Specialized in precision automation systems for active alignment, micro-assembly, electro-optical testing and laser processing.
nanosystec GmbH
Groß-Umstadt · Newark (CA) · Shenzhen · ChennaiNew on Amplifa
Systems house for micro-precision and laser processing
nanosystec GmbH, headquartered in Groß-Umstadt, develops and manufactures custom precision systems for applications requiring the highest accuracy in joining and micro material processing. The portfolio includes active alignment of opto-electronic components with typical precision below 100 nm, micro-assembly with placement accuracies below 1 µm, electro-optical characterization as well as laser balancing and fine cutting. Joining methods used include micro adhesive bonding with UV curing, laser welding, selective laser soldering, thermode soldering and eutectic bonding. The systems handle components from 0.2 mm in size made of silicon, glass, ceramics, plastics and metals such as stainless steel, Kovar, titanium, brass, aluminium and tungsten. nanosystec supports customers from the feasibility study through to component-specific series production machines, including automation, machine vision and process software (TestMaster). Customers come from space technology, data transmission, automotive, metrology, medical technology, optoelectronics, microelectronics, telecommunications and the semiconductor industry. Since November 2024, nanosystec has been part of the Swedish Addtech Group. In addition to its headquarters in Groß-Umstadt, the company maintains sites in Newark (California), Shenzhen, and a sales partner in Chennai.
- Site
- Groß-Umstadt
- Processes
- Active alignment of opto-electronic components, Micro adhesive bonding with UV curing, Selective laser soldering, Laser welding, Eutectic bonding, Laser fine cutting, Laser ablation (deburring, material removal), Laser balancing (fine balancing by laser ablation)
- Materials
- Stainless steel, Kovar, Titanium alloys, Non-ferrous metals, Brass, Aluminium, Steel, Silicon
- Certificates
- ISO 9001:2008, ISO 9001:2015, ISO 9001
- Industries
- Space technology, Data technology / data transmission, Automotive supply industry, Metrology, Medical technology, Optoelectronics
- 01
Engineering / feasibility study
- 02
Active alignment / micro-assembly
- 03
Laser processing (balancing, fine cutting)
- 04
Electro-optical testing
- 05
Automation and series integration
Processes and Materials
Active Alignment
Positioning of opto-electronic components with precision below 100 nm, fixation by UV adhesive bonding, laser welding or laser soldering.
Micro-Assembly
Passive placement of chips, optics, VCSELs and PICs with accuracy below 1 µm.
Laser Welding
Precision welding of stainless steel, Kovar, titanium alloys and non-ferrous metals, including hermetic seam welding.
Selective Laser Soldering / Thermode Soldering
Joining of tinned components, circuit boards and flex boards with accuracy of 10 µm or better.
Eutectic Bonding
Joining of silicon and photonics chips in micro-assembly stations.
Laser Balancing
Contactless material removal on rotating workpieces; residual unbalance of a few µgmm.
Laser Fine Cutting
Precise cutting and ablation of metal, ceramic and plastic with spot sizes down to 10 µm.
Electro-Optical Testing
Characterization of PICs, VCSELs and silicon photonics wafers up to 300 mm.
