Supplier of production materials, plasma surface activation, cleaning and marking solutions for electronics manufacturing
Löhnert Industriebedarf
Nuremberg (DE)New on Amplifa
About us
Löhnert Industriebedarf has been a partner to the medium-sized electronics industry since 2003 and is based in Nuremberg. The company is a specialist in SMD, THT and thick-film technology and distributes high-quality production materials from globally leading manufacturers. The portfolio includes technological consulting for the introduction and implementation of circuit production materials, plasma surface activation and fine cleaning (including with cold-active handheld plasma devices in PDD technology), manual cleaning including stencil cleaning, labeling and marking solutions as well as temperature and climate monitoring. Represented partner companies include relyon plasma, IDENTCO, Christian Koenen GmbH, Testo, TSC, Vliesstoff Kasper and PrintCB (conductive copper inks for printed electronics). Customers include companies from the automotive supply industry, telecommunications, the military and aerospace industry as well as industrial electronics and medical technology.
- Site
- Nuremberg
- Processes
- SMD assembly (component placement, SMD technology), THT assembly (component placement, THT technology), Bare-die assembly, Production of circuit carriers in organic thick-film technology, Production of circuit carriers in inorganic thick-film technology, Plasma surface activation and fine cleaning (surface pretreatment), Plasma activation for 3D printing surfaces, Manual cleaning (including stencil cleaning for the electronics industry)
- Materials
- Copper, Plastic, Glass, Ceramic, Carbon Nanotubes (CNT), Metals, Paper, Vinyl
- Certificates
- DIN EN ISO 9001:2008 (QM system), ISO 9001
- Founded
- 2003
- Industries
- Electronics industry, Automotive supply industry, Telecommunications, Military and aerospace industry, Industrial electronics, Medical technology
- 01
Technological consulting
- 02
Procurement/distribution of production materials
- 03
Surface activation (plasma)
- 04
Cleaning (manual, stencil cleaning)
- 05
Marking and labeling
- 06
Temperature/climate monitoring
Materials and processes
Conductive Copper Inks
Printing inks with copper particles for producing electrical conductor tracks and contacts as an alternative to silver inks in printed electronics.
Copper
Functional, electrically and thermally conductive copper coatings on plastic, ceramic, glass and carbon nanotubes.
Plastic
Substrate material for printed electronics, plasma activation and marking materials.
Glass
Substrate for copper electrodes (e.g. smart glass, displays) as well as treatment material for plasma activation.
Ceramic
Substrate for conductive and thermally conductive copper coatings as well as thick-film technology.
Carbon Nanotubes (CNT)
Material for solutions in the field of sensors and heating elements in printed electronics.
Polyester/Film
Label materials for thermal transfer printing and marking applications.
Locations
Nuremberg
DEHeadquarters
- Materials
- Electronic components, printed circuit boards, copper inks, marking materials
- PZ2 piezobrush (handheld plasma device, PDD technology, relyon plasma)
- PZ3 piezobrush (handheld plasma device, <50 °C, 18 W)
- Thermal imaging camera testo 880
- Automatic print and labeling system Hermes+ (IDENTCO)
- Electronic label dispenser ELD
- Thermal transfer desktop printer TC series (TSC)
- Thermal direct printer TDP-225 / TDP-324 (TSC)
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMD assembly (component placement, SMD technology)Assembly | – | – | – | – | Electronic components, Printed circuit boards |
| THT assembly (component placement, THT technology)Assembly | – | – | – | – | Electronic components, Printed circuit boards |
| Bare-die assemblyAssembly | – | – | – | – | Semiconductors (bare die) |
| Production of circuit carriers in organic thick-film technologyEngineering | – | – | – | – | – |
| Production of circuit carriers in inorganic thick-film technologyEngineering | – | – | – | – | – |
| Plasma surface activation and fine cleaning (surface pretreatment)Surface | – | – | – | – | Glass, Plastic, Metals, Ceramic |
| Plasma activation for 3D printing surfacesSurface | – | – | – | – | – |
| Manual cleaning (including stencil cleaning for the electronics industry)Surface | – | – | – | – | – |
| Laser cutting of SMD stencils (precision metal stencils)Joining | Positioning accuracy in the micrometer range | – | – | – | Metal (stencil material) |
| Precision screen printing (technical screen printing for electronics, solar and thick-filmJoining | – | – | – | – | Glass, Displays |
| Photoplot and high-precision technology (masks and printing originals)Engineering | Positioning accuracy in the micrometer range | – | – | – | – |
| Printed electronics with conductive copper inks (printing of conductor tracks/components)Joining | – | – | – | – | Plastic, Glass, Ceramic, Carbon Nanotubes (CNT) |
| Functional copper coatings (electrically/thermally conductive)Surface | – | – | – | – | Plastic, Ceramic, Glass, Carbon Nanotubes (CNT) |
| Thermal transfer printing / labeling (marking products)Assembly | – | – | – | – | Paper, Vinyl, Acetate, Polyester, Film |
| Precision die cutting (precision stamped parts, graphic overlays, nameplates)Machining | – | – | – | – | – |
| Monitoring and documentation of climate and temperature data (quality assurance)Testing | – | – | – | – | – |
| Industrial thermography (thermal imaging inspection, infrared thermography)Testing | – | – | – | – | – |
9 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Handheld plasma device (cold-active plasma, PDD technology) | relyon plasma PZ2 piezobrush | – | – | – | Nuremberg |
| Handheld plasma device (cold-active plasma, <50°C, 18 W) | relyon plasma PZ3 piezobrush | – | – | – | Nuremberg |
| Handheld plasma device in PDD technology | relyon plasma | – | – | – | Nuremberg |
| Thermal imaging camera | Testo testo 880 | – | Minimum focusing distance 10 cm; temperature resolution < 0.1 °C | – | Nuremberg |
| Automatic print and labeling system | IDENTCO Hermes+ Series | – | Print widths 54.2 to 168 mm | – | Nuremberg |
| Electronic label dispenser | IDENTCO ELD | – | – | – | Nuremberg |
| Thermal transfer desktop printer | TSC TC series | – | Label width up to 112 mm; print speed up to 152 mm/s | – | Nuremberg |
| Thermal direct printer (2-inch) | TSC TDP-225 | – | Print speed 127 mm/s; 203 dpi | – | Nuremberg |
| Thermal direct printer | TSC TDP-324 | – | Print speed 102 mm/s; 300 dpi | – | Nuremberg |
Additional services
Quality
The introduction of a quality management system according to DIN EN ISO 9001:2008 is intended to integrate the company's services into a documented system and promote customer-oriented improvements. Testing and metrology equipment includes thermal imaging cameras (temperature resolution below 0.1 °C) as well as systems for monitoring and documenting climate and temperature data.
| Evidence | Nuremberg |
|---|---|
| ISO 9001 |
History
- 2003
Foundation as Löhnert Industriebedarf; establishment as a partner to the medium-sized electronics industry.
Introduction of a quality management system according to DIN EN ISO 9001:2008.