
Electronics development, PCB assembly and device manufacturing from idea to series production
kessler systems GmbH
Ostrach · Pfullendorf · Königseggwald · RavensburgNew on Amplifa
About kessler systems
kessler systems GmbH is a medium-sized family business founded in 2010 by Marc P. Kessler, headquartered in Ostrach, and an E²MS technology partner for custom electronics solutions. The company offers complete contract manufacturing of electronic assemblies, devices and systems – from electronics and software development, prototyping (EMSPROTO) and industrialization (DFM/DFT/DFP) to PCB assembly, device/box-build assembly, test concepts and worldwide delivery. The machine park comprises 40 SMD assembly lines, selective and wave soldering systems, and reel preparation, coating and potting capacities; assembly is available from component size 01005, from 1 piece to high volume, and optionally in a cleanroom. PCBs are sourced through certified production partners, from 1-/2-layer to multilayer with 22 layers, HDI as well as flexible and rigid-flex. Quality standards are backed by certifications according to ISO 9001, IATF 16949, ISO 14001, ISO 27001 and ISO 45001. In November 2025, kessler systems acquired Soluware GmbH from Ravensburg (software development); in parallel, the Schulz Group became a strategic partner. Customers come from industries such as IoT, industrial electronics, measurement technology, automotive, medical technology, aerospace and traffic control technology.
- Site
- Ostrach
- Processes
- Electronics development (hardware, PCB, devices, software, apps), PCB manufacturing (1-/2-sided PCBs, multilayer up to 22 layers, microvia/HDI, flexible/rigid-flex,, Electronics prototyping (SMD, THT, mixed assembly), PCB assembly SMD & THT (single-/double-sided), Selective soldering, Wave soldering, Selective coating, Potting
- Materials
- Aluminium, Steel, Plastic, PCB / printed circuit board (multilayer, HDI, metal core, flexible), PCBs (multilayer, HDI, metal core, flexible)
- Certificates
- ISO 9001, IATF 16949, ISO 14001, ISO 27001, ISO 45001, IPC-A-600, IPC-A-610
- Founded
- 2010
- Industries
- IoT, Aerospace, Traffic control technology, Building technology, Measurement technology, Automotive and sensor technology
- 01
Electronics development (hardware, software, apps)
- 02
PCB development and sourcing
- 03
Prototyping
- 04
Industrialization (DFM/DFT/DFP)
- 05
PCB assembly SMD/THT (wave/selective soldering)
- 06
Coating & potting
- 07
Device manufacturing / box-build / HMI assembly
- 08
Testing & test equipment construction
- 09
Logistics, fulfillment & worldwide delivery
- 10
Obsolescence management, repair & refurbishment
Materials & Processes
PCBs (multilayer, HDI, metal core, flexible)
Manufacture of 1-/2-sided PCBs, multilayers up to 22 layers, microvia/HDI as well as flexible and rigid-flex boards via certified production partners.
Aluminium
Used in device and enclosure manufacturing, including laser cutting, bending, die casting and CNC milling.
Steel
Material for enclosures and system components in device manufacturing, including laser cutting and bending.
Plastic
For enclosure parts via injection molding, vacuum forming and 3D printing.
Locations

Ostrach
DEHeadquarters, manufacturing and prototype production (since 2022)
- Lot size
- from 1 piece to high volume
- Materials
- PCBs, aluminium, steel, plastic
- 40 SMD assembly lines
- 2 assembly islands (2023)
- Selective soldering system
- Wave soldering system (2024)
- AOI inspection system Viscom S3088 (2024)
- AI camera system Inspekto S70
- Reeling machine
- 3D printing
Pfullendorf
DEFirst company site (2010)
Königseggwald
DECompany headquarters 2012–2022, production site
Ravensburg
DESite of the acquired Soluware GmbH (software development, since Nov. 2025)
Components & Services




