, Software, Mechanics)
- 02
Prototyping & Sourcing
- 03
PCBA (SMT/THT, Reflow, Wave and Selective Soldering)
- 04
Surface Protection (Coating, Nano-Coating, Potting)
- 05
Cable Integration & Press-Fit
- 06
Box-Build / System Integration & Final Assembly
- 07
Testing & Quality Assurance
Materials & Processes
Printed Circuit Boards
Base material for SMT and THT assembly of electronic modules.
SMT Assembly
Highly automated surface-mount assembly with reflow soldering, solder paste printing through stainless steel stencils and SPI inspection.
THT Assembly
Through-hole technology with wave and selective soldering for mixed-technology assemblies.
Coating
Brush, spray, dip and thick-film coating for protection of assemblies.
Nano-Coating
Hydrophobic nano-layer as surface protection for electronic assemblies.
Potting
Void-free potting as protection against moisture and mechanical stress.
Plastics Processing
Processing of plastics for housing and system components.
Stainless Steel (Stencils)
Material for solder paste stencils in the SMT process.
Cable Assembly
Cable assembly with cables and connectors for system integration.
Press-Fit Technology
Solderless joining of press-fit contacts into printed circuit boards.
Sites
Grassau
DEHeadquarters; hardware, software and mechanics development, layout, highly automated series production
- Lot size
- Prototype to large series
- Materials
- Printed circuit boards, SMT/THT, coating, nano-coating, potting
- Multiple SMT assembly lines
- Class-8 cleanroom
- AOI
- ICT
- Boundary scan test
- High-voltage test
- Surface protection systems
Győr
HUHigh-volume manufacturing with system integration and final assembly
- Lot size
- Medium series to annual volumes into the six figures
- Materials
- Printed circuit boards, SMT/THT, cable assembly, press-fit
- 12 SMT assembly lines
- Wave soldering system
- Selective soldering system
- Cable assembly
- Press-fit
- Inline inspection
Horní Suchá
CZAgile manufacturing with ODM expertise for small series and scalable production
- Lot size
- Small series to scalable series
- Materials
- Printed circuit boards, SMT/THT, coating, cable integration
- 7 SMT assembly lines
- Prototype SMT line
- Class-2 cleanroom
- X-ray inspection system
- Box-build assembly
- Coating
Assemblies
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMT Assembly (Surface Mount Technology)Assembly | – | – | – | – | Printed circuit boards, Electronic components |
| THT Assembly (Through-Hole Technology)Assembly | – | – | – | – | Printed circuit boards, Through-hole components |
| Reflow SolderingJoining | – | – | – | – | Solder paste, SMT components |
| Wave SolderingJoining | – | – | – | – | Solder, THT components |
| Selective SolderingJoining | – | – | – | – | Solder, THT components, mixed-technology assemblies |
| Solder Paste Printing with Stainless Steel StencilAssembly | – | – | – | – | Solder paste, Stainless steel |
| Solder Paste Inspection (SPI)Testing | – | – | – | – | – |
| Automated Optical Inspection (AOI)Testing | – | – | – | – | – |
| In-Circuit Test (ICT)Testing | – | – | – | – | – |
| Boundary Scan TestTesting | – | – | – | – | – |
| High-Voltage TestTesting | – | – | – | – | – |
| X-Ray InspectionTesting | – | – | – | – | – |
| Functional TestTesting | – | – | – | – | Electronic assemblies |
| EMC Testing (Electromagnetic Compatibility)Testing | – | – | – | – | – |
| ESD Testing per IEC 61000-4-2Testing | – | – | – | – | – |
| Brush CoatingSurface | – | – | – | Small series | Coating material |
| Fully Automatic Spray CoatingSurface | – | – | – | – | Coating material |
| Dip CoatingSurface | – | – | – | – | Coating material |
| Thick-Film CoatingSurface | – | – | – | – | Coating material |
| Nano-Coating (Hydrophobic)Surface | – | – | – | – | Nano-coating material |
| Potting (Void-Free)Surface | – | – | – | – | Potting compound |
| Prototype Manufacturing (Rapid Prototyping)Assembly | – | – | – | – | Electronic assemblies |
| Small Series ManufacturingAssembly | – | – | – | 0 – 500 assemblies | Electronic assemblies |
| Medium Series ManufacturingAssembly | – | – | – | 500 – 100,000 assemblies | Electronic assemblies |
| Large Series ProductionAssembly | – | – | – | 100,000 assemblies | Electronic assemblies |
| Cable Assembly / Cable HarnessingAssembly | – | – | – | – | Cables, Connectors |
| Press-Fit TechnologyJoining | – | – | – | – | Printed circuit boards, Press-fit contacts |
| Box-Build / System Integration / Final AssemblyAssembly | – | – | – | – | Electronic devices and systems |
| Electronics Development (Hardware, Software, Mechanics)Engineering | – | – | – | – | – |
| 2D/3D Design / Mechanical EngineeringEngineering | – | – | – | – | – |
| Plastics ProcessingPlastics | – | – | – | – | Plastics |
| Metal ProcessingForming | – | – | – | – | Metal |
8 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMT assembly lines | – | – | – | – | Grassau, Germany |
| SMT assembly lines | – | 7 | – | – | Horní Suchá, Czech Republic |
| SMT assembly lines | – | 12 | – | – | Győr, Hungary |
| Prototype SMT line | – | 1 | – | – | Horní Suchá, Czech Republic |
| Reflow oven | – | – | – | – | – |
| Wave soldering system | – | – | – | – | Győr, Hungary |
| Selective soldering system | – | – | – | – | Győr, Hungary |
| X-ray inspection system | – | – | – | – | Horní Suchá, Czech Republic |
Quality
Production quality is ensured through a zero-defect strategy with tailored test concepts. The in-house test infrastructure includes SPI, AOI, ICT, boundary scan, X-ray, high-voltage, functional, EMC and ESD testing in accordance with IEC 61000-4-2.
| Evidence | Grassau | Győr | Horní Suchá |
|---|---|---|---|
| ISO 9001 | |||
| Medical Technology Standards | |||
| Automotive Standards |
History
- 1986
Founding of today's KATEK GmbH by Prof. Dr. Dr. h.c. Anton Kathrein under the umbrella of the Kathrein Group
- 2012
Acquisition of KATEK Hungary Kft.
- 2017
Groundbreaking and relocation to the new logistics center in Grassau
- 2018
Growth to approx. 3.700 employees at 19 sites (KATEK Group)
- 2021
Merger of KATEK Frickenhausen GmbH and KATEK Czech Republic s.r.o.; IPO of KATEK SE in the Prime Standard of the Frankfurt Stock Exchange
- 2024
Kontron acquires majority stake in KATEK SE (59,4% of the shares of main shareholder PRIMEPULS); delisting announced
- 2024–2026
KATEK GmbH, KATEK Hungary Kft. and KATEK Czech Republic s.r.o. form the ODM/EMS division of the Kontron Group; as of 01.01.2026, Kontron Austria GmbH joins the division