Design House for optical sensors: CMOS image sensors, neuromorphic sensors, TOF and X-ray ROIC design with production transfer.
Lumeriz
ZurichNew on Amplifa
About Lumeriz
Lumeriz is a design house based in Zurich that develops advanced optical sensors for intelligent image processing. Its service portfolio covers the design of CMOS image sensors (rolling and global shutter), neuromorphic vision sensors, time-of-flight depth sensors, and optoelectronic readout ICs for X-ray, infrared, thermal and photon-counting applications. Its work ranges from pixel, analog and digital circuit design to optical design and signal-chain simulation through to fabrication-ready layouts. In addition, the company offers custom co-design and system integration, module integration, algorithm and SDK development, as well as turnkey solutions including camera tuning and firmware optimization. Packaging, calibration and transfer to mass production are handled through a manufacturing network. Target industries are automotive, medical technology, robotics, consumer technology, AIoT, mobile, smart home and XR.
- Site
- Zurich
- Processes
- CMOS Image Sensor Design (Rolling Shutter / Global Shutter), Neuromorphic Vision Sensor (NVS) Design, Time-of-Flight Depth Sensor Design (iToF/dToF, NIR), Optoelectronic ROIC Design (X-ray, Infrared, Thermal, Photon Counting), Pixel, Analog and Digital Design / Optical Design / Signal-Chain Simulation, Custom Co-Design and System Integration (optical/electronic simulation, schematic, layout), Module Integration, SDK Development and Turnkey Solutions, Packaging, Calibration and Mass Production Transfer (via manufacturing network)
- Materials
- CMOS Image Sensor, Neuromorphic Vision Sensor, Time-of-Flight Depth Sensor, Optoelectronic ROIC, 3D Stacking / BSI / Hybrid Bonding, High Dynamic Range (DCG, DAG, DOL)
- Certificates
- Technology Transfer and Qualification
- Founded
- 2023
- Industries
- Automotive, Medical Technology, Robotics, Consumer Technology, AIoT, Mobile
- 01
Sensor Design and Architecture
- 02
Custom Co-Design and System Integration
- 03
Module Integration and SDK Development
- 04
Packaging and Calibration
- 05
Transfer to Mass Production
Technologies and Processes
CMOS Image Sensor
Design of rolling- and global-shutter sensors with high resolution and low noise.
Neuromorphic Vision Sensor
Microsecond capture of motion and scene changes with very low power consumption.
Time-of-Flight Depth Sensor
Active NIR measurement for real-time 3D perception with millimeter precision.
Optoelectronic ROIC
Ultra-low-noise readout ICs for X-ray, infrared, thermal and photon-counting applications.
3D Stacking / BSI / Hybrid Bonding
Stacked BSI architectures improve quantum efficiency, light sensitivity and readout speed.
High Dynamic Range (DCG, DAG, DOL)
Techniques for image capture with more than 120 dB of dynamic range.
Sites
Zurich
CHDesign and Development Center
- Lot size
- Prototype to series production
- Materials
- CMOS image sensors, NVS, TOF, ROIC
- R&D pixel/analog/digital design
- Signal-chain simulation
- Optical testing
- Camera tuning
Sensors and Modules
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| CMOS Image Sensor Design (Rolling Shutter / Global Shutter)Engineering | – | – | – | – | Silicon (chip design) |
| Neuromorphic Vision Sensor (NVS) DesignEngineering | – | – | – | – | – |
| Time-of-Flight Depth Sensor Design (iToF/dToF, NIR)Engineering | – | – | – | – | – |
| Optoelectronic ROIC Design (X-ray, Infrared, Thermal, Photon Counting)Engineering | – | – | – | – | – |
| Pixel, Analog and Digital Design / Optical Design / Signal-Chain SimulationEngineering | – | – | – | – | – |
| Custom Co-Design and System Integration (optical/electronic simulation, schematic, layout)Engineering | – | – | – | – | – |
| Module Integration, SDK Development and Turnkey SolutionsAssembly | – | – | – | – | – |
| Packaging, Calibration and Mass Production Transfer (via manufacturing network)Surface | – | – | – | – | – |
| 3D Stacking / BSI Architecture / Hybrid Bonding (technology portfolio)Joining | – | – | – | – | – |
Additional services
Quality
Quality assurance includes system-level testing, optical testing, camera tuning, calibration, as well as technology transfer and qualification for mass production via the manufacturing network.
| Evidence | Zurich |
|---|---|
| Technology Transfer and Qualification |
History
- 2023
Founded in Zurich