Contract manufacturing (EMS) for electronic assemblies: SMD and THT placement, soldering, assembly and testing
Rinklin Elektronik GmbH & Co. KG
Neuffen (DE)New on Amplifa
About Rinklin Elektronik
Rinklin Elektronik GmbH & Co. KG is an owner-managed family business based in Neuffen near Nürtingen (Baden-Württemberg) and produces exclusively on a contract basis: As a pure service company (EMS), it takes on the placement, soldering, assembly and testing of printed circuit boards and electronic assemblies for industry. Production includes SMD placement on two flexible Mydata machines with package sizes from 0201 to QFP256, a fully automatic stencil printing system with 2-D solder paste inspection as well as automatic THT placement of axial and radial components. The process spectrum includes lead-free wave soldering for PCBs up to 380 mm width, full-tunnel soldering with inert gas, selective soldering and manual placement. The assembly department produces complete assemblies including cable assembly, screwing, connector and housing assembly. Quality assurance is carried out, among other things, by AOI systems (Orbotech, Viscom) and flying probe testing; the company is certified to ISO 9001 and all workplaces are ESD-protected. Around 20 employees produce prototypes as well as small to medium batch sizes for customers from the electronics and industrial applications sectors.
- Site
- Neuffen
- Processes
- SMD placement (SMT production), THT automatic placement axial (IC, axial, radial), THT automatic placement radial, Manual placement, Wave soldering (up to 380 mm width, lead-free), Full-tunnel soldering with inert gas (lead-free), Selective soldering (SPA 400, lead-free with inert gas/nitrogen), Assembly of electronic assemblies incl. cable assembly, screwing, connector and housing assembly
- Materials
- Printed circuit boards (printed circuit boards and assemblies), SMD components (package sizes 0201 to QFP256), THT components (IC, axial, radial), Solder paste (lead-free), SMD components, Printed circuit boards and assemblies, Lead-free solder paste/soldering processes
- Certificates
- ISO 9001, ESD-protected workplaces, AOI / 2-D solder paste inspection, Flying probe test
- Founded
- 1982
- Employees
- 20
- Industries
- Electronics industry, Contract manufacturing (EMS) for industry
- 01
Purchasing/component procurement (optional)
- 02
Solder stencil printing
- 03
SMD placement
- 04
THT automatic placement
- 05
Manual placement
- 06
Wave/full-tunnel/selective soldering
- 07
AOI
- 08
Assembly incl. cable assembly
- 09
Electrical testing / flying probe test
- 10
Warehousing and shipping
Components and Processes
SMD components
Placement of package sizes 0201 to QFP256 on two Mydata machines with SMD Tower supply (<5 % humidity).
THT components (IC, axial, radial)
Automatic placement of axial resistors and diodes (RM 7.5–22 mm) as well as radial capacitors, LEDs and electrolytic capacitors (RM 2.5/5 mm).
Printed circuit boards and assemblies
Base material for placement, soldering, assembly and testing on customer order.
Lead-free solder paste/soldering processes
Lead-free soldering by wave soldering, full-tunnel system with inert gas and selective soldering system.
