Manufacturer of RFID transponders, inlays and labels for LF, HF/NFC and UHF (RAIN RFID) with its own antenna production in the Czech Republic.
LUX-IDent s.r.o.
Lanškroun, Czech RepublicNew on Amplifa
Company Profile
LUX-IDent s.r.o. is a manufacturer of RFID transponders based in Lanškroun, Czech Republic, active in the market since 2002 and, since November 2019, 100 % owned by HID Global. The core competence lies in the production of RFID inlays in the frequency bands 125 kHz (LF), 13.56 MHz (HF incl. NFC) and 868–915 MHz (UHF, RAIN RFID). The antenna technologies include air-coil winding (diameter 5–120 mm), wire embedding technology for HF antennas as well as etched antennas for HF/NFC and UHF inlays and labels. In addition, chip encoding, inkjet printing, laser engraving, ultrasonic welding, digital die-cutting with a CNC flatbed cutter and potting technology are offered; contract manufacturing of plastic parts and OEM design are also part of the service portfolio. Customers come from industries such as animal identification, access control, industry and logistics, payment/eID as well as transport and ticketing. The products are mainly exported to EU countries, with a growing customer base in the USA and Canada.
- Site
- 563 01 Lanškroun
- Processes
- Coil winding (air-coil technology) for RFID inlays, non-encapsulated transponders, diameter, Wire embedding technology for HF antennas, mainly pre-laminates for, Etched antenna technology for HF (incl. NFC) and UHF (RAIN RFID) inlays & labels, Ultrasonic welding of plastic parts, hermetic sealing possible, Digital cutting (CNC flatbed cutter, 3-axis, accuracy 10⁻³ mm), milling for thicker, Potting (sealing RFID chip in plastic compound), Printing personalization (inkjet printing, high-resolution full-color printing, also on uneven, Laser engraving for key fobs and wristbands
- Materials
- PVC (white, glossy or matt), Copper wire (coil winding / wire embedding), Polished stainless steel (Locket key fob frame), Plastic (contract manufacturing, housings, potting), Potting compound (various temperature ranges), Laminated base materials (digital cutting, laminate for tags), Etched antenna substrate (HF/UHF inlays & labels), Air-coil technology (coil winding)
- Certificates
- ISO 9001:2015, ISO 14001, RoHS Compliance, REACH Compliance, FSC®, ISO 9001, RoHS, REACH
- Founded
- 2002
- Industries
- Animal identification (Animal ID), Access control & security, Industry & logistics, Payment / eID, Transport & ticketing, Inventory / Asset Management
- 01
OEM design / product development
- 02
Antenna manufacturing (coil winding, wire embedding, etching)
- 03
Chip assembly and encoding
- 04
Encapsulation (potting, ultrasonic welding)
- 05
Personalization (inkjet printing, laser engraving)
- 06
Digital die-cutting
- 07
Assembly and shipping
Technologies and Materials
Air-coil technology (coil winding)
Non-encapsulated transponders with diameters from 5 to 120 mm, also in custom formats.
Wire embedding technology
Since 2015 for large volumes of various HF antennas, mainly as pre-laminates for card manufacturers.
Etched antenna technology
Since 2016 for HF (incl. NFC) and UHF (RAIN RFID) inlays & labels in standard and custom designs.
PVC (white, matt or glossy)
Base material for contactless cards in ISO 7810/7816 format, optionally with magnetic stripe.
Potting technology
Potting compounds in various temperature ranges for the production of robust RFID tags for industrial applications.
Polished stainless steel
Frame material for the 'Locket' key fob.
