Precision machines and turnkey solutions for lapping, polishing, fine grinding and wire sawing – in particular for Si and SiC wafers.
Lapmaster Wolters GmbH
Rendsburg, Germany · Mount Prospect, IL, USA · Shenyang, China · Cheyyar, India · Gwatt (Thun), SwitzerlandNew on Amplifa
About Lapmaster Wolters
Lapmaster Wolters GmbH, headquartered in Rendsburg, is a manufacturer of precision machining machines and a provider of turnkey process solutions for surface treatment. The portfolio includes double-disc machines for lapping, polishing and fine grinding, multi-wire saw machines and CMP (chemical-mechanical polishing) systems. Materials machined include silicon and SiC wafers as well as extremely hard and brittle materials such as gallium nitride, indium phosphide, sapphire, diamond, specialty glass and rare-earth magnet alloys, plus metals, plastics, ceramics and glass for general industry. The offering is complemented by service, maintenance, retrofit, spare parts, consumables and contract lapping, polishing and metrology services. The company was formed in 2014 through the acquisition of Peter Wolters GmbH by Lapmaster and operates locations in North America, Asia and Europe.
- Site
- Rendsburg
- Processes
- Lapping, Polishing, Fine Grinding, single-sided and double-sided, Profile and Creep-Feed Grinding, Double Disc Grinding, Thru-Feed Grinding, Bore Honing and Finishing, Precision Sawing for Wafers
- Materials
- Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN), Indium Phosphide (InP), Sapphire, Diamond, Specialty Glass, Rare-Earth Magnet Alloys
- Industries
- Semiconductors, Opto-Electronics, Precision Optics, Aerospace, Energy Technology, Automotive
- 01
Engineering and process development
- 02
Machine manufacturing (double-disc, CMP and wire saw machines)
- 03
Turnkey process solutions
- 04
Consumables (abrasives, diamond products, carriers, slurries)
- 05
Service, maintenance and retrofit
- 06
Contract lapping/polishing/metrology services
Materials and Processes
Silicon (Si)
Wafer manufacturing for logic, memory chips, power devices and photovoltaics via wire sawing, lapping, fine grinding and CMP.
Silicon Carbide (SiC)
Double-sided precision machining (DSPL/DMP/CMP) of 6" and 8" SiC wafers with the patented UPAC system.
Gallium Nitride (GaN)
Hard, brittle semiconductor material for opto-electronics, machined with diamond-based tooling and adaptive process control.
Indium Phosphide (InP)
Used in opto-electronic applications, requires single-sided and double-sided precision machining.
Sapphire
Ultra-hard material for optics and electronics applications, machined by lapping and polishing.
Diamond
Extremely hard machining task with specialized processes and diamond tooling.
Specialty Glass / Glass
Machining, among others, for smart and AR glasses with high surface quality and low material stress.
Rare-Earth Magnet Alloys
Components for energy and high-tech applications, single- and double-sided precision machining.
Metals, Plastics, Ceramics
General industry: double-disc grinding, deburring, honing and contract manufacturing for automotive, aerospace and medical technology.
Locations
Rendsburg
DEHeadquarters and production (wire saw production since 2021)
- Multi-wire saw machines (DW288-S4, DW288-S6, DW292, DW296)
- Double-disc machines AC 400/700/1200/1500
Mount Prospect, IL
USUS Headquarter, Lapmaster International LLC
Noblesville, IN
USIndiana Facility, Lapmaster International LLC
Shenyang
CNLAPMASTER WOLTERS Precision Machinery Company, Ltd – production and sales
Bangalore
INLW Semiconductor India Pvt. Ltd
Cheyyar, Thiruvannamalai Dist.
INLapmaster Wolters India Private Limited – production
Gwatt (Thun)
CHPW WaferTec GmbH
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| LappingSurface | – | – | – | – | Silicon (Si), SiC, Gallium Nitride (GaN), Indium Phosphide (InP), Sapphire, Diamond, Glass, Metals, Plastics, Ceramics, Rare-Earth Magnet Alloys |
| PolishingSurface | – | – | – | – | Silicon (Si), SiC, Sapphire, Glass, Metals, Plastics, Ceramics |
| Fine Grinding, single-sided and double-sidedMachining | – | – | – | – | Silicon (Si), SiC, Metals, Plastics, Ceramics, Glass |
| Profile and Creep-Feed GrindingMachining | – | – | – | – | Metals |
| Double Disc GrindingMachining | – | – | – | – | Metals, Plastics, Ceramics, Glass |
| Thru-Feed GrindingMachining | – | – | – | – | Metals |
| Bore Honing and FinishingSurface | – | – | – | – | Metals |
| Precision Sawing for WafersMachining | – | – | – | – | Silicon (Si), SiC |
| Wire Sawing of Monocrystalline Silicon Bricks into Ultra-Thin Wafers (Multi Wire Saw)Machining | – | – | – | – | Silicon (Si) |
| CMP (Chemical-Mechanical Polishing) for Structured WafersSurface | – | – | – | – | Silicon (Si), SiC |
| DAP (Double-Sided Precision Lapping)Surface | – | – | – | – | SiC wafers |
| Metallographic PreparationTesting | – | – | – | – | Metals |
| DeburringSurface | – | – | – | – | Metals |
| Contract Manufacturing: Contract Lapping/Polishing/Metrology ServicesSurface | – | – | – | – | Metals, Plastics, Ceramics, Glass |
14 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Double-disc batch processing machine (lapping/polishing) | Peter Wolters AC 400 L | – | – | – | – |
| Double-disc batch processing machine (lapping/polishing) | Peter Wolters AC 400 P | – | – | – | – |
| Double-disc batch processing machine | Peter Wolters AC 700 L | – | – | – | – |
| Double-disc batch processing machine | Peter Wolters AC 700 P | – | – | – | – |
| Double-sided machining machine for SiC wafers | Peter Wolters AC 1200 DSPL | – | – | – | – |
| Double-sided machine for SiC wafers | Peter Wolters AC 1200 L | – | – | – | – |
| Double-sided machine for SiC wafers | Peter Wolters AC 1200 P | – | – | – | – |
| Double-disc machine DSPL/DMP/CMP for 6" and 8" SiC wafers, UPAC system | Peter Wolters AC 1500 DSPL-DMP-CMP | – | 6" and 8" wafers | – | – |
| Double-disc batch processing machine (50 kW main drives, max. working pressure 3000 daN) | Peter Wolters AC 1500 L | – | – | – | – |
| Multi-wire saw machine | DW288-S4 | – | – | – | – |
| Multi-wire saw machine | DW288-S6 | – | – | – | – |
| Multi-wire saw machine | DW292 | – | – | – | – |
| Multi-wire saw machine for square monocrystalline Si bricks (photovoltaics) | DW296 | – | – | – | – |
| Sawing machine for wafer processing | TS23 | – | – | – | – |
Additional services
Reference customers