Solutions for electronics manufacturing: SMT and THT technology, inspection, consumables and used machinery.
KÜBLER GmbH
Altensteig-Walddorf (headquarters)New on Amplifa
Manufacturing solutions by system – the Kübler principle
KÜBLER GmbH, based in Altensteig-Walddorf, is a family-run company that has been active in electronics manufacturing for over 30 years. The portfolio covers manufacturing solutions for the entire SMT process chain – from stencil printing, dispensing/jetting and placement through to vapor phase and selective soldering – complemented by board handling, intelligent SMD storage systems with pick-by-light, and automated goods-inward capture. For quality assurance, AI-supported 3D AOI and SPI systems, in-machine First Article Inspection, and digital microscopes up to 4K are offered. In addition, the company supplies consumables such as solder pastes (T3–T6), fluxes and solder, organizes the recycling of tin-containing electronic waste, and brokers inspected used machinery including disassembly, transport and reassembly. Technology partners include Panasonic, Essemtec, Asscon, INERTEC, Pacha and Arcadia. Consulting on process development, line design and project support through to installation, commissioning, training and maintenance is consolidated at Kübler with a single point of contact.
- Site
- Altensteig-Walddorf
- Processes
- SMD printing (stencil printing), SMD placement, All-in-one placement (jetting of solder paste + placement), Dispensing/jetting (solder paste, adhesives, potting compounds, underfill, 3D dispensing), Vapor phase soldering (with/without vacuum, toploader to inline), Selective soldering (batch to inline), Hybrid placement of SMD and THT components including cutting and clinching, AOI and SPI (3D inspection, AI-supported)
- Materials
- Solder paste (alloys, powder sizes T3–T6, lead-free and lead-containing), Solder (bars, rods, anodes, wire; lead-free and lead-containing), Potting compounds, Adhesives/SMT adhesives, Silver epoxy, Silver conductive adhesive, Underfill (underfill/void-filling material), Solder paste (T3–T6)
- Industries
- Electronics manufacturing, SMT/THT manufacturing, Electronic assemblies
- 01
Consulting on process development and line design
- 02
Technology selection from manufacturers and partners
- 03
Coordination of installation, commissioning, training and maintenance
- 04
Consumables: solder pastes, fluxes, solder
- 05
Recycling of tin-containing electronic waste
- 06
Sales and brokerage of used machinery
Materials & consumables
Solder paste (T3–T6)
Various alloys and powder sizes T3 to T6, lead-free and lead-containing, with low void content.
Flux
For wave/selective soldering and tinning, no-clean, water-soluble, rosin-based and VOC-free, RoHS and REACH compliant.
Solder
Bars, rods, anodes and wire, lead-free and lead-containing.
Potting compounds, adhesives, silver epoxy, silver conductive adhesive,
Dispensing and potting materials for dispensing and coating applications on electronic assemblies.
Site
Altensteig-Walddorf
DEHeadquarters
- Panasonic NPM-GP/L stencil printers
- Essemtec Tarantula dispenser
- Essemtec Puma and Fox placement machines
- Panasonic NPM-W2, NPM-WX and AM100 placement machines
- Asscon vapor phase soldering systems VP510 to VP1000-1580
- INERTEC selective soldering systems CUBE.460 and CUBE Inline+
- Pacha transport, flip and buffer modules
- Arcadia storage systems Archimede, Galileo goods-inward station
Components & applications
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMD printing (stencil printing)Electronics manufacturing/SMT | Repeat accuracy ±3.8 µm | – | – | – | Solder paste |
| SMD placementElectronics manufacturing/SMT | Placement accuracy up to ±25 µm | – | – | – | – |
| All-in-one placement (jetting of solder paste + placement)Electronics manufacturing/SMT | – | – | – | – | Solder paste, Adhesive |
| Dispensing/jetting (solder paste, adhesives, potting compounds, underfill, 3D dispensing)Electronics manufacturing/SMT | – | – | – | – | Solder paste, Adhesives, Potting compounds, Silver epoxy, Silver conductive adhesive, Underfill |
| Vapor phase soldering (with/without vacuum, toploader to inline)Electronics manufacturing/Soldering | – | up to 1500 mm (VP1000-1580) | – | – | – |
| Selective soldering (batch to inline)Electronics manufacturing/Soldering | Solder angle programmable 0°/7° | 460 mm × 460 mm | – | – | lead-containing PCBs, lead-free PCBs |
| Hybrid placement of SMD and THT components including cutting and clinchingElectronics manufacturing/THT | – | – | – | – | – |
