Manufacturer of high-precision machine tools for lapping, fine grinding, polishing and cutting of wafers and flat precision parts
Lapmaster Wolters GmbH
Rendsburg, Germany · Mount Prospect, IL, USA · Ivybridge, UKNew on Amplifa
Precision Meets Partnership
Lapmaster Wolters GmbH, which operates under the Peter Wolters brand, develops, manufactures and markets high-precision machine tools and systems for fine surface finishing. The portfolio comprises fine grinding, lapping, honing and polishing machines for flat workpieces, internal cylindrical, creep-feed and profile grinding machines as well as CMP machines, cutting and wire saws, and deburring machines. Materials processed include silicon wafers, metal, ceramics, glass and electronic materials. The machines are used primarily in the semiconductor and photovoltaic industries as well as in the automotive, aerospace, electronics, ceramics and glass industries. The offering also includes consumables, custom-tailored processes, commissioning, and service and maintenance. This is complemented by research and development in the fields of engineering, mechatronics and process technology. Founded in 1804 and headquartered in Rendsburg, the company is part of the Precision Surfacing Solutions Group (PSS) with production facilities in Illinois (USA) and Ivybridge (UK).
- Site
- Rendsburg, Schleswig-Holstein
- Processes
- Lapping, Honing, Polishing, Fine grinding, Cutting/Sawing (cut-off and wire saws), CMP (Chemical Mechanical Polishing) for wafer structures, Deburring, Internal cylindrical grinding
- Materials
- Silicon (wafers), Ceramics, Glass, Metal, Electronic materials
- Certificates
- ISO 9001
- Founded
- 1804
- Employees
- 600
- Industries
- Semiconductor industry, Photovoltaics, Automotive, Aerospace, Electronics, Ceramics
- 01
Engineering, mechatronics and process technology (R&D)
- 02
Machine manufacturing
- 03
Commissioning
- 04
Consumables (consumable materials)
- 05
Service and maintenance
- 06
Customer-specific, custom-tailored processes
Materials and Processes
Silicon (wafers)
Basis for microchips and photovoltaic wafers; central material for lapping, CMP and cutting processes.
Metal
Machining of metallic workpieces by lapping, honing, polishing, fine grinding and deburring.
Ceramics
Fine finishing of ceramic workpieces for electronics and industrial applications.
Glass
Precision surface finishing of glass workpieces.
Electronic materials
Processing of materials from the electronics industry.
Sites
Rendsburg
DEHeadquarters and production
- Materials
- Silicon wafers, metal, ceramics, glass
- Lapping machines for silicon wafers
- CMP machines for wafer processing
- Cutting and wire saws
- Internal cylindrical grinding machines
- Creep-feed grinding machines
- Profile grinding machines
- Deburring machines
Mount Prospect, IL
USProduction facility
- Fine grinding, lapping and polishing machines for flat workpieces
Ivybridge
UKProduction facility
- Fine grinding, lapping and polishing machines for flat workpieces
Machined Components
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| LappingSurface | – | – | – | – | Silicon (wafers), various materials (metal, ceramics, glass) |
| HoningSurface | – | – | – | – | various materials |
| PolishingSurface | – | – | – | – | various materials |
| Fine grindingSurface | – | – | – | – | various materials |
| Cutting/Sawing (cut-off and wire saws)Machining | – | – | – | – | Silicon (wafers), photovoltaic and semiconductor wafers |
| CMP (Chemical Mechanical Polishing) for wafer structuresSurface | – | – | – | – | Silicon wafers |
| DeburringSurface | – | – | – | – | Metal |
| Internal cylindrical grindingMachining | – | – | – | – | Metal |
| Creep-feed grindingMachining | – | – | – | – | Metal |
| Profile grindingMachining | – | – | – | – | Metal |
| Engineering (engineering, mechatronics and process technology, R&D)Engineering | – | – | – | – | – |
7 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Lapping machine (silicon wafers) | Lapmaster Wolters / Peter Wolters | – | – | seit 1961 | Rendsburg |
| CMP machine (wafer processing) | Peter Wolters | – | – | seit 1996 | Rendsburg |
| Cut-off and wire saws | Lapmaster Wolters / Peter Wolters (acquired from Meyer Burger) | – | – | 2019/2021 | Rendsburg |
| Internal cylindrical grinding machine | Peter Wolters | – | – | – | – |
| Creep-feed grinding machine | Peter Wolters | – | – | – | – |
| Profile grinding machine | Peter Wolters | – | – | – | – |
| Fine grinding, lapping and polishing machines (flat workpieces) | Peter Wolters | – | – | – | Rendsburg, Illinois (USA), Ivybridge (UK) |
Additional services
Reference customers
Quality
The company texts emphasize strict regulatory standards as well as high demands on quality, dimensional accuracy and efficiency in precision manufacturing. Specific certificates and testing equipment are not listed in the sources.
| Evidence | Rendsburg |
|---|---|
| ISO 9001 |