Development and manufacturing of electronic assemblies, infrared remote controls and warning systems
PSE Elektronik GmbH
EggenfeldenNew on Amplifa
About PSE Elektronik
PSE Elektronik GmbH is an electronics company founded in 1972 in Eggenfelden, specializing in EMS services (Electronic Manufacturing Services), electronics development, infrared remote controls and electronic warning systems. In the EMS area, the company manufactures assemblies from single pieces and first articles through small and medium series up to large-scale series, in both SMT and THT mounting. All common printed circuit board materials are processed, from FR4 to Flex to ceramics; the SMT production achieves 17,000 placements per hour with a placement accuracy of 35 µm. The scope of services includes materials management, soldering under inert gas (reflow, vapor phase, selective and wave soldering), cable assembly, coating & potting, assembly and device integration, inspection procedures according to IPC-A-610, as well as after-sales service including repair and obsolescence management. The in-house development department covers hardware and software, schematic/layout design, firmware, device design, test equipment development and EMC pre-compliance testing. Customers come from, among others, sensor and drive technology, medical, building and lighting technology as well as mechanical engineering. The quality management system is certified to DIN EN ISO 9001:2015.
- Site
- Eggenfelden
- Processes
- SMT mounting (electronics manufacturing/EMS), THT mounting (manual & semi-automated), Selective soldering, Wave soldering, Vapor phase soldering, Reflow soldering (under inert gas atmosphere), Assembly mounting / device integration incl. final inspection, Automatic Optical Inspection (AOI)
- Materials
- FR4, Flex (flexible printed circuit board), Ceramic (printed circuit board material), Aluminium (RC05 housing), Lithium (button cell CR2032), Aluminium
- Certificates
- DIN EN ISO 9001:2015, ISO 9001
- Founded
- 1972
- Industries
- Sensor and Drive Technology, Medical Technology, Building Technology, Lighting Technology, Mechanical Engineering, Lifting Platforms
- 01
Electronics development (hardware, software, layout, firmware)
- 02
Prototyping and transfer to series production
- 03
Materials management and logistics
- 04
SMT and THT mounting
- 05
Soldering (reflow, vapor phase, selective and wave soldering)
- 06
Inspection procedures (AOI, MOI, E-tests, functional testing)
- 07
Coating & potting (lacquering, potting, cleaning)
- 08
Assembly and device integration incl. final inspection
- 09
After-sales service (repair, spare parts and obsolescence management)
Materials & PCB Materials
FR4
Standard printed circuit board material for SMT and THT mounting in all lot sizes.
Flex (flexible printed circuit board)
Flexible printed circuit boards for applications with moving or space-critical assemblies.
Ceramic (printed circuit board material)
Ceramic substrates for electronic applications with special thermal requirements.
Aluminium
Housing material of the infrared remote control RC05, anodized in various colors.