| AOI and SPI (3D inspection, AI-supported)Inspection | – | – | – | – | – |
| 3D AOI after reflow and wave solderingInspection | – | – | – | – | – |
| First Article Inspection in the machineInspection | – | – | – | – | – |
| Inspection/rework with digital autofocus microscopes up to 4KInspection | – | – | – | – | – |
| Automated goods inward (AI label recognition, 2D scanner, OCR, label printing)Electronics manufacturing/Logistics | – | – | – | – | – |
| Intelligent SMD storage systems with pick-by-lightElectronics manufacturing/Logistics | – | – | – | – | – |
| Board handling/automation (loaders, unloaders, flip, rotate and buffer modules)Electronics manufacturing/Handling | – | – | – | – | – |
| Coating and potting of assemblies (dispensing and coating system)Electronics manufacturing | – | – | – | – | Adhesives and sealants, UV-curing materials, Single- and multi-component materials |
| UV curing (inline, through-feed oven)Surface treatment | – | – | – | – | UV-curing materials |
| Electronics manufacturing/Materials | – | – | – | – | Solder pastes, Fluxes, Solder |
| Recycling of tin-containing electronic wasteOther | – | – | – | – | tin-containing electronic waste |
| Electronics manufacturing | – | – | – | – | – |
| Consulting on process development and line designEngineering | – | – | – | – | – |
27 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Stencil printer | Panasonic NPM-GP/L | – | – | – | Altensteig-Walddorf |
| Dispensing system (inline) | Essemtec Spider | – | Dispensing area up to 406 × 305 mm | – | Used machine in stock |
| Dispenser | Essemtec Tarantula | – | PCBs up to 560 × 610 mm, optionally up to 1800 × 610 mm | – | Altensteig-Walddorf |
| Inline placement machine with dispensing axes | Essemtec PUMA 1 | – | PCBs up to 560 × 610 mm; components 0201 to 80 × 33 mm | 2021 | Used machine in stock |
| Placement machine | Essemtec Puma | – | up to 280 feeder tracks on 2 m²; PCBs up to 1,800 mm | – | Altensteig-Walddorf |
| Placement machine | Essemtec Fox | – | up to 200 feeder tracks on 1 m², up to 420 feeder tracks per line | – | Altensteig-Walddorf |
| SMT placement machine | Panasonic NPM-W2 | – | Components 01005 to 150 × 24 × 40 mm | – | Altensteig-Walddorf |
| SMT placement machine | Panasonic NPM-WX (also NPM-WXS) | – | Components 01005 to 150 × 24 × 40 mm | – | Altensteig-Walddorf |
| Placement system | Panasonic AM100 | – | for large PCBs and large components | – | Altensteig-Walddorf |
| Vapor phase soldering system | Asscon VP510 | – | Soldering format up to 450 × 450 mm | – | Altensteig-Walddorf |
| Vapor phase soldering system | Asscon VP310 | – | Soldering format up to 300 × 300 mm | – | Altensteig-Walddorf |
| Vapor phase soldering system (batch, optional vacuum) | Asscon VP810 / VP810 vacuum | – | – | – | Altensteig-Walddorf |
| Vapor phase soldering system | Asscon VP6100 | – | up to 600 × 600 mm | – | Altensteig-Walddorf |
| Vapor phase soldering system | Asscon VP1100 | – | up to 610 × 610 mm | – | Altensteig-Walddorf |
| Vapor phase soldering system (inline) | Asscon VP1000-1580 | – | up to 1500 × 610 mm (side trimmed) | – | Altensteig-Walddorf |
| Selective soldering system | INERTEC CUBE.460 | – | PCBs up to max. 460 × 460 mm | – | Altensteig-Walddorf |
| Selective soldering system (inline, modular) | INERTEC CUBE Inline+ | – | – | – | Altensteig-Walddorf |
| Transport, flip and buffer modules (board handling) | Pacha | – | – | – | Altensteig-Walddorf |
| THT PCB handling and workstation systems | Pacha | – | – | – | Altensteig-Walddorf |
| Transfer and circulation systems for solder frames and masks | Pacha | – | – | – | Altensteig-Walddorf |
| Intelligent storage system (pick-by-light) | Arcadia Archimede | – | up to 1,200 reels on 0.45 m²; stencils up to 240 units on 0.60 m² | – | Altensteig-Walddorf |
| Stencil storage (Smart Storage Stencil) | Arcadia Archimede Smart Storage Stencil | – | – | – | Altensteig-Walddorf |
| Pick-by-light bars | Arcadia Archimede Smart Bars | – | – | – | Altensteig-Walddorf |
| Mobile setup cart | Arcadia Archimede Smart Cart | – | – | – | Altensteig-Walddorf |
| Goods-inward station | Arcadia Galileo | – | – | – | Altensteig-Walddorf |
| Cartesian dispensing and coating system (inline cell with UV curing) | Werner Wirth Alpha 6 | – | XY-axis gantry, Z-axis | – | Used machine in stock |
| UV curing through-feed oven | Werner Wirth Alpha UV Cure | – | – | – | Used machine in stock |
Additional services
Background
Family-run company with over 30 years of experience in electronics manufacturing; the website additionally advertises 40 years of expertise.