Manufacturer of flex, rigid-flex and multilayer PCBs including assembly, engineering and expedited service
Kubatronik Leiterplatten GmbH
Geislingen / Steige (DE)New on Amplifa
Company
Kubatronik Leiterplatten GmbH is a PCB manufacturer that has been in operation for more than 40 years, headquartered in Geislingen an der Steige in southern Germany. For over 20 years, the focus has been on flex and rigid-flex PCBs; the portfolio also includes multilayer boards up to 42 layers, semiflex, insulating boards, as well as HDI and SBU constructions with laser-drilled microvias. The company manufactures prototypes and small and medium series "Made im Schwabenländle" and supports projects from DFM and co-engineering through to series production. The range of services also includes impedance control, laser cutting and drilling, PCB assembly (PCBA) with component sourcing, as well as high-volume procurement via European and Asian partner companies. The products are used in aerospace, military technology, medical technology and high-end industry.
- Site
- Geislingen / Steige
- Processes
- Flex PCBs (1-layer, 2-layer, multilayer, plated through, with/without stiffener), Rigid-flex PCBs (up to 32 layers, symmetric/asymmetric, HDI/SBU), Multilayer PCBs (up to 42 layers), Semiflex PCBs, Insulating boards (max. thickness 5.6 mm), HDI / SBU (sequential layer builds, blind/buried/stacked/staggered microvias, laser-drilled), HighSpeed / HighFrequency PCBs (impedance control, mixed-layer builds,, Trace width and spacing 75 µm (3 mil), micro-fine structures
- Materials
- FR4, PTFE (Teflon), RF/HF special materials, Copper, Low-profile copper foils, Solder resist (green, blue, black, white, yellow, red), Epoxy, Polyimide
- Certificates
- DIN EN ISO 9001, DIN EN ISO 9100 (aerospace), UL 94 V0, IPC / RoHS / REACH
- Industries
- Aerospace, Military/defense technology, Medical technology, High-end industry
- 01
Engineering / Co-Design (DFM)
- 02
Prototyping
- 03
PCB manufacturing (flex, rigid-flex, multilayer, HDI)
- 04
Impedance control / testing
- 05
PCB assembly (PCBA) and component sourcing
- 06
Series production incl. procurement via partners
Materials and Surfaces
FR4
Base material for multilayer and rigid-flex PCBs up to 42 layers, also in mixed-layer constructions with RF/HF materials.
Polyimide
Flexible base material for 1- to multilayer flex PCBs.
PTFE (Teflon)
Material with extremely low loss factor for high-frequency applications.
RF/HF special materials
Materials with special dielectric properties for low-loss high-frequency transmission.
Copper / low-profile copper foils
Conductor material; low-profile foils for HF-capable structures.
Epoxy
Used, among other things, for via plugging (IPC4761 Type I-VII).
Solder resist
Available in green, blue, black, white, yellow and red.
Sites
Geislingen / Steige
DEHeadquarters and production
- Lot size
- Prototypes to high volumes
- Materials
- Polyimide, FR4, PTFE, copper, RF/HF materials
- Modern machinery for PCB manufacturing
- Laser drilling/laser cutting (microvias)
- PCBA assembly
PCBs and Assemblies
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Flex PCBs (1-layer, 2-layer, multilayer, plated through, with/without stiffener)PCB manufacturing | – | – | – | Prototypes – Series | Polyimide, Copper |
| Rigid-flex PCBs (up to 32 layers, symmetric/asymmetric, HDI/SBU)PCB manufacturing | – | – | – | – | FR4, Polyimide |
| Multilayer PCBs (up to 42 layers)PCB manufacturing | – | – | – | – | FR4 |
| Semiflex PCBsPCB manufacturing | – | – | – | – | – |
| Insulating boards (max. thickness 5.6 mm)PCB manufacturing | – | – | – | – | – |
| HDI / SBU (sequential layer builds, blind/buried/stacked/staggered microvias, laser-drilled)PCB manufacturing | – | – | – | – | – |
| HighSpeed / HighFrequency PCBs (impedance control, mixed-layer builds,PCB manufacturing | – | – | – | – | PTFE (Teflon), FR4, RF/HF materials |
| Trace width and spacing 75 µm (3 mil), micro-fine structuresPCB manufacturing | – | – | – | – | – |
| Laser cutting and laser drillingPCB manufacturing | – | – | – | – | – |
| Via in pad, plugging with copper/epoxy/solder resist (IPC4761 Type I-VII)PCB manufacturing | – | – | – | – | Copper, Epoxy, Solder resist |
| Metallization of edges and slotsPCB manufacturing | – | – | – | – | Copper |
| Impedance control (on request with protocol report)Testing | – | – | – | – | – |
| PCB assembly (PCBA) incl. component sourcing, prototypes to high volumesAssembly | – | – | – | Prototype – high volumes | – |
| Engineering: DFM, prototyping, co-engineering & co-designEngineering | – | – | – | – | – |
| Surface finishes (HASL among others, combination of different finishes)Surface finish | – | – | – | – | – |
| Embedded components, heatsink, backplanes, cavities, hybrid PCBsPCB manufacturing | – | – | – | – | – |
1 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Modern machinery (PCB manufacturing, details not specified) | – | – | – | – | Geislingen / Steige |
Additional services
Reference customers
Quality
Quality control and certifications according to DIN EN ISO 9001 and DIN EN ISO 9100 as well as UL 94 V0; IPC, RoHS and REACH compliance is observed. Impedance control is available on request with a protocol report.
| Evidence | Geislingen / Steige |
|---|---|
| DIN EN ISO 9001 | |
| DIN EN ISO 9100 (aerospace) | |
| UL 94 V0 | |
| IPC / RoHS / REACH |
History
Founding of the company; active as a PCB manufacturer for more than 40 years
Start of specialization in flex and rigid-flex PCBs (more than 20 years ago)