Development and manufacture of custom superabrasive tools (CBN, diamond) for high-precision grinding applications.
Meister Abrasives AG
Andelfingen (CH) · Industriestrasse 10, CH-8450 AndelfingenNew on Amplifa
About Meister Abrasives
Meister Abrasives AG, headquartered in Andelfingen, Switzerland, develops and manufactures custom superabrasive tools for high-precision grinding applications. The portfolio comprises external and internal grinding wheels, double-disc face grinding wheels, honing stones, dressing tools as well as special solutions for ingot/boule processing and wafer thinning and backgrinding. The tools combine CBN, diamond, aluminium oxide and silicon carbide grains with proprietary ceramic and hybrid bond systems (including HighPerformance, UltraCut, UltraFine, Ceralox, Ceramet, CleanCut, CleanFine, FUSION), which are developed in the company's own laboratory. Tool sizes range from a 1.3 mm bore diameter up to a 1500 mm wheel diameter. Customer industries include automotive, e-mobility, surface coating, medical technology, semiconductors, rolling bearings, aerospace as well as tool and die making. A test and application centre in Andelfingen serves for process optimisation together with customers; more than 200 employees worldwide work for the company.
- Site
- CH-8450 Andelfingen
- Processes
- External grinding (external cylindrical and non-cylindrical grinding: profile plunge grinding, peel, Internal grinding (internal cylindrical grinding), Double-disc face grinding, Hard material machining (grinding of carbide, technical ceramics, CBN, diamond and, Fine machining / honing (honing stones, superfinish), Dressing (stationary and rotating dressing tools, individual and universal), Ingot and boule processing (grinding of SiC boules/silicon ingots for wafer production), Thinning and backgrinding (wafer thinning, coarse grinding Z1 / fine grinding Z2)
- Materials
- Silicon carbide (SiC, 4H-SiC), Silicon, Polysilicon (poly-Si), Sapphire (Al2O3), Gallium nitride (GaN), Indium phosphide (InP), Gallium arsenide (GaAs), Lithium niobate (LiNbO3)
- Certificates
- ISO 9001:2015, ISO 14001:2015
- Founded
- 1951
- Employees
- >200
- Industries
- Automotive, E-mobility, Surface coating, Medical technology, Semiconductors, Rolling bearings
- 01
Custom tool development (engineering)
- 02
In-house bond and grain development in the laboratory
- 03
Manufacture of the superabrasive tools
- 04
Quality inspection (including Renishaw probes)
- 05
Process optimisation and application engineering at the test and application
Grains, bonds and machined materials
Cubic boron nitride (CBN)
Extremely hard and wear-resistant abrasive grain, especially for hardened steels such as 100Cr6.
Diamond
Hardest known abrasive grain for carbide, ceramics, composites and wafer processing.
Aluminium oxide (sintered corundum)
Conventional abrasive grain, among other things in Ceralox technology for series processes.
Silicon carbide grain (SiC)
Abrasive grain for demanding grinding applications.
Ceramic bonds (HighPerformance, UltraCut, UltraFine, Ceralox)
Proprietary bond systems for precise geometries, homogeneous surfaces and high efficiency.
Hybrid bonds (Ceramet, CleanCut, CleanFine, FUSION)
Metal-ceramic matrix systems for high wear resistance and self-sharpening behaviour on extremely hard materials.
Steel (including 100Cr6, 100MnCrW4)
Materials to be machined for internal grinding, double-disc face grinding and fine machining.
Hard materials and semiconductor substrates (SiC, sapphire, GaN, InP, GaAs,
Materials for ingot/boule processing as well as wafer thinning and backgrinding.
Technical ceramics and carbide
Machining with diamond and CBN tools down to surface finishes in the nanometre range.
PEEK (fibre-reinforced), POM
Plastics for double-disc face grinding.
Locations
Andelfingen
CHHeadquarters, R&D and production centre with test and application centre
- Part weight / size
- Tools from 1.3 mm to 1500 mm diameter
- Lot size
- Custom manufacturing
- Materials
- CBN, diamond, aluminium oxide, SiC in ceramic and hybrid bonds
- Test and application centre (grinding test rig, laboratory)
- Precision measurement with Renishaw probe
Product solutions
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| External grinding (external cylindrical and non-cylindrical grinding: profile plunge grinding, peelMachining | – | – | – | – | hardened steels (CBN), carbide, ceramics, composites (diamond) |
| Internal grinding (internal cylindrical grinding)Machining | – | – | – | – | steel, aluminium, ceramics, hardened steels |
| Double-disc face grindingMachining | Ra 10-50 nm (nanometre range) | – | – | – | PEEK (fibre-reinforced), POM, 100MnCrW4 (<20 HRC), 100Cr6 (60 HRC), carbide, SiC, AlOx, BK7 glass |
| Hard material machining (grinding of carbide, technical ceramics, CBN, diamond andMachining | Surface quality down to the | – | – | – | carbide, technical ceramics (oxides, nitrides), CBN, diamond, coated high-performance materials |
| Fine machining / honing (honing stones, superfinish)Surface | – | – | – | – | steel, cast iron, hardened steels (CBN) |
| Dressing (stationary and rotating dressing tools, individual and universal)Machining | – | – | – | – | – |
| Ingot and boule processing (grinding of SiC boules/silicon ingots for wafer production)Machining | – | – | – | – | silicon carbide (SiC), silicon |
| Thinning and backgrinding (wafer thinning, coarse grinding Z1 / fine grinding Z2)Machining | TTV < 2 µm (CleanCut DIA, coarse grinding step) · Ra 0.5–1.0 nm (UltraFine UF6, near | 150 mm (4H-SiC wafer in the poster) | – | – | silicon carbide (SiC), silicon, polysilicon (poly-Si), sapphire (Al2O3), gallium nitride (GaN), indium phosphide (InP), gallium arsenide (GaAs), lithium niobate (LiNbO3), lithium tantalate (LiTa), extremely hard ceramics |
| Manufacture of superabrasive tools: grinding wheels, honing stones and dressing tools with CBN,Engineering | Tool sizes from 1.3 mm bore diameter to 1500 mm | 1500 mm diameter | – | – | CBN, diamond, aluminium oxide, silicon carbide |
| On-site process optimisation and application engineering, test and application centreEngineering | – | – | – | – | – |
1 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Test and application centre (grinding test rig, laboratory) | Meister Abrasives (in-house) | – | – | – | Andelfingen, Switzerland |
Additional services
Quality management
According to the company, quality is a fundamental cornerstone; the process-oriented management system fulfils the requirements of the standards ISO 9001:2015 and ISO 14001:2015 (SQS/IQNET, certificate CH-H10483). Tools are, among other things, verified metrologically using a Renishaw probe.
| Evidence | Andelfingen |
|---|---|
| ISO 9001:2015 | |
| ISO 14001:2015 |
History
- 1951
Founded on 12 September 1951 in Andelfingen by Konrad Meister as a one-person business (import and sale of grinding wheels).
- 1956
Opening of the first branch in Andelfingen, five years after the founding.
- 1961
Establishment of the Swiss production facility; first company in the Western world with ceramic-bonded high-precision grinding wheels.
- 2024
Renewal of the ISO 9001:2015 and ISO 14001:2015 certifications (SQS/IQNET, 22.06.2024).
- 2026
Management handover at ABRAXOS Holding AG: Norbert Kern takes over as CEO of the entire group as of 1 September 2026.