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MediaTek – Fertigung

Fabless semiconductor company developing SoCs and chipsets for smartphones, smart home, automotive, IoT and data centers.

MediaTek Logo

MediaTek Inc.

Hsinchu (TW) · Düsseldorf (DE) · Oulu (FI) · Bangalore (IN) · Tokyo (JP) · SeongNam (KR) · Beijing (CN) · Shanghai (CN)New on Amplifa

1997Founded
Hsinchu, TaiwanHeadquarters
2 bn+ devices/yearDevices Equipped
TWSE: 2454Stock Listing
5th largest fabless semiconductorMarket Position

About MediaTek

MediaTek Inc. (TWSE: 2454) is a fabless semiconductor company founded in 1997 in Hsinchu, Taiwan. The company develops system-on-chip (SoC) solutions for smartphones, smart home and TV devices, automotive applications, IoT, laptops and tablets, as well as data center and connectivity products. According to its own statements, MediaTek is the fifth-largest fabless semiconductor company worldwide, the market leader in smartphone chipsets, and equips more than 2 billion devices annually. The portfolio includes the Dimensity smartphone platforms, Kompanio chips for computing, Filogic Wi-Fi 7 and Wi-Fi 8 platforms, 5G modems, custom ASICs and Edge AI technologies with its own NPU. As a fabless company, MediaTek focuses on chip design and sells its products worldwide to device manufacturers; manufacturing is carried out by external foundry partners. In addition to its headquarters in Hsinchu Science Park, the company maintains offices including in Düsseldorf (MediaTek Germany), Oulu, Bangalore, Tokyo, Seoul, Beijing and Shanghai.

Site
Hsinchu City
Processes
Chip design (SoC), 5G modems, Wi-Fi 7/8 (Filogic), Custom ASICs, Data Center Solutions, Edge AI / NPU (NeuroPilot SDK), Display technologies (MiraVision), Camera ISP (Imagiq)
Materials
System-on-Chip Design, Custom ASICs, Edge AI / NPU (NeuroPilot SDK), 5G Modems (incl. NTN, RedCap), Wi-Fi 7/8 (Filogic)
Founded
1997
Industries
Smartphones, Smart Home / Smart TVs, Automotive, IoT, Laptops & Tablets, Data Center
  1. 01

    System architecture & chip design (SoC)

  2. 02

    IP development (NPU, ISP, modems)

  3. 03

    Verification & validation

  4. 04

    Manufacturing at external foundry partners

  5. 05

    Software/SDK (NeuroPilot, HyperEngine)

  6. 06

    Support & ecosystem partnerships

Technologies & Platforms

SoC

System-on-Chip Design

Highly integrated SoCs for smartphones, smart home, automotive, IoT and computing.

ASIC

Custom ASICs

Custom chips for consumer and data center applications.

NPU

Edge AI / NPU (NeuroPilot SDK)

Proprietary neural processing units for AI processing directly on the device.

Modem

5G Modems (incl. NTN, RedCap)

Modem technologies for cellular connectivity up to satellite communication.

Filogic

Wi-Fi 7/8 (Filogic)

Wi-Fi platforms with Multi-Link Operation and Bluetooth 5.x integration.

Locations

Standort Hsinchu

Hsinchu

TW

Headquarters, chip design

Materials
SoC, ASIC, NPU, Modem

Düsseldorf

DE

Branch office MediaTek Germany

Oulu

FI

Branch office MediaTek Finland

Bangalore

IN

Branch office

Products & Platforms

Dimensity 9600 Pro Smartphone Platform
Dimensity 9600 Pro Smartphone PlatformSoC design · Smartphones
Dimensity CX C10 Max
Dimensity CX C10 MaxSoC design · Laptops & tablets

Inside the production

Dream Faster – brand image
Dream Faster – brand image
Investor Relations
Investor Relations

Industries

SmartphonesSmart Home / Smart TVsAutomotiveIoTLaptops & TabletsData CenterNetworking & ConnectivityCommercial Display

Additional services

Chip design (SoC)5G modemsWi-Fi 7/8 (Filogic)Custom ASICsData Center SolutionsEdge AI / NPU (NeuroPilot SDK)Display technologies (MiraVision)Camera ISP (Imagiq)Gaming technologies (HyperEngine)Venture capital investments (MediaTek Ventures)

Reference customers

NVIDIAGoogle (Googlebook / Dimensity CX C10 Max)

History

  1. 1997

    Founded in Hsinchu, Taiwan

  2. 2001

    Establishment of the MediaTek Foundation (December 2001)

  3. 2022

    Presentation of the Wi-Fi 7 platforms in January

  4. 2023

    Dimensity 9200 as the first chip with ISP-native RGBW sensor support; Dimensity 9200+ awarded 'Best Gaming Smartphone SOC of 2023'

  5. 2024

    4 publications at ISSCC; the only Taiwanese company with an award in 21 consecutive years

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