Laser wafer dicing in liquids: precise, burr-free separation of semiconductor wafers using LidroCUT® technology.
Lidrotec GmbH
BochumNew on Amplifa
About Lidrotec
Lidrotec GmbH is a laser technology company founded in 2021 in Bochum and the first company to offer wafer dicing with lasers in liquids. The patented LidroCUT® process combines an ultrafast pulsed laser with specially developed liquids that efficiently cool the workpiece, remove nano- and microparticles, and optimize laser ablation. This produces burr-free, sharp cut edges without microcracks and without particle deposits – regardless of the material. The range of services includes dicing, scribing, grooving, trimming, structuring and functionalization as well as feasibility studies, demonstrations and contract manufacturing; since the end of 2023, turnkey machines have also been delivered. Target industries are the semiconductor, energy, medical, electronics and materials science sectors. The company is based in Bochum and delivers its machines worldwide.
- Site
- Bochum
- Processes
- Wafer Dicing (Laser Dicing in Liquids, LidroCUT®), Scribing, Grooving, Trimming, Structuring, Functionalization, Tape Frame Application, Feasibility studies / demonstrations / job shop (contract manufacturing of laser processing in
- Materials
- Silicon (Si), Silicon carbide (SiC), Gallium arsenide (GaAs), Indium phosphide (InP), Composite systems (various materials), All materials (material independence), Laser Dicing in Liquids (LidroCUT®)
- Founded
- 2021
- Industries
- Semiconductors, Energy, Medical, Electronics, Materials science
- 01
Feasibility study / demonstration
- 02
Laser processing in liquids (LidroCUT®)
- 03
Dicing / scribing / grooving / trimming / structuring
- 04
Surface cleaning by liquid
- 05
Contract manufacturing or turnkey machine delivery
Materials & Processes
Silicon (Si)
Standard wafer material; higher yield and narrower kerf widths when dicing.
Silicon carbide (SiC)
Brittle material that can be separated with LidroCUT® without scrap due to microcracks.
Gallium arsenide (GaAs)
Semiconductor material for gentle separation using the liquid process.
Indium phosphide (InP)
Semiconductor material for gentle separation using the liquid process.
Laser Dicing in Liquids (LidroCUT®)
Ultrafast pulsed laser with controlled liquids for burr-free, particle-free cuts without heat input.
Sites
Bochum
DEHeadquarters, manufacturing and development
- Materials
- Si, SiC, GaAs, InP
- LidroCUT® wafer dicing machine (laser processing in liquids, ultrafast pulsed laser)
Components & Applications
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Wafer Dicing (Laser Dicing in Liquids, LidroCUT®)Machining | – | – | – | – | Si, SiC, GaAs, InP, Semiconductor wafers (all materials) |
| ScribingMachining | – | – | – | – | Si, SiC, GaAs, InP |
| GroovingMachining | – | – | – | – | Si, SiC, GaAs, InP |
| TrimmingMachining | – | – | – | – | Si, SiC, GaAs, InP |
| StructuringMachining | – | – | – | – | all materials |
| FunctionalizationSurface | – | – | – | – | all materials |
| Tape Frame ApplicationAssembly | – | – | – | – | – |
| Feasibility studies / demonstrations / job shop (contract manufacturing of laser processing inEngineering | – | – | – | – | Si, SiC, GaAs, InP |
1 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Wafer dicing machine (LidroCUT®, laser processing in liquids, ultrafast pulsed laser) | Lidrotec LidroCUT® | – | – | – | Bochum, Germany |
Additional services
History
- 2021
Founded in Bochum by laser technology experts; first company to offer wafer dicing with lasers and liquids.
- 2023
Delivery of the first turnkey machines from the end of 2023.