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EMS provider for electronic assemblies, devices and systems from prototype to series production

P&

P&R Gerätetechnik GmbH

Schwedt/Oder, DENew on Amplifa

1983Founded (as an EAW production facility)
50+Employees
1,800 m²Production area
80+Active customers
High-Mix Low- to Mid-VolumeManufacturing profile

About P&R Gerätetechnik

P&R Gerätetechnik GmbH is an EMS provider (Electronic Manufacturing Services) based in Schwedt/Oder whose production site traces back to a PCB assembly operation established in 1983 by the Elektro-Apparate-Werke Berlin. With more than 50 employees and 1,800 m² of production space, the company manufactures electronic assemblies, systems and devices ranging from the smallest sensor to a battery-powered industrial PC in a 19-inch housing. The service portfolio includes SMT and THT assembly, reflow, wave and selective soldering, conformal coating, potting and overmolding (potting and hotmelt), assembly cleaning, cable assembly, and device assembly (box build) as well as customer-specific testing including burn-in and high-voltage tests. Manufacturing is complemented by design for manufacturing, material procurement, warehousing, logistics and development support from prototypes and pilot series through to series production. Customers include industries such as safety technology, transportation and railway electronics, IoT and metrology, automation, smart energy, communications technology, building technology, medical technology as well as agricultural and forestry machinery; delivery is worldwide.

Site
Schwedt/Oder
Processes
SMT manufacturing (SMD assembly), THT manufacturing (through-hole assembly), Reflow soldering under nitrogen atmosphere, Wave soldering (dual-wave soldering), Selective soldering, Hand soldering, Coating and painting (conformal coating), Potting
Materials
Printed circuit boards (PCB), Metal housings, SMT manufacturing (SMD assembly), THT manufacturing (through-hole assembly), Potting and overmolding (Hotmelt), Coating and painting, Cable assembly, Device assembly and device manufacturing (Box Build)
Certificates
ISO 9001:2015, ISO 14001:2015, IPC standards (CIS qualification)
Founded
1983
Employees
50+
Industries
Safety technology, Transportation technology, IoT and metrology, Agricultural and forestry machinery, Building technology and smart building, Automation
  1. 01

    Design for Manufacturing

  2. 02

    Material procurement and warehousing

  3. 03

    SMT assembly

  4. 04

    Reflow soldering

  5. 05

    THT assembly (wave, selective and hand soldering)

  6. 06

    AOI, X-ray and SPI

  7. 07

    Assembly cleaning

  8. 08

    Coating and painting

  9. 09

    Potting and overmolding

  10. 10

    Device assembly (box build)

  11. 11

    Testing and programming (burn-in, high voltage)

  12. 12

    Logistics incl. customs formalities

Manufacturing Processes

SMT

SMT manufacturing (SMD assembly)

CNC-controlled Siplace placement machines precisely place SMD components onto PCBs printed with solder paste.

THT

THT manufacturing (through-hole assembly)

Wired components are inserted through metallized holes and processed by hand, wave or selective soldering, suitable for mechanically stressed and safety-critical applications.

PCB

Printed circuit boards (PCB)

Base material for all manufactured assemblies in SMT, THT and mixed assembly.

POT

Potting and overmolding (Hotmelt)

Protects assemblies against moisture, vibration, dust, heat and mechanical stress.

COAT

Coating and painting

Conformal coatings increase corrosion resistance and tracking resistance against condensation, moisture and dust.

KC

Cable assembly

Soldering, insertion and crimping technology for cables and stranded wires, for larger volumes also overmolded with plastic.

BOX

Device assembly and device manufacturing (Box Build)

Installation of tested assemblies into housings, including metal and 19-inch enclosures, up to the finished device.

Locations

Schwedt/Oder

DE

Production and administration

Lot size
Prototype to series
Materials
PCBs, SMD and THT components, conformal coatings, potting compounds, cables and stranded wires
  • Siplace SMD placement machines
  • ERSA reflow ovens (nitrogen atmosphere)
  • ERSA wave soldering system
  • ERSA selective soldering systems
  • AOI system
  • X-ray inspection system
  • SPI system
  • Climatic chambers for burn-in tests
  • Painting machine
  • Semi-automated optical assembly and inspection system
  • Electric and torque-controlled screwdrivers

Industries

Safety technologyTransportation technologyIoT and metrologyAgricultural and forestry machineryBuilding technology and smart buildingAutomationTransportation and railway electronicsSmart energyCommunications technologyMedical technology