Locations
Lanškroun
CZProduction and administration (Tovární 368)
- Lot size
- Samples, small series up to large series
- Materials
- Copper wire, plastic, PVC, etched antenna substrates, semiconductor chips
- CNC flatbed cutter (3-axis, accuracy in the 10⁻³ mm range)
- High-resolution inkjet printers
- Laser engraving machine
- Ultrasonic welding machine
- Coil winding machines (air coils, 5–120 mm)
- Wire embedding system
- Production line for etched antennas
- Potting system
Products
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Coil winding (air-coil technology) for RFID inlays, non-encapsulated transponders, diameterEngineering | – | 120 mm (diameter) | – | Small series and large series | Copper wire, Plastic (pre-laminated inlays) |
| Wire embedding technology for HF antennas, mainly pre-laminates forEngineering | – | – | – | Large volumes | Copper wire, Plastic |
| Etched antenna technology for HF (incl. NFC) and UHF (RAIN RFID) inlays & labelsEngineering | – | – | – | – | Etched antenna substrate, Plastic |
| Ultrasonic welding of plastic parts, hermetic sealing possibleJoining | – | – | – | – | Plastic |
| Digital cutting (CNC flatbed cutter, 3-axis, accuracy 10⁻³ mm), milling for thickerMachining | – | – | – | – | Laminated base materials, Plastic, Paper/film (labels) |
| Potting (sealing RFID chip in plastic compound)Surface | – | – | – | – | Plastic, Potting compound |
| Printing personalization (inkjet printing, high-resolution full-color printing, also on unevenSurface | – | – | – | – | Plastic, Card material, Uneven surfaces, Rounded edges |
| Laser engraving for key fobs and wristbandsSurface | – | – | – | – | Plastic, Metal (polished stainless steel for Locket key fob) |
| Chip coding (writing data into programmable chip memory, UID reading)Assembly | – | – | – | – | Semiconductor chips, Chip modules (MOA2, MOA4, MOB4, MOB6, MCC2, MCC8, NOA3, |
| OEM design (product development, test phases, custom products, contract manufacturing ofEngineering | – | – | – | – | Plastic |
| In-house machine designEngineering | – | – | – | – | – |
| Research & Development (machine development, materials research, technology)Engineering | – | – | – | – | – |
| Production of white contactless cards (ISO 7810, 7816, clamshell format, matt or glossy,Assembly | – | – | – | – | PVC (white) |
| Assembly of RFID transponders, inlays and labels in 125 kHz (LF), 13.56 MHz (HF incl. NFC) andAssembly | – | – | – | Samples and small series up to large | Copper wire, Plastic, Etched antenna substrate, PVC, Semiconductor chips |
8 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| CNC flatbed cutter (digital cutting plotter, 3-axis, accuracy 10⁻³ mm) | – | – | – | – | Lanškroun, Czech Republic |
| Inkjet printers (high-resolution, full-color printing) | – | – | – | – | Lanškroun, Czech Republic |
| Laser engraving machine | – | – | – | – | Lanškroun, Czech Republic |
| Ultrasonic welding machine | – | – | – | – | Lanškroun, Czech Republic |
| Coil winding machines (air-coil technology, diameter 5–120 mm) | – | – | Diameter 5–120 mm | – | Lanškroun, Czech Republic |
| Wire embedding system | – | – | – | 2015 (impl | Lanškroun, Czech Republic |
| Etched antenna production line (HF/UHF inlays & labels) | – | – | – | 2016 (impl | Lanškroun, Czech Republic |
| Potting machine / potting technology | – | – | – | – | Lanškroun, Czech Republic |
Additional services
Quality & Certificates
All manufacturing processes are consolidated in one plant in Lanškroun, which enables strict process and quality control from base material to finished product. The company is certified to ISO 9001 and ISO 14001 and demonstrates compliance with RoHS, REACH, FSC, PFAS and POP.
| Evidence | Lanškroun |
|---|---|
| ISO 9001 | |
| ISO 14001 | |
| RoHS | |
| REACH | |
| FSC® |
History
- 2002
Market entry in the RFID transponder market as a family business in Lanškroun, building on the long tradition of the electronics industry at the site.
- 2015
Introduction of wire embedding technology for the series production of HF antennas.
- 2016
Expansion of production capacities with etched antenna technology for HF/NFC and UHF inlays and labels.
- 2019
HID Global acquires 100 % of the shares of LUX-IDent in November.