Development and industrialization of power semiconductor packages and modules from idea to series production
Lynx Packaging Technologies
New on Amplifa
About Lynx Packaging Technologies
Lynx Packaging Technologies specializes in advanced power semiconductor packaging & assembly and supports customers from concept to mass production. The service portfolio includes package and process design for plastic and molded modules, heatsinks and discrete packages, complemented by FEM simulations (mechanical, electrical, thermal, RLC, CFD) as well as behavior and lifetime simulation according to mission profile. Manufacturing employs processes such as Ag/Cu sintering, large-area soldering and sintering, and high-performance bonding materials; cooling is done directly via pin fins or indirectly via thermal interface material. PCB-embedded die packaging and prototyping with frontend/backend compatibility (CPI) are also part of the offering. Target industries are e-mobility, AI & datacenter as well as industrial & renewable applications with SiC, GaN and IGBT modules. The company cites over 30 years of R&D experience in thermal management, assembly and testing.
- Processes
- Package and Process Design (Plastic modules, Molded modules, Discrete packages), FEM simulation (mechanical, electrical, thermal Rth/Zth/Crosstalk, RLC, CFD), Behavior and lifespan simulation according to mission profile, Ag/Cu sintering, Large area soldering / sintering, High-strength bonding / die attach, Direct cooling (pin fins) and indirect cooling with TIM for heatsinks, liquid/forced air cooling, Prototyping & Industrialization (Frontend/Backend compatibility, CPI)
- Materials
- Silicon carbide (SiC), Gallium nitride (GaN), IGBT (semiconductor), Silver (Ag), Copper (Cu), Thermal Interface Material (TIM), Silicon carbide, Gallium nitride
- Industries
- E-Mobility, AI & Datacenter, Industrial & Renewable, AI & Datacenter
- 01
Package and Process Design
- 02
FEM simulation (mechanical, electrical, thermal, RLC, CFD)
- 03
Behavior and lifetime simulation
- 04
Prototyping & Industrialization
- 05
Ag/Cu sintering, soldering, bonding
- 06
Assembly & Testing
Materials & Processes
Silicon carbide
Semiconductor material for high-performance modules in e-mobility, AI and renewables applications.
Gallium nitride
Semiconductor material for highly efficient power packages.
IGBT
Power semiconductor as the basis for modules and packages.
Silver
Sintering material for the electrical and thermal connection of chips.
Copper
Sintering material and base material for thermal management.
Thermal Interface Material
Used for the indirect cooling of modules with heatsinks.
Packages & Modules
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Package and Process Design (Plastic modules, Molded modules, Discrete packages)Engineering | – | – | – | – | SiC, GaN, IGBT |
| FEM simulation (mechanical, electrical, thermal Rth/Zth/Crosstalk, RLC, CFD)Engineering | – | – | – | – | – |
| Behavior and lifespan simulation according to mission profileEngineering | – | – | – | – | – |
| Ag/Cu sinteringJoining | – | – | – | – | Silver, Copper |
| Large area soldering / sinteringJoining | – | – | – | – | – |
| High-strength bonding / die attachJoining | – | – | – | – | – |
| Direct cooling (pin fins) and indirect cooling with TIM for heatsinks, liquid/forced air coolingSurface | – | – | – | – | – |
| Prototyping & Industrialization (Frontend/Backend compatibility, CPI)Assembly | – | – | – | – | – |
| PCB-embedded die packagingAssembly | – | – | – | – | – |
Additional services
History
Over 30 years of R&D experience in thermal management, assembly & testing