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Renesas – Fertigung

Develops and manufactures semiconductors and embedded solutions for automotive, industrial, infrastructure and IoT applications.

Renesas Logo

Renesas Electronics Corporation

Tokyo (Headquarters) · Yonezawa · Oita · Nishiki · Naka · Takasaki · Saijo · Kawashiri · Kulim · Beijing · SuzhouNew on Amplifa

>21,000 in over 30 countriesEmployees
11 factoriesLocations

About Renesas Electronics

Renesas Electronics Corporation is a Japanese semiconductor manufacturer headquartered in Tokyo and, according to its own statements, employs more than 21,000 staff in over 30 countries. The portfolio includes microcontrollers (MCU), microprocessors (MPU), analog ICs, power and GaN semiconductors, sensor technology and connectivity solutions, complemented by software, development tools and reference designs. The products are used, among other things, in automotive engineering, industrial automation, consumer electronics, communications infrastructure, robotics, healthcare and AI data centers. In-house manufacturing facilities with IATF-16949 certification are located in Japan (including Yonezawa, Oita, Nishiki, Naka, Takasaki, Saijo, Kawashiri) as well as in Malaysia and China; the GaN technology is based on a vertically integrated in-house wafer fabrication. The company additionally supports customers with functional safety in accordance with ISO 26262, IEC 61508 and IEC/UL 60730, as well as with embedded security and Edge-AI development.

Site
Yonezawa
Processes
Embedded/System Solutions, Development Tools, Software & Reference Designs, AI/ML Development Environment (e-AI Translator, Reality AI Tools), Functional Safety Support (ISO 26262, IEC 61508, IEC/UL 60730), Technical Support, Support Communities, Knowledge Base
Materials
Gallium Nitride (GaN), PR40 Process Technology, Silicon
Certificates
ISO 9001, IATF 16949, Functional Safety Support (ISO 26262/IEC 61508)
Employees
>21000
Industries
Automotive, Industry/Industrial Automation, Consumer Electronics, Communications Infrastructure, IoT, Robotics
  1. 01

    Chip Design

  2. 02

    Wafer Fabrication

  3. 03

    Test

  4. 04

    Package & Final Test

  5. 05

    Software and Development Tools

  6. 06

    Technical Support

Technologies and Processes

GaN

Gallium Nitride (GaN)

Wide-bandgap semiconductors for discrete power GaN FETs, GaN drivers and controllers in applications from 45 W to over 10 kW, manufactured in the company's own wafer process.

PR40

PR40 Process Technology

Complementary bipolar process on bonded SOI substrates for high-voltage precision analog applications.

Si

Silicon

Base material for MCU, MPU, analog and connectivity ICs.

Manufacturing Locations

Yonezawa

JP

Factory

Materials
Semiconductors

Oita

JP

Factory

Materials
Semiconductors

Nishiki

JP

Factory

Materials
Semiconductors

Naka

JP

Factory (Renesas Semiconductor Manufacturing)

Materials
Semiconductors

Takasaki

JP

Factory (Renesas Semiconductor Manufacturing)

Materials
Semiconductors

Saijo

JP

Factory (Renesas Semiconductor Manufacturing)

Materials
Semiconductors

Kawashiri

JP

Factory (Renesas Semiconductor Manufacturing)

Materials
Semiconductors

Kulim

MY

Factory (Renesas Semiconductor KL)

Materials
Semiconductors

Beijing

CN

Factory (Renesas Semiconductor Beijing)

Materials
Semiconductors

Suzhou

CN

Factory (Renesas Semiconductor Suzhou)

Materials
Semiconductors

Components

DFN 12-pin Chip (NCG12)
DFN 12-pin Chip (NCG12)IC Package · Electronics
TSSOP 16-pin Chip (PGG16)
TSSOP 16-pin Chip (PGG16)IC Package · Electronics
FCLGA 8-pin Chip (FL0008AA)
FCLGA 8-pin Chip (FL0008AA)IC Package · Electronics
LFBGA 368-pin Chip
LFBGA 368-pin ChipIC Package · Electronics
VFQFPN 28-pin Chip (NDG28)
VFQFPN 28-pin Chip (NDG28)IC Package · Electronics
SCQFN 72-pin Chip
SCQFN 72-pin ChipIC Package · Electronics
STQFN 44-pin Chip (QU0044AA)
STQFN 44-pin Chip (QU0044AA)IC Package · Electronics
SOIC 14-pin Chip
SOIC 14-pin ChipIC Package · Electronics

Inside the production

Humanoid robot with data center environment – low-voltage GaN portfolio
Humanoid robot with data center environment – low-voltage GaN portfolio
DSC 8x8 GaN chip for AI data centers
DSC 8x8 GaN chip for AI data centers
GreenPAK SLG46801V programmable IC
GreenPAK SLG46801V programmable IC
RZ/G3L and RZ/G3SE low-power microprocessors
RZ/G3L and RZ/G3SE low-power microprocessors
Battery management system for humanoid robots
Battery management system for humanoid robots
GaN-based 6.6 kW on-board charger
GaN-based 6.6 kW on-board charger
HMI solution: smart home control via tablet
HMI solution: smart home control via tablet

Industries

AutomotiveIndustry/Industrial AutomationConsumer ElectronicsCommunications InfrastructureIoTRoboticsHealthcareAI Data CenterEnergy/Renewable EnergiesAerospace/Hi-Rel

Additional services

Embedded/System SolutionsDevelopment Tools, Software & Reference DesignsAI/ML Development Environment (e-AI Translator, Reality AI Tools)Functional Safety Support (ISO 26262, IEC 61508, IEC/UL 60730)Technical Support, Support Communities, Knowledge Base

Quality and Certifications

Renesas follows a group-wide quality policy with a uniform quality management system across sales, development and manufacturing; factories in Japan, Malaysia and China are certified to IATF 16949, and numerous group companies to ISO 9001. Testing and support services include reliability reports (also for former Intersil products) as well as functional safety support in accordance with ISO 26262, IEC 61508 and IEC/UL 60730.

EvidenceCompany
IATF 16949
ISO 9001
Functional Safety Support (ISO 26262/IEC 61508)

History

  1. 2019

    Introduction of the RA family of 32-bit Arm Cortex-M microcontrollers for IoT applications.

  2. 2024

    Renesas rad-hard ICs (Intersil brand) on board JAXA's first Japanese lunar lander SLIM.

  3. 2026

    Expansion of the GaN portfolio: 650 V GaN in the dual-side-cooled 8x8 mm package and first low-voltage GaN FETs for AI data centers and robotics.

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