Location
Neuffen
DEMain plant: SMD/THT production, assembly, administration
- Lot size
- Prototypes, small to medium series
- Materials
- Printed circuit boards, SMD and THT components
- 2 Mydata SMD placement machines
- SMD Tower (MYDATA)
- Ersa fully automatic stencil printer with AOI
- Universal VCD 88 (THT axial)
- Universal RAD 88 (THT radial)
- Seho wave soldering machine 8041-PCS
- Seho full-tunnel soldering system with inert gas
- Ebso SPA 400/SPA400-F selective soldering system
- 5 Heeb Laserlite tables
- AOI Orbotech and Viscom
- Flying probe test system
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMD placement (SMT production)Assembly | – | – | – | small batch sizes – medium batch sizes | Printed circuit boards, SMD components (package sizes from 0201 to QFP256) |
| THT automatic placement axial (IC, axial, radial)Assembly | – | – | – | – | axial resistors, diodes, ceramic capacitors, ICs |
| THT automatic placement radialAssembly | – | – | – | – | radial capacitors, transistors, LEDs, electrolytic capacitors, ceramic capacitors, film capacitors (RM 2.5 mm / RM 5 mm) |
| Manual placementAssembly | – | – | – | – | Printed circuit boards, Assemblies |
| Wave soldering (up to 380 mm width, lead-free)Joining | – | 380 mm | – | – | Printed circuit boards |
| Full-tunnel soldering with inert gas (lead-free)Joining | – | – | – | – | Printed circuit boards |
| Selective soldering (SPA 400, lead-free with inert gas/nitrogen)Joining | – | – | – | Small series – Medium series | THT components on printed circuit boards (e.g. displays, |
| Assembly of electronic assemblies incl. cable assembly, screwing, connector and housing assemblyAssembly | – | – | – | Prototypes/small series | – |
| Electrical testing / flying probe testTesting | – | – | – | – | Assemblies |
| Automated optical inspection (AOI)Testing | – | – | – | – | Printed circuit boards, Solder paste (2-D inspection) |
| Solder stencil printing (fully automatic with AOI)Assembly | – | – | – | – | Solder paste, Printed circuit boards |
| Functional tests, intermediate inspections, final inspection after assemblyTesting | – | – | – | – | Assemblies |
12 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMD placement machine | Mydata | 2 | – | 1997 (Einf | Neuffen |
| SMD Tower (supply of SMD reels/trays, <5% humidity) | MYDATA | – | – | – | Neuffen |
| Fully automatic stencil printer with AOI (2-D solder paste inspection) | Ersa | 1 | – | 2008 | Neuffen |
| THT axial placement machine | Universal VCD 88 | 1 | RM 7.5 mm – 22 mm | 2012 | Neuffen |
| THT radial placement machine | Universal RAD 88 | 1 | RM 2.5 mm / RM 5 mm | 2016 | Neuffen |
| Wave soldering machine (lead-free) | Seho 8041-PCS | 1 | up to 380 mm width | – | Neuffen |
| Full-tunnel soldering system with inert gas | Seho | 1 | – | 2018 | Neuffen |
| Selective soldering system / mini-wave selective soldering system | Ebso SPA 400 / SPA400-F | 1 | – | 2007 | Neuffen |
| Heeb Laserlite table with cutting mechanism | Heeb Laserlite | 5 | – | – | Neuffen |
| AOI system (Automated Optical Inspection) | Orbotech | – | – | 2004 | Neuffen |
| AOI system | Viscom | 1 | – | 2008 | Neuffen |
| Flying probe test system | – | – | – | 2014 | Neuffen |
Additional services
Quality and Certification
The company is certified to ISO 9001 (since 2005), all workplaces are ESD-protected. Testing includes AOI systems (Orbotech, Viscom), 2-D solder paste inspection at the stencil printer, electrical tests with flying probe testing as well as functional, intermediate and final inspections.
| Evidence | Neuffen |
|---|---|
| ISO 9001 | |
| ESD-protected workplaces | |
| AOI / 2-D solder paste inspection | |
| Flying probe test |
History
- 1982
Founded by Hans Rinklin in Neuffen/Württemberg
- 1984
Move into the rented production premises in Neuffen, Bahnhofstraße 28
- 1986
Introduction of SMD technology
- 1991
Changeover to automatic THT placement (IC, axial and radial)
- 1997
Expansion of SMD production Mydata/IBL/MPM
- 2002
Changeover from Grasmann to Seho wave soldering machine
- 2004
Introduction of AOI (Automated Optical Inspection, Orbotech)
- 2005
Renamed Rinklin Elektronik GmbH & Co. KG; Peter Rinklin joins; second Seho wave soldering machine for RoHS applications; certification to ISO 9001
- 2006
Move into the company's own building in Neuffen, Auchtertstraße 12
- 2007
Acquisition of the Ebso SPA 400 selective soldering system
- 2008
Carsten Fliegner joins; fully automatic Ersa printer with AOI and AOI system from Viscom
- 2010
Internal relocation and expansion of SMD placement
- 2012
Replacement of the THT axial placement machine with a Universal VCD 88
- 2014
Introduction of flying probe testing
- 2016
Replacement investment in the THT radial machine Universal RAD 88
- 2018
Introduction of a full-tunnel soldering system
- 2020
Handling of interesting tasks of all kinds during the corona pandemic
- 2023
Expansion of the SMD line
- 2025
Company founder Hans Rinklin passed away (29.06.2025)