Custom wet process equipment for semiconductor and MEMS manufacturing up to 300 mm wafer size
M-O-T Mikro- und Oberflächentechnik GmbH
Saarbrücken · GermanyNew on Amplifa
About WOLL.Semicon
WOLL.Semicon is the semiconductor brand of M-O-T Mikro- und Oberflächentechnik GmbH within the WOLL.Group. At our Saarbrücken site, we develop and manufacture custom wet process equipment for research, development and series production. The modular systems can be integrated into both existing front-end-of-line (FEOL) and back-end-of-line (BEOL) manufacturing environments. The equipment handles complex wet-chemical processes such as etching, cleaning, electroplating and photoresist processing, and is delivered as manual, semi- or fully automatic systems as well as custom chemical stations. Materials processed include silicon (Si), silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs) and indium phosphide (InP) at wafer sizes up to 300 mm; in addition, the platform enables the electroplated deposition of gold, silver, copper, nickel and further alloys. The systems are aimed at applications in photonics, energy, 5G, microLED, sensor technology and MEMS.
- Site
- Saarbrücken
- Processes
- Wet-chemical etching, Cleaning (wet cleaning), Electroplating / electroplated deposition, Photoresist processing, Custom chemical stations, Custom wet process equipment (manual, semi- and fully automatic), Etching, Cleaning
- Materials
- Silicon (Si), Silicon carbide (SiC), Gallium nitride (GaN), Gallium arsenide (GaAs), Indium phosphide (InP), Gold, Silver, Copper
- Certificates
- Process control
- Industries
- Semiconductors, MEMS, Photonics, Energy, 5G, microLED
- 01
Development of custom wet process equipment
- 02
Manufacturing in Saarbrücken
- 03
Integration into FEOL and BEOL environments
- 04
Process control and support
Materials and Processes
Silicon (Si)
Standard wafer material for wet-chemical etching, cleaning and photoresist processing up to 300 mm.
Silicon carbide (SiC)
Material for power electronics applications in energy and 5G.
Gallium nitride (GaN)
Used for high-frequency and power applications, among others in the 5G sector.
Gallium arsenide (GaAs)
III-V semiconductor material, among others for photonics and sensor technology.
Indium phosphide (InP)
Material for optoelectronic and photonics applications.
Gold
Electroplatable material for metallizations.
Silver
Electroplatable material for conductive layers.
Copper
Electroplated deposition for conductive metallizations.
Nickel
Electroplated deposition for barriers and layers.
Site
Saarbrücken
DEDevelopment and manufacturing of wet process equipment
- Materials
- Si, SiC, GaN, GaAs, InP; Au, Ag, Cu, Ni
- Manual wet process equipment (wet bench)
- Semi-automatic wet process equipment
- Fully automatic wet process equipment
Systems and Equipment
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Wet-chemical etchingSurface | – | – | – | – | Silicon (Si), Silicon carbide (SiC), Gallium nitride (GaN), Gallium arsenide (GaAs), Indium phosphide (InP) |
| Cleaning (wet cleaning)Surface | – | – | – | – | Silicon (Si), Silicon carbide (SiC), Gallium nitride (GaN), Gallium arsenide (GaAs), Indium phosphide (InP) |
| Electroplating / electroplated depositionSurface | – | – | – | – | Gold, Silver, Copper, Nickel, Alloys |
| Photoresist processingSurface | – | – | – | – | – |
| Custom chemical stationsEngineering | – | – | – | – | Silicon (Si), Silicon carbide (SiC), Gallium nitride (GaN), Gallium arsenide (GaAs), Indium phosphide (InP) |
3 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Manual wet process equipment (wet bench) | M-O-T Mikro- und Oberflächentechnik GmbH (WOLL.Semicon) | – | Wafer sizes up to 300 mm | – | Saarbrücken |
| Semi-automatic wet process equipment | M-O-T Mikro- und Oberflächentechnik GmbH (WOLL.Semicon) | – | Wafer sizes up to 300 mm | – | Saarbrücken |
| Fully automatic wet process equipment | M-O-T Mikro- und Oberflächentechnik GmbH (WOLL.Semicon) | – | Wafer sizes up to 300 mm | – | Saarbrücken |
Additional services
Quality and Process Control
Ultra-clean wet bench systems, precise process control and durable components ensure stable processes, high efficiency and low operating costs.
| Evidence | Saarbrücken |
|---|---|
| Process control |