High-performance laser surface structuring (DLIP) with feature sizes below 1 µm for functionalized product surfaces.
LAMpAS
New on Amplifa
About LAMpAS
LAMpAS is a European research and technology project that makes laser surface structuring industrially scalable. At its core is the combination of a high-power ultrashort-pulse laser (>1 kW, ps laser) with a DLIP polygon scanner head that achieves scan speeds over 100 m/s and a productivity of more than 1 m²/min. The processes create defined surface patterns with structure sizes below 1 µm and minimal thermal impact on the workpiece. This results in functional properties such as anti-fingerprint, anti-bacterial and easy-to-clean, as well as decorative finishes. Target industries include, among others, household appliances (ovens, hobs, cooker hoods, dishwashers, refrigerators), tools, furniture, sporting goods, and laboratory and hospital equipment. Consortium partners include Bosch, TRUMPF, Lasea and NIT.
- Processes
- Ultrashort-pulse laser structuring (ultrashort-pulse laser, DLIP/polygon scanner), High-power ultrashort-pulse laser processing (DLIP, >1 kW ps laser, scan speeds >100 m/s), Laser structuring of surfaces with feature sizes <1 µm, Surface functionalization (anti-fingerprint, anti-bacterial, easy-to-clean, decorative, Fast material processing with minimal thermal impact
- Materials
- Ultrashort-pulse laser processing with DLIP polygon scanner, Direct Laser Interference Patterning
- Industries
- Household appliances, Tools, Garden & hobby, Furniture, Sporting goods, Signage
- 01
High-power ultrashort-pulse laser source (>1 kW ps laser)
- 02
DLIP polygon scanner beam guidance
- 03
Surface structuring (<1 µm feature size)
- 04
Functionalization of the component surface
Processes & Technologies
Ultrashort-pulse laser processing with DLIP polygon scanner
High-throughput laser structuring (>1 m²/min) with scan speeds over 100 m/s and minimal thermal impact.
Direct Laser Interference Patterning
Creates interference-based surface patterns with a resolution of 5–10 µm and feature sizes below 1 µm.
Application Examples
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Ultrashort-pulse laser structuring (ultrashort-pulse laser, DLIP/polygon scanner)Surface | Resolution 5–10 µm · Structure sizes < 1 µm | – | – | – | – |
1 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Ultrashort-pulse laser system (>1 kW ps laser) with DLIP polygon scanner head | DLIP Polygon Scanner head | – | Scan speed > 100 m/s; productivity > 1 m²/min | – | – |
Additional services
Project History
- 2020
Website/project published (JSON-LD datePublished 2020-06-09)
- 2022
Participation in EPIC Online Technology Meeting on Lasers for Mobility of the Future (17.10.2022)