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Lightium – Fertigung

Foundry for photonic integrated circuits based on thin-film lithium niobate (TFLN) - from MPW to volume production.

Lightium Logo

Lightium AG

Schlieren (CH)New on Amplifa

Schlieren, SwitzerlandLocation
AGLegal form
200 mm WaferWafer size / Annual high-volume capacity

About Lightium

Lightium AG is a photonic foundry based in Schlieren (Switzerland) that manufactures photonic integrated circuits (PICs) based on thin-film lithium niobate (TFLN). The company offers foundry services ranging from rapid prototyping and multi-project wafer (MPW) runs to volume production on 200-mm wafers in a high-volume foundry environment. The TFLN platform is characterized by light modulation at over 100 GHz, low-voltage operation (Vπ ≤ 1 V) and a broad transparency window from 350 to 5,500 nm. The Process Design Kit (PDK) is available in four wavelength bands (C-band, O-band, 780 nm, 830 nm). Partners include PHIX (photonic packaging), MPI Corporation and Axiomatic_AI (AI-assisted PIC testing). Target industries are photonics, telecommunications and semiconductors.

Site
Schlieren
Processes
Thin-Film Lithium Niobate (TFLN) photonics manufacturing (foundry services, rapid prototyping to, TFLN foundry services (MPW to volume production), Prototyping, PIC testing (in partnership), Photonic packaging (in partnership)
Materials
Thin-Film Lithium Niobate (TFLN), Thin-Film Lithium Niobate (LiNbO3)
Industries
Photonics, Photonic Integrated Circuits (PICs), Telecommunications, Semiconductors
  1. 01

    PDK & Design Support

  2. 02

    Prototyping / MPW

  3. 03

    TFLN Wafer Fabrication (200 mm)

  4. 04

    PIC Testing (Partnership)

  5. 05

    Photonic Packaging (Partnership)

  6. 06

    Volume Production

Materials & Processes

TFLN

Thin-Film Lithium Niobate (LiNbO3)

Thin-film lithium niobate as a platform material for high-performance photonic integrated circuits with modulation at over 100 GHz and a transparency window of 350–5,500 nm.

Locations

Schlieren

CH

Headquarters and Foundry (Manufacturing)

Part weight / size
200 mm wafer
Lot size
Prototypes/MPW to volume production
Materials
Thin-Film Lithium Niobate (TFLN)

Industries

PhotonicsPhotonic Integrated Circuits (PICs)TelecommunicationsSemiconductors

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
Thin-Film Lithium Niobate (TFLN) photonics manufacturing (foundry services, rapid prototyping toSemiconductor/Photonics Manufacturing–200 mm wafer––Lithium niobate (LiNbO3), thin-film

Additional services

TFLN foundry services (MPW to volume production)PrototypingPIC testing (in partnership)Photonic packaging (in partnership)

Reference customers

PHIXMPI CorporationAxiomatic_AI

History

  1. 2025

    Won the Final Stage of the Swiss foundation program Venture Kick

  2. 2025

    Cooperation with PHIX for photonic packaging

  3. 2025

    Strategic partnership with MPI Corporation and Axiomatic_AI for AI-assisted PIC testing

  4. 2025

    Secured participation in the INGENIOUS consortium (€7.6 million) for the integration of lasers and detectors into TFLN PICs

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