Vacuum reflow furnaces, quartz tube furnaces and systems for electronic packaging – development, construction and support from a single source.
REK Innovation GmbH
Aschheim/Dornach near MunichNew on Amplifa
About REK Innovation
REK Innovation GmbH is a specialized provider of machinery and systems for electronic packaging, headquartered in Aschheim/Dornach near Munich. Founded in 2020, the company develops and manufactures customized systems for the semiconductor and electronics industries, including vacuum reflow furnaces for void-free soldering on DBC and AMB substrates as well as quartz tube furnaces for thermal processes such as annealing, sintering, alloying, doping and thermal oxidation. REK Innovation covers the entire development process in-house: from mechanical design through software development and electronics design to manufacturing, commissioning and maintenance. The systems are characterized by modular architecture, networked control with certified IT security (Smart Manufacturing & IoT) and 'Made in Germany' manufacturing. Areas of application include power electronics, LED manufacturing, wafer-level packaging, high-reliability printed circuit boards and T/R modules for aerospace. In addition to plant engineering, the company offers technological consulting as well as worldwide service and support.
- Site
- Aschheim/Dornach near Munich
- Processes
- Vacuum reflow soldering, Void-free soldering on DBC or AMB substrates, Annealing, Sintering, Alloying, Doping (diffusion processes), Thermal oxidation (dry and wet), Polyimide imidization / thermal cure
- Materials
- DBC substrates, AMB substrates, Ceramic, Glass, Silicon wafers, Polyimide, Glass frits, Thick-film pastes
- Founded
- 2020
- Industries
- Semiconductor industry, Power electronics, LED manufacturing, Aerospace (T/R modules), Electronics industry / electronic packaging, Electronics industry/electronic packaging
- 01
Consulting and requirements analysis
- 02
Mechanical design
- 03
Software development
- 04
Electronics design
- 05
Manufacturing
- 06
Commissioning at the customer
- 07
Service and maintenance / worldwide support
Materials and Processes
DBC substrates
Carriers for void-free reflow soldering in power electronics.
AMB substrates
Active metal brazed substrates for high-reliability thermal attachment.
Vacuum reflow soldering
Void-free soldering of chips, MEMS, sensors and LEDs onto substrates.
Thermal processes
Annealing, sintering, alloying, tempering and doping in quartz tube furnaces.
Thermal oxidation
Dry and wet oxidation of wafers under controlled atmosphere.
Polyimide imidization / thermal cure
Heat treatment of polyimide for packaging applications.
Glass frit and thick-film paste processes
Processing of glass, ceramic and thick-film materials.
Package sealing
Sealing of ceramic or metal packages against environmental influences.
Machine and plant engineering
Design, software, electronics, manufacturing and commissioning from a single source.
Locations
Aschheim/Dornach near Munich
DEHeadquarters, development and manufacturing
- Materials
- DBC/AMB substrates, wafers, ceramics, glass, polyimide
- Vacuum reflow furnace (in-house production)
- Quartz tube furnace (in-house production)
- Furnace systems for electronic packaging (in-house production)
Systems and Components
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Vacuum reflow solderingJoining | – | – | – | – | DBC substrates, AMB substrates, semiconductor chips, MEMS, sensors, LEDs, printed circuit boards, T/R modules, ceramic and metal packages |
| Void-free soldering on DBC or AMB substratesJoining | – | – | – | – | DBC substrates, AMB substrates |
| AnnealingHeat treatment | – | – | – | – | inorganic substrates |
| SinteringHeat treatment | – | – | – | – | – |
| AlloyingHeat treatment | – | – | – | – | – |
| Doping (diffusion processes)Heat treatment | – | – | – | – | wafers |
| Thermal oxidation (dry and wet)Surface | – | – | – | – | wafers |
| Polyimide imidization / thermal cureHeat treatment | – | – | – | – | polyimide |
| Glass frit processesHeat treatment | – | – | – | – | glass, ceramic |
| Heat treatment of inorganic substratesHeat treatment | – | – | – | – | inorganic substrates, ceramic, glass |
| Vacuum and controlled atmosphere processesHeat treatment | – | – | – | – | – |
| TemperingHeat treatment | – | – | – | – | – |
| Package sealing (ceramic or metal packages)Joining | – | – | – | – | ceramic, metal |
| Thin-film and substrate processingSurface | – | – | – | – | substrates |
| Thick-film paste processesSurface | – | – | – | – | thick-film pastes, ceramic |
| Machine/plant engineering including design, software, electronics, manufacturing, commissioningEngineering | – | – | – | – | – |
| Service and maintenance of systemsEngineering | – | – | – | – | – |
| Reflow soldering for wafer-level packagingJoining | – | – | – | – | wafers |
3 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Vacuum reflow furnace | REK Innovation | – | – | – | Aschheim near Munich |
| Quartz tube furnace | REK Innovation | – | – | – | Aschheim near Munich |
| Furnace systems/plants for electronic packaging (in-house production) | REK Innovation | – | – | – | Aschheim near Munich |
Additional services
History
- 2020
Founding of REK Innovation GmbH by Venzi Rangelov, Felix Eiler and Markus Krauß