Locations
Eggenfelden
DEHeadquarters with development and manufacturing
- Lot size
- Single pieces to large-scale series
- Materials
- FR4, Flex, Ceramic, Aluminium
- SMT line Siemens Siplace (2024)
- SMD placement machine MIMOT MB200 (2015)
- Standalone SMD placement machine (island solution)
- Vapor phase soldering system ASSCON (2024)
- Selective soldering system ERSA Versaflow 4/55 (2020)
- Selective soldering system EBSO
- Wave soldering system
- 3D AOI KohYoung (2017)
- X-ray component counter Technovalley (2021)
- Digital microscope Keyence (2023)
- Nitrogen system
- EMC pre-compliance laboratory
Components & Products
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMT mounting (electronics manufacturing/EMS)Assembly | Placement accuracy 35 µm | – | – | Single pieces – Large-scale series | FR4, Flex (flexible printed circuit boards), Ceramic |
| THT mounting (manual & semi-automated)Assembly | – | – | – | – | FR4, Flex, Ceramic |
| Selective solderingJoining | – | – | – | – | – |
| Wave solderingJoining | – | – | – | – | – |
| Vapor phase solderingJoining | – | – | – | – | – |
| Reflow soldering (under inert gas atmosphere)Joining | – | – | – | – | – |
| Assembly mounting / device integration incl. final inspectionAssembly | – | – | – | – | – |
| Automatic Optical Inspection (AOI)Inspection | – | – | – | – | – |
| Manual Optical Inspection (MOI)Inspection | – | – | – | – | – |
| E-tests (manual and semi-automated, needle adapters, PC software)Inspection | – | – | – | – | – |
| 100% inspection according to IPC-A-610, customer-specific electrical and functional testsInspection | – | – | – | – | – |
| Cable assemblyAssembly | – | – | – | – | – |
| Dip coating and selective coating (conformal coating)Surface | – | – | – | – | – |
| PottingSurface | – | – | – | – | – |
| Cleaning and washing of assembliesSurface | – | – | – | – | – |
| ReworkAssembly | – | – | – | – | – |
| Electronics development (hardware and software, schematic/layout design, firmware, device design)Engineering | – | – | – | – | – |
| Prototyping / prototype construction and transfer to series productionEngineering | – | – | – | – | – |
| EMC pre-compliance testing in the in-house laboratory, thermal cycling and climate testsInspection | – | – | – | – | – |
| Test equipment developmentEngineering | – | – | – | – | – |
| Laser markingSurface | – | – | – | – | – |
| Screen printing process (front foils/labeling)Surface | – | – | – | from 50 pieces | – |
| Manufacturing of infrared remote controls (transmitters and receivers)Assembly | – | – | – | – | Aluminium |
11 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMD placement machine | MIMOT MB200 | 1 | – | 2015 | Eggenfelden |
| 3D AOI (Automatic Optical Inspection) | KohYoung | 1 | – | 2017 | Eggenfelden |
| Selective soldering system | ERSA Versaflow 4/55 | 1 | – | 2020 | Eggenfelden |
| Selective soldering system | EBSO | – | – | – | Eggenfelden |
| Wave soldering system | – | – | – | – | Eggenfelden |
| X-ray component counter | Technovalley | 1 | – | 2021 | Eggenfelden |
| Digital microscope | Keyence | 1 | – | 2023 | Eggenfelden |
| SMT line (placement line) | Siemens Siplace | 1 | – | 2024 | Eggenfelden |
| Vapor phase soldering system | ASSCON | 1 | – | 2024 | Eggenfelden |
| Nitrogen system | – | 1 | – | 2024 | Eggenfelden |
| Standalone SMD placement machine (island solution) | – | 1 | – | – | Eggenfelden |
Additional services
Reference customers
Quality
Every assembly undergoes 100% inspection according to IPC-A-610; in addition, automatic and manual optical inspection, electrical E-tests as well as customer-specific functional and stress tests (thermal cycling, climate tests) are available. The quality management system has been certified multiple times by DEKRA to DIN EN ISO 9001:2015, first in 1994.
| Evidence | Eggenfelden |
|---|---|
| ISO 9001 |
History
- 1972
Foundation of PSE Elektronik GmbH by Peter Schmidt
- 1973
First manufacturing of alarm systems
- 1989
Launch of the infrared business unit
- 1994
Start of SMD mounting in the electronics manufacturing area; first certification to DIN EN ISO 9001
- 2005
Conversion to lead-free production processes under the EU RoHS directive
- 2012
Installation of a photovoltaic system
- 2015
Expansion of the SMD machine fleet: placement machine MIMOT MB200
- 2017
Visual inspection expanded with a 3D AOI from KohYoung
- 2019
Introduction of the EFA SmartSuite software
- 2020
Commissioning of the Versaflow 4/55 selective soldering system from ERSA
- 2021
Purchase of an X-ray component counter from Technovalley
- 2023
Expansion of analysis capabilities through a digital microscope from Keyence; introduction of the Luminovo software
- 2024
Extensive renovation including renewal of the ESD floor; investment in an SMT line (Siemens Siplace) with vapor phase (ASSCON); upgrade of the nitrogen system