Inside the production



Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Electronics development (hardware, PCB, devices, software, apps)Engineering | – | – | – | – | – |
| PCB manufacturing (1-/2-sided PCBs, multilayer up to 22 layers, microvia/HDI, flexible/rigid-flex,Engineering | – | – | – | High Volume | – |
| Electronics prototyping (SMD, THT, mixed assembly)Assembly | – | – | – | 1 piece | – |
| PCB assembly SMD & THT (single-/double-sided)Assembly | – | – | – | 1 piece – High Volume | – |
| Selective solderingJoining | – | – | – | – | – |
| Wave solderingJoining | – | – | – | – | – |
| Selective coatingSurface | – | – | – | – | – |
| PottingSurface | – | – | – | – | – |
| Reeling (machine-fed from reel)Assembly | – | – | – | – | – |
| Industrialization / DFM/DFT/DFPC/DFP consultingEngineering | – | – | – | – | – |
| Device manufacturing / box-build / system assemblyAssembly | – | – | – | Small series – Large series | Aluminium, Steel, Plastic |
| Touch & display assembly (bonding of membrane keyboards)Assembly | – | – | – | – | – |
| Control cabinet constructionAssembly | – | – | – | – | – |
| Enclosure manufacturing: laser cutting, waterjet cutting, bending, die casting, continuous casting,Forming | – | – | – | – | Aluminium, Steel, Plastic |
| 3D printing (samples, enclosures, small series, jigs, tools)Additive | – | – | – | – | – |
| Cable assemblyJoining | – | – | – | – | – |
| HMI production (display/touch systems, EX protection, IP/IK protection ratings, NFC)Assembly | – | – | – | – | – |
| Test & repair center (refurbishment, repair, software upload, repackaging)Testing | – | – | – | – | – |
| Test procedures: Solder Paste Inspection (SPI), AOI, X-ray, In-Circuit Test, Functional Test, JTAG,Testing | – | – | – | – | – |
| Test equipment construction (custom test adapters)Engineering | – | – | – | – | – |
| Obsolescence management / end-of-life consultingEngineering | – | – | – | – | – |
| Fulfillment center (sourcing, stockpiling, logistics, call-off orders)Engineering | – | – | – | – | – |
7 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMD assembly lines | – | 40 | – | – | Ostrach |
| Assembly islands | – | 2 | – | 2023 | Ostrach |
| Selective soldering system | – | – | – | – | – |
| Wave soldering system | – | – | – | 2024 | – |
| AOI inspection system | Viscom S3088 | 1 | – | 2024 | Ostrach |
| AI camera system for visual inspection | Inspekto S70 | 1 | – | 2023 | – |
| Reeling machine | – | – | – | – | – |
Additional services
Reference customers
Quality & Certifications
Quality assurance comprises optical (SPI, AOI, X-ray), electrical (ICT, FCT, JTAG) and dynamic test procedures (burn-in, climate test, RF test) as well as an AI-supported camera system Inspekto S70 for final inspection; traceability is ensured along the entire value chain according to IPC-A-600 and IPC-A-610.
| Evidence | Ostrach |
|---|---|
| ISO 9001 | |
| IATF 16949 | |
| ISO 14001 | |
| ISO 27001 | |
| ISO 45001 | |
| IPC-A-600 | |
| IPC-A-610 |
History
- 2010
Founded by Marc P. Kessler in his own garage in Pfullendorf; started with consulting on outsourcing production facilities
- 2011
Strong growth; establishment of an own quality management system
- 2012
Relocation of company headquarters to Königseggwald; own production
- 2014
In-house prototype production; expansion of production services
- 2015
Expansion of the Königseggwald site
- 2016
Move to a new company building in Königseggwald
- 2018
Founding of the subsidiaries kessler engineering and kessler licht technik; red dot design award for kessler licht technik
- 2019
Iconic Award for innovative architecture for kessler licht technik
- 2020
10th company anniversary; Green Product Award for kessler licht technik
- 2022
Move to the new company headquarters in Ostrach
- 2023
New customers from IoT and industry; site expansion in planning
- 2023-08
Capacity expansion at the Ostrach site through two new assembly islands (from October)
- 2024
New wave soldering system for prototype production; AOI system Viscom S3088; deployment of Inspekto S70 (AI camera) for final inspection
- 2025-11
Acquisition of Soluware GmbH (Ravensburg); Schulz Group acquires shares in kessler systems and becomes a strategic partner