EMS manufacturing of electronic assemblies (PCBA) and modules – from development to delivery
Leuze electronic assembly GmbH
Unterstadion, GermanyNew on Amplifa
About Leuze electronic assembly
Leuze electronic assembly GmbH (LEA) is a subsidiary of the Leuze Group specialising in Electronics Manufacturing Services (EMS), located in Unterstadion in the Alb-Donau district. Founded in 1977, the company develops, manufactures and distributes electronic assemblies (PCBA) as well as integrated modules based on them – from PCB design through assembly and testing to customised packaging and delivery. In the approximately 3,000 m² plant, more than 200 employees work in three shifts on three SMD production lines. The manufacturing range includes SMD and THT assembly, Fine Pitch BGAs, assembly on flexible substrate material, micro-assembly under cleanroom conditions (±15 µm), protective coating and potting as well as electrical testing. Around two thirds of production goes to the worldwide Leuze Group, one third to external customers; over 250 million assembled components are processed per year. LEA is certified to DIN EN ISO 9001 and ISO 14001.
- Site
- Unterstadion
- Processes
- THT assembly (Through-Hole), SMT assembly (Surface-mounted), Fine Pitch BGA assembly, Assembly on flexible substrate material (interconnection technologies), Manufacturing of multilayer HDI structures, PCB design / schematic to PCBA (engineering), In-house jig and fixture construction, Industrialisation with 3-shift production
- Materials
- SMD assembly (Surface-mounted), THT assembly (Through-Hole), Fine Pitch BGA, Multilayer HDI structures, Flexible substrate material, COB technology / micro-assembly, PCBs from leading PCB suppliers
- Certificates
- DIN EN ISO 9001, DIN EN ISO 14001
- Founded
- 1977
- Employees
- 160
- Industries
- Electronics manufacturing/EMS, Industrial automation, OEM
Processes & Technologies
SMD assembly (Surface-mounted)
Assembly of surface-mounted components with FUJI NXT3, in practice up to 100,000 components per hour.
THT assembly (Through-Hole)
Plug-in components are passed through the PCB and soldered by hand, wave or robotic soldering.
Fine Pitch BGA
Assembly of components with fine pitch dimensions as a company speciality.
Multilayer HDI structures
Manufacturing of complex multilayer PCBs with high packing densities.
Flexible substrate material
Assembly of interconnection technologies on flexible substrate materials.
COB technology / micro-assembly
Placement of components and apertures in the cleanroom with ±15 µm accuracy.
PCBs from leading PCB suppliers
Close cooperation with leading PCB suppliers for efficient and automated manufacturing processes.
Locations
Unterstadion
DEHeadquarters and production (3 production lines, 3-shift operation)
- FUJI NXT3 SMD placement machine (in practice up to 100,000 components/h)
- AOI 3D system from KohYoung
- Central line computer from ASYS
- Component programming machine (all component types, over 500,000 components/year)
- 3 SMD production lines (paste printing, placement, reflow, AOI)
- Cleanroom for micro-assembly
- Inline UV curing system
- Wave soldering system
- Robotic soldering system
- Flying probe test system
- Bed-of-nails inline test
- Laser separation system
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| THT assembly (Through-Hole)Assembly | – | – | – | – | – |
| SMT assembly (Surface-mounted)Assembly | – | – | – | – | – |
| Fine Pitch BGA assemblyAssembly | – | – | – | – | – |
| Assembly on flexible substrate material (interconnection technologies)Assembly | – | – | – | – | – |
| Manufacturing of multilayer HDI structuresAssembly | – | – | – | – | – |
| PCB design / schematic to PCBA (engineering)Engineering | – | – | – | – | – |
| In-house jig and fixture constructionEngineering | – | – | – | – | – |
| Industrialisation with 3-shift productionEngineering | – | – | – | – | – |
| Component programming (fully automatic)Assembly | – | – | – | – | – |
| SMD process: paste printing with SPIAssembly | Paste application accurate to 1 µm | – | – | – | – |
| SMD assembly with FUJI NXT3 P&P (up to 100,000 components/h)Assembly | – | – | – | – | – |
| Reflow soldering under controlled inert gas atmosphereJoining | – | – | – | – | – |
| Automated Optical Inspection (AOI) in 3D inlineTesting | – | – | – | – | – |
| Micro-assembly: components, apertures & COB technology (under cleanroom conditions)Assembly | Placement +/- 15 µm | – | – | – | – |
| Machine-based adhesive applications with inline UV curing systemAssembly | – | – | – | – | – |
| Hand soldering (THT soldering)Joining | – | – | – | – | – |
| Wave soldering (THT soldering)Joining | – | – | – | – | – |
| Robotic soldering (THT soldering)Joining | – | – | – | – | – |
| Protective coating of assembliesSurface treatment | – | – | – | – | – |
| Potting of assemblies (assembly protection, Glob Top)Surface treatment | – | – | – | – | – |
| In-circuit test: flying probeTesting | – | – | – | – | – |
| In-circuit test: bed-of-nails inlineTesting | – | – | – | – | – |
| Functional testing inlineTesting | – | – | – | – | – |
| Customised functional testingTesting | – | – | – | – | – |
| Panel separation: roller bladeAssembly | – | – | – | – | – |
| Panel separation: double linear bladeAssembly | – | – | – | – | – |
| Panel separation: millingAssembly | – | – | – | – | – |
| Panel separation: laser separationAssembly | – | – | – | – | – |
| Module assembly (integration of the PCB into a module)Assembly | – | – | – | – | – |
| Customised packaging, labelling and deliveryAssembly | – | – | – | – | – |
| Transparent project managementEngineering | – | – | – | – | – |
5 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMD placement machine (Pick & Place) | FUJI NXT3 | – | in practice up to 100,000 components/h | – | Unterstadion |
| AOI 3D system (Automated Optical Inspection) | KohYoung | – | – | – | Unterstadion |
| Central line computer | ASYS | – | – | – | Unterstadion |
| Component programming machine (all component types) | – | – | over 500,000 components/year | – | Unterstadion |
| SMD production line (paste printing, placement, reflow, AOI) | – | 3 | – | – | Unterstadion |
Additional services
Quality & Certification
99.7% of the electronic components manufactured in Unterstadion are already defect-free in the first process run; every process step and every component is traceable at all times (100% traceability). Testing is performed inline via 3D AOI, flying probe, bed-of-nails and functional testing.
| Evidence | Unterstadion |
|---|---|
| DIN EN ISO 9001 | |
| DIN EN ISO 14001 |
History
- 1977
Company founded in Unterstadion as an EMS specialist; subsidiary of the Leuze Group.
- 2022
Revenue around €64.5 million; processing of over 320 million SMDs and approx. 10 million THT components; average production growth of 17% p.a. over ten years.
- 2025
Revenue over €45 million according to the website.