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
SMT manufacturing (SMD assembly)Joining–––Prototype – SeriesPCBs, SMD components
THT manufacturing (through-hole assembly)Joining–––Prototype/small series – SeriesPCBs, wired THT components
Reflow soldering under nitrogen atmosphereJoining––––Solder paste, PCBs
Wave soldering (dual-wave soldering)Joining––––PCBs, THT components
Selective solderingJoining––––PCBs, THT components
Hand solderingJoining––––PCBs, THT components
Coating and painting (conformal coating)Surface––––electronic assemblies, conformal coatings
PottingPlastics––––assemblies, potting compounds
Overmolding (hotmelt moulding)Plastics––––assemblies, hotmelt plastic
AOI (automated optical inspection)Testing––––electronic assemblies
X-ray inspection (radiographic testing)Testing––––electronic assemblies
SPI (solder paste inspection)Testing––––PCBs with solder paste
Device assembly and device manufacturing (box build)Assembly–––small quantities – Seriesassemblies, housings (incl. metal housings, 19-inch housings)
Testing and programming (functional tests, high-voltage tests)Testing––––electronic assemblies and devices
Burn-in and stress tests in climatic chambersTesting––––electronic assemblies
Assembly cleaningSurface––––electronic assemblies
Cable assembly (soldering, press-fit and crimping technology)Joining–––larger quantitiescables, stranded wires, plastic-overmolded cables
Rework (repair of assemblies)Joining––––electronic assemblies
Material procurement, warehousing and logisticsEngineering––––electronic components and parts
Design for Manufacturing (DFM)Engineering–––––
Prototypes and pilot series (0-series), development supportEngineering–––––
Modular sourcing (assembly/device modules)Engineering–––––
Test concepts and test systems (development and setup)Testing–––––

11 Anlagen & Maschinen

MachineManufacturer / modelQuantityWorking areaYear builtSite
SMD placement machine (pick-and-place)Siplace–––Schwedt/Oder
Reflow ovenERSA–Reflow soldering under nitrogen atmosphere–Schwedt/Oder
Wave soldering systemERSA–––Schwedt/Oder
Selective soldering systemERSAseveral––Schwedt/Oder
AOI system (automated optical inspection)––––Schwedt/Oder
X-ray inspection system (radiographic testing)––––Schwedt/Oder
SPI system (solder paste inspection)––––Schwedt/Oder
Climatic chambers for burn-in tests––––Schwedt/Oder
Painting machine––––Schwedt/Oder
Semi-automated optical assembly and inspection system––––Schwedt/Oder
Electric and torque-controlled screwdrivers (assembly aids)––––Schwedt/Oder

Additional services

SMT manufacturing (SMD assembly)THT manufacturingCoating and paintingPotting and overmolding (potting, hotmelt)AOI, X-ray and SPIDevice assembly / box buildTesting and programming (burn-in, high-voltage tests)Assembly cleaningCable assemblyReworkDesign for ManufacturingMaterial procurementWarehousingLogistics incl. customs formalitiesModular sourcingPrototypes and pilot series (0-series)Test concepts and test systemsDevelopment support

Quality and Environmental Management

Quality management has been certified since 1994 (today ISO 9001:2015 by DQS) and is complemented by IPC standards and the internal qualification of employees as Certified IPC Specialists (CIS). Test technology includes AOI, X-ray, SPI, functional testing, high-voltage testing as well as burn-in and stress tests in climatic chambers.

EvidenceSchwedt/Oder
ISO 9001:2015
ISO 14001:2015
IPC standards (CIS qualification)

History

  1. 1983

    The Elektro-Apparate-Werke Berlin establish a production facility for PCB assembly in Schwedt (Oder).

  2. 1990

    Conversion into a corporation: EAW Berlin GmbH.

  3. 1994

    Introduction of the ISO 9001:1994 quality management system as the first EMS manufacturer in East Germany.

  4. 1996

    Management buy-out by Norbert Rendelmann and Andreas Petzel; renamed P&R Gerätetechnik GmbH.

  5. 2002

    Purchase of the property including the production buildings.

  6. 2009

    Introduction of the IPC standards; IPC qualification of employees as Certified IPC Specialists (CIS).

  7. 2016

    Construction of a new, fully air-conditioned office and production building.

  8. 2020

    Introduction of the ISO 14001 environmental management system.

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