Equipment for Advanced Packaging and Wafer Level Packaging services for the semiconductor industry
PacTech GmbH
Germany · USA · MalaysiaNew on Amplifa
About PacTech
PacTech specializes in Advanced Packaging Equipment and Wafer Level Packaging services for semiconductor manufacturing. The company develops and manufactures machines for processes such as laser soldering, Laser Assisted Bonding, electroless nickel plating (Electroless Plating), solder ball mounting and wire soldering. In addition, PacTech offers WLP services, including electroless and electroplating, copper pillar, redistribution layer (RDL), solder balling, wafer level component assembly, wafer thinning, wafer metal coating, wafer dicing as well as 3D and 3.5D packaging, flip chip, probe card, reballing and SMT. The company also supplies complete electroplating chemistry solutions for process transfer to customers. PacTech is part of the NAGASE Group, is headquartered in Germany and maintains locations in the USA and Malaysia. Target industries include semiconductors, aerospace, automotive, consumer electronics, energy and solar, medical as well as production and assembly.
- Site
- Germany
- Processes
- Laser Soldering, Laser Assisted Bonding, Electroless Plating, Solder Ball Mounting, Wire Soldering, Wafer Level Bumping / Wafer Level Packaging Services, Electroplating, Copper Pillar
- Industries
- Semiconductors, Aerospace, Automotive, Consumer Electronics, Energy and Solar, Medical
- 01
Engineering and development of packaging equipment
- 02
Manufacturing of the equipment product families (SB², Ultra-SB², LAPLACE,
- 03
Wafer Level Packaging services (bumping, plating, assembly)
- 04
Supply of plating chemicals
- 05
Sales and service worldwide
Locations
Germany (headquarters)
DEHeadquarters, development and equipment
- SB²
- Ultra-SB²
- LAPLACE
- PACLINE
USA
USSales and service location
Malaysia
MYSales and service location
Solutions & Equipment
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Laser SolderingJoining | – | – | – | – | – |
| Laser Assisted BondingJoining | – | – | – | – | – |
| Electroless PlatingSurface | – | – | – | – | – |
| Solder Ball MountingAssembly | – | – | – | – | – |
| Wire SolderingJoining | – | – | – | – | – |
| Wafer Level Bumping / Wafer Level Packaging ServicesAssembly | – | – | – | – | – |
| ElectroplatingSurface | – | – | – | – | – |
| Copper PillarAssembly | – | – | – | – | – |
| Redistribution Layer (RDL)Surface | – | – | – | – | – |
| Solder BallingAssembly | – | – | – | – | – |
| Wafer Level Component AssemblyAssembly | – | – | – | – | – |
| Wafer ThinningMachining | – | – | – | – | – |
| Wafer Metal CoatingSurface | – | – | – | – | – |
| Wafer DicingMachining | – | – | – | – | – |
| 3D and 3.5D PackagingAssembly | – | – | – | – | – |
| Flip ChipAssembly | – | – | – | – | – |
| Probe CardTesting | – | – | – | – | – |
| ReballingAssembly | – | – | – | – | – |
| SMTAssembly | – | – | – | – | – |
4 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Advanced Packaging Equipment (SB² product family) | PacTech SB² | – | – | – | – |
| Advanced Packaging Equipment (Ultra-SB² product family) | PacTech Ultra-SB² | – | – | – | – |
| Advanced Packaging Equipment (LAPLACE product family) | PacTech LAPLACE | – | – | – | – |
| Advanced Packaging Equipment (PACLINE product family) | PacTech PACLINE | – | – | – | – |
Additional services
History
Over 30 years of experience in precision engineering in the field of advanced packaging; part of the NAGASE Group