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Koh Young – Fertigung

Koh Young develops True-3D inspection systems for electronics manufacturing, semiconductor advanced packaging and medical robotics.

KO

Koh Young Technology, Inc.

Seoul (South Korea)New on Amplifa

2002Founded
No. 1 in SPI & AOI since 2013Market position (self-reported)
WorldwideDelivery routes / sales

About Koh Young

Founded in 2002, Koh Young Technology specializes in inspection and measurement solutions based on optomechatronics and machine vision. The core portfolio includes 3D solder paste inspection (SPI), True-3D automated optical inspection (AOI), semiconductor inspection for advanced packaging as well as Mini/Micro-LED, Dispensing Process Inspection (DPI), Final Optical Inspection (FOI) and 3D measurement systems for high-density substrates. In addition, the company offers AI-based process optimization and process control for smart factory environments, including KPO Printer, KAP (Auto One-Touch AI Programming) and Smart Review. The product lines include aSPIre 3, Zenith 2, Zenith S, Meister D/D+ and Neptune C+. Since 2006, the company has called itself the world market leader in 3D inspection and states that it has held the No. 1 market position in SPI and AOI since 2013. With its expertise in optomechatronics, Koh Young is also active in the medical field, in particular with a platform for neurosurgical navigation and robotic guidance. Customers come from electronics manufacturing (SMT/EMS), the semiconductor industry and medical technology; deliveries are made worldwide.

Site
Seoul (South Korea)
Processes
Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), True 3D, Semiconductor Inspection (Advanced Packaging, Mini/Micro-LED), Dispensing Process Inspection (DPI), Final Optical Inspection (FOI), 3D Measurement for High-Density Substrate, AI-based process optimization (smart factory), Medical robotics / neurosurgical navigation
Materials
3D Solder Paste Inspection (SPI), True 3D AOI, Semiconductor Inspection, Dispensing Process Inspection (DPI), Final Optical Inspection (FOI), 3D Measurement for High-Density Substrates, AI Process Optimization
Founded
2002
Industries
Electronics manufacturing (SMT/EMS), Semiconductor / advanced packaging, Medical technology
  1. 01

    Research & development (optomechatronics, machine vision, AI)

  2. 02

    System development and manufacturing of the inspection systems

  3. 03

    AI programming and software (KAP, Smart Review)

  4. 04

    Sales and worldwide delivery

  5. 05

    Process optimization and support at the customer

Technologies & Processes

SPI

3D Solder Paste Inspection (SPI)

Inspection of the print quality and reliability of solder paste prints in SMT manufacturing.

AOI

True 3D AOI

AI-supported optical final inspection for zero-defect production in electronics manufacturing.

SEMICON

Semiconductor Inspection

Quality assurance for advanced packaging as well as Mini/Micro-LED applications.

DPI

Dispensing Process Inspection (DPI)

In-line inspection of dispensing processes including thickness measurement.

FOI

Final Optical Inspection (FOI)

True-3D inspection technology for hybrid inspection tasks.

MEISTER

3D Measurement for High-Density Substrates

Measurement of highly reflective components and high-density substrates.

AI

AI Process Optimization

Automated process control and optimization for smart factory environments, e.g. KPO Printer.

Locations

Seoul

KR

Headquarters and development

  • aSPIre 3 (3D SPI)
  • Zenith 2 / Zenith S (True 3D AOI)
  • Meister D/D+ (3D measurement system)
  • Neptune C+ (in-line DPI)
  • KPO Printer (AI process optimization)

Industries

Electronics manufacturing (SMT/EMS)Semiconductor / advanced packagingMedical technology

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
Solder Paste Inspection (SPI)Inspection–––––
Automated Optical Inspection (AOI), True 3DInspection–––––
Semiconductor Inspection (Advanced Packaging, Mini/Micro-LED)Inspection–––––
Dispensing Process Inspection (DPI)Inspection–––––
Final Optical Inspection (FOI)Inspection–––––
3D Measurement for High-Density SubstrateInspection–––––
AI-based process optimization (smart factory)Engineering–––––
Medical robotics / neurosurgical navigationAssembly–––––

6 Anlagen & Maschinen

MachineManufacturer / modelQuantityWorking areaYear builtSite
3D SPI inspection systemKoh Young aSPIre 3––––
True 3D AOI inspection systemKoh Young Zenith 2––––
True 3D AOI inspection systemKoh Young Zenith S––––
3D measurement system for substratesKoh Young Meister D/D+––––
In-line DPI inspection systemKoh Young Neptune C+––––
AI process optimization solution for printersKoh Young KPO Printer––––

Additional services

3D SPI (solder paste inspection)3D AOI (automated optical inspection)Semiconductor inspection (advanced packaging, Mini/Micro-LED)Dispensing Process Inspection (DPI)Final Optical Inspection (FOI)AI-based process optimization and process control (smart factory)Medical technology / neurosurgical navigation and robotic guidance

History

  1. 2002

    Foundation of Koh Young Technology

  2. 2006

    Self-reported: position as world market leader in 3D inspection

  3. 2013

    Self-reported: market position No. 1 in SPI & AOI

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