Service provider for taping, processing, programming and measurement of electronic components – from small batches to large-scale series
S&P Dienstleistungen in der Mikroelektronik GmbH
Kirchheim unter Teck · Weilheim an der TeckNew on Amplifa
About S&P Mikroelektronik
S&P Dienstleistungen in der Mikroelektronik GmbH was founded in 1997 in Dettingen unter Teck and has been based in Kirchheim unter Teck since 2000. The medium-sized company operates as a service provider for the packaging and finishing of electronic components. Its range of services includes optical 2D and 3D measurement and taping of components into blister tape (tape & reel) as well as tube, tray, bulk and frame taping, processing by cutting, bending and crimping, programming of flashes, PROMs and controllers, component drying including dry-pack packaging, and marking by paint, laser or label. The offering is complemented by visual inspection, selection, project management, carrier tape, process and measurement program development, and the design of special machines, tools and fixtures. Customers include industries such as the automotive industry, mechanical engineering, medical, aerospace and aviation technology, industrial and consumer electronics, and telecommunications. The quality management system is certified to ISO 9001:2015 and IATF 16949; since 2023 a large external warehouse has been available in Weilheim an der Teck.
- Site
- Kirchheim unter Teck
- Processes
- Taping (tape & reel) into blister