Develops and manufactures compact short-pulse DPSS high-power lasers for industrial micromaterial processing.
QUANTEQ GmbH
BerlinNew on Amplifa
About QUANTEQ
QUANTEQ GmbH is a Berlin-based laser technology company that, according to its own statements, develops and manufactures particularly compact short-pulse diode-pumped solid-state (DPSS) high-power lasers for micromaterial processing. The beam sources are available in the wavelengths infrared (1064 nm), green (532 nm), UV (355 nm) and deep-UV (266 nm) and enable applications such as marking, micro drilling, micro cutting, engraving, surface structuring (DLIP), laser annealing, as well as laser lift-off and dicing of displays. With dimensions of 200 x 110 x 33 mm, purely air-cooled operation, optional battery operation and peak powers up to 700 kW, the lasers can also be integrated into confined environments such as fragile robotic systems. Materials processed include metals, plastics, diamond, optical glass, wafers and polyimide film. Customer industries include semiconductors, printed circuit boards/electronics, displays, aerospace, optics, automotive, logistics and packaging, as well as jewelry and healthcare. QUANTEQ cites more than 30 years of experience in laser technology and, in addition to the beam sources, offers OEM integration and custom application samples for customers.
- Site
- Berlin
- Processes
- Laser Micro Marking, Laser Micro Drilling, Laser Micro Cutting, Laser Structuring / DLIP Surface Structuring, Laser Engraving, Laser Annealing (Annealing of Wafers/TFT Displays), Laser Lift-Off (LLO) of OLED/MicroLED Displays, Dicing of Wafers and Displays
- Materials
- Stainless Steel, Metals, Plastics, Diamond, Optical Glass, Polyimide Film, Infrared 1064 nm, Green 532 nm
- Certificates
- Optical and Electrical Metrology, ISO 9001
- Industries
- Semiconductors, Printed Circuit Boards (PCB)/Electronics, Displays, Aerospace, Optics, Automotive
- 01
Development of the laser systems
- 02
Electronics and software development (Fireboard, OEM controllers)
- 03
Assembly and manufacturing of the lasers
- 04
Optical and electrical testing
- 05
OEM integration at the customer
- 06
Creation of custom application samples for customers
Wavelengths & Processed Materials
Infrared 1064 nm
Up to 60 W / 5 mJ and 700 kW peak power, e.g. for marking and engraving of metals and plastics.
Green 532 nm
Up to 35 W / 2 mJ for precise micro drilling and micro cutting including diamond.
UV 355 nm
Up to 20 W / 500 µJ, e.g. for polyimide film cutting and PCB applications.
Deep-UV 266 nm
Up to 10 W / 200 µJ for particularly fine micro structuring and cold ablation.
Stainless Steel
Cutting without carbonization thanks to minimized heat-affected zone.
Metals
Marking, structuring, engraving, drilling and cutting of common metals.
Plastics and Polyimide Film
Laser processing for electronics and packaging applications.
Diamond
Micro cutting and engraving even in hard diamond.
Optical Glass
Cutting, drilling, edge chamfering and DLIP anti-reflective structuring.
Wafers
Marking, dicing, structuring and annealing in semiconductor manufacturing.
Locations
Berlin
DEHeadquarters, development and manufacturing
- Materials
- Metals, plastics, diamond, optical glass, wafers, polyimide
- Q_266 Deep-UV Laser (266 nm)
- Q_355 UV Laser (355 nm)
- Q_532 Green Laser (532 nm)
- Q_1064 Infrared Laser (1064 nm)
Laser Beam Sources
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Laser Micro MarkingSurface | – | – | – | – | Metals, Plastics, Diamond, Glass, Wafers |
| Laser Micro DrillingSurface | – | – | – | – | Metals, Plastics, Diamond, Optical Glass |
| Laser Micro CuttingSurface | – | – | – | – | Metals, Plastics, Diamond, Optical Glass, Polyimide Film |
| Laser Structuring / DLIP Surface StructuringSurface | – | – | – | – | Metals, Plastics, Glass, Wafers |
| Laser EngravingSurface | – | – | – | – | Metals, Plastics, Diamond |
| Laser Annealing (Annealing of Wafers/TFT Displays)Heat Treatment | – | – | – | – | Wafers, Glass |
| Laser Lift-Off (LLO) of OLED/MicroLED DisplaysSurface | – | – | – | – | OLED, MicroLED |
| Dicing of Wafers and DisplaysSurface | – | – | – | – | Wafers, OLED, MicroLED |
| Trimming of Capacitors and ResistorsSurface | – | – | – | – | Capacitors, Resistors |
| Chamfering of Optical Glass EdgesSurface | – | – | – | – | Optical Glass |
4 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Compact High-Power DPSS Short-Pulse Laser Q_266 (266 nm, Deep-UV) | QUANTEQ Q_266 | – | – | – | Berlin |
| Compact High-Power DPSS Short-Pulse Laser Q_355 (355 nm, UV) | QUANTEQ Q_355 | – | – | – | Berlin |
| Compact High-Power DPSS Short-Pulse Laser Q_532 (532 nm, Green) | QUANTEQ Q_532 | – | – | – | Berlin |
| Compact High-Power DPSS Short-Pulse Laser Q_1064 (1064 nm, Infrared) | QUANTEQ Q_1064 | – | – | – | Berlin |
Additional services
Reference customers
Quality
Optical and electrical measurements as well as commissioning of test stations are part of the company's in-house development and testing of the laser systems.
| Evidence | Berlin |
|---|---|
| Optical and Electrical Metrology | |
| ISO 9001 |
History
More than 30 years of experience in laser technology (company statement); previously traded as Compact Laser Solutions GmbH.
Secured Team Global as an investor to accelerate growth.