Locations
Groß-Umstadt
DEHeadquarters, development and production
- Part weight / size
- Components from 0.2 mm
- Lot size
- Single station to automated series production line
- Materials
- Silicon, glass, ceramics, stainless steel, Kovar, titanium, brass, aluminium, tungsten, plastic
- NanoBalancer
- NanoGlue
- NanoHybrid
- NanoSolder
- NanoTest PIC HD
- NanoTest SiP
- NanoTest VCSEL
- NanoWelder
- VersaCut
- VersaGlue
- VersaHybrid
- VersaSolder
- VersaWeld
Newark (CA)
USSales and service North America
Shenzhen
CNnanosystec Ltd., sales and service China/Hong Kong
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Active alignment of opto-electronic componentsAssembly | < 100 nm | – | – | – | Optics, Optical fibers, Diode lasers, Integrated photonic circuits, VCSEL, Photodiodes, PICs, Modulators, Chips |
| Micro adhesive bonding with UV curingJoining | < 1 µm | – | – | Small series | Glass, Plastic (adhesive), Silicon chips, Photonics components |
| Selective laser solderingJoining | < 1 µm | – | – | – | Solder, Gold/tin alloy, Metal (tinned), Solder paste |
| Laser weldingJoining | < 1 µm | – | – | – | Stainless steel, Kovar, Titanium alloys, Non-ferrous metals, Tungsten |
| Eutectic bondingJoining | – | – | – | – | Silicon, Photonics chips |
| Laser fine cuttingMachining | Spot sizes up to 10 µm in diameter | 110 mm | – | – | Stainless steel, Kovar, Brass, Aluminium, Steel, Silicon, AlN (ceramic), Plastic, Ceramic |
| Laser ablation (deburring, material removal)Machining | Spot sizes up to 10 µm | 110 mm | – | – | Metal, Ceramic, Plastic |
| Laser balancing (fine balancing by laser ablation)Machining | Residual unbalance of a few µgmm | – | – | – | Metal, Plastic, Ceramic |
| Micro-assembly / precise placement of opto-electronic assembliesAssembly | < 1 µm | – | Component size from 0.2 mm | – | Silicon, Photonics chips, Glass, Ceramic, Plastic |
| Optical & electrical characterization (electro-optical testing)Testing | – | 300 mm (wafer) | – | – | Silicon wafers, Photonics chips, VCSEL |
| Thermode soldering (Hot Bar Soldering)Joining | 10 µm or better | – | – | – | Metal, Tinned components, Circuit boards, Flex boards |
| Machine vision (machine vision for process support)Testing | – | – | – | – | – |
| Automation / process automation (handling, feeder systems, robots)Assembly | – | – | – | – | – |
| Development of production concepts / engineering (feasibility study to series production machine)Engineering | – | – | – | – | – |
13 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Laser system for fine balancing (laser balancing) | nanosystec NanoBalancer | 1 | – | – | Groß-Umstadt |
| Laser processing system (cutting/ablation) | nanosystec VersaCut | 1 | Work surface 700 x 900 mm; scan field 110x100 mm | – | Groß-Umstadt |
| Positioning and adhesive bonding station (UV curing) | nanosystec NanoGlue | 1 | – | – | Groß-Umstadt |
| Active alignment and test station (micro joining) | nanosystec NanoHybrid | 1 | – | – | Groß-Umstadt |
| Laser soldering station (selective soldering) | nanosystec NanoSolder | 1 | – | – | Groß-Umstadt |
| Electro-optical test station (PIC) | nanosystec NanoTest PIC HD | 1 | – | – | Groß-Umstadt |
| Wafer test station (silicon photonics) | nanosystec NanoTest SiP | 1 | Wafers up to 300 mm (12 inch) | – | Groß-Umstadt |
| VCSEL test station | nanosystec NanoTest VCSEL | 1 | Wafers up to 150 mm (6 inch) | – | Groß-Umstadt |
| Laser welding station (alignment + welding) | nanosystec NanoWelder | 1 | – | – | Groß-Umstadt |
| Laser soldering and thermode soldering station | nanosystec VersaSolder | 1 | – | – | Groß-Umstadt |
| Micro adhesive bonding station (low-distortion bonding) | nanosystec VersaGlue | 1 | 1000 mm x 1000 mm | – | Groß-Umstadt |
| Micro joining and laser welding station (hybrid) | nanosystec VersaHybrid | 1 | – | – | Groß-Umstadt |
| Laser welding station (universal) | nanosystec VersaWeld | 1 | – | – | Groß-Umstadt |
Additional services
Quality
nanosystec has been ISO 9001 certified since July 2014 (ISO 9001:2015 since August 2017). All process data of the stations is stored and available for evaluations; machine vision supports process monitoring.
| Evidence | Groß-Umstadt |
|---|---|
| ISO 9001 |
History
- 2014
Initial certification according to ISO 9001:2008 (from July 2014).
- 2017
Recertification to ISO 9001:2015 (from August 2017).
- 2024
nanosystec became part of Addtech AB, a Swedish publicly listed technology group (November 2024).
Quadrupling of the production floor space in Groß-Umstadt through relocation.