Adhesive tapes and machines (Adwill) for semiconductor back-end manufacturing – Tape x Equipment from Munich.
LINTEC Advanced Technologies (Europe) GmbH
Munich · DresdenNew on Amplifa
About LINTEC Europe
LINTEC Advanced Technologies (Europe) GmbH is a total solution provider for semiconductor back-end manufacturing headquartered in Munich with a branch office in Dresden. Under the Adwill product brand, the portfolio includes dicing tapes, backgrinding tapes, backside coating tapes and dicing die bonding tapes, as well as fully and semi-automatic laminators, peelers, wafer mounters and UV irradiation systems. The solutions are aimed at the processing of silicon wafers as well as advanced materials such as SiC and GaN. From R&D through design and consulting to production, LINTEC offers everything from a single source; machines can be highly customized – around 99% of delivered systems are bespoke units. A showroom with machines for training and process development is available in Munich. The Europe GmbH is part of the Japanese LINTEC Corporation, a comprehensive manufacturer of adhesive-related products with 5,311 employees, group revenue of ¥316 billion and an export ratio of 64%.
- Site
- Munich
- Processes
- Dicing tapes (dicing die bonding tapes), Backgrinding tapes (wafer thinning support), Backside coating tapes (thermal conductive backside coating), Heat-Resistant Tape, Anti-ESD Dicing Tape, Pattern Coating Before Lamination (PCBL) – resin coating for back grinding, Wafer mounting (laminating tape onto wafer), Individually tailored solutions for semiconductor back-end manufacturing
- Materials
- Silicon wafers, SiC (silicon carbide), GaN (gallium nitride)
- Certificates
- ISO 9001
- Employees
- 5311
- Industries
- Semiconductor industry, Power electronics, SiC/GaN semiconductors
- 01
R&D
- 02
Design
- 03
Consulting
- 04
Production
- 05
Machine customizing
- 06
Training and process development in the showroom
- 07
Customer service and technical support
Products and Processes
Silicon wafers
Base material for dicing, backgrinding and backside coating tapes as well as wafer mounting.
SiC (silicon carbide)
Advanced semiconductor material specifically supported by the wafer mounter RAD-2510F/8.
GaN (gallium nitride)
Advanced semiconductor material specifically supported by the wafer mounter RAD-2510F/8.
Locations
Munich
DEHeadquarters/Branch office
- Materials
- Silicon wafers, SiC, GaN
- Fully-Automatic Wafer Mounter RAD-2510F/8
- Wafer Mounter RAD-2500 series
- Laminators (fully and semi-automatic)
- Peelers
- UV irradiation systems
- Showroom for training and process development
Dresden
DEBranch office/Office
Products
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Dicing tapes (dicing die bonding tapes)Joining | – | – | – | – | Silicon wafers |
| Backgrinding tapes (wafer thinning support)Machining | – | – | – | – | Silicon wafers |
| Backside coating tapes (thermal conductive backside coating)Surface | – | – | – | – | Silicon wafers |
| Heat-Resistant TapeOther | – | – | – | – | – |
| Anti-ESD Dicing TapeJoining | – | – | – | – | – |
| Pattern Coating Before Lamination (PCBL) – resin coating for back grindingSurface | – | – | – | – | Silicon wafers |
| Wafer mounting (laminating tape onto wafer)Joining | – | – | – | – | Silicon wafers, SiC, GaN |
5 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Fully-Automatic Wafer Mounter | LINTEC RAD-2510F/8 | – | – | – | Munich |
| Wafer Mounter | LINTEC RAD-2500 series | – | – | – | – |
| Laminators (fully and semi-automatic) | LINTEC (Adwill) | – | – | – | – |
| Peeler | LINTEC (Adwill) | – | – | – | – |
| UV irradiation systems | LINTEC (Adwill) | – | – | – | – |
Additional services
Quality
The machines are state of the art and highly customizable; Tape x Equipment is in use in every modern fab in Europe. Quality and adherence to delivery dates are regularly confirmed by customers.
| Evidence | Munich | Dresden |
|---|---|---|
| ISO 9001 |
History
- 2022
Foundation of the Bavarian Chips Alliance, of which LINTEC is a member (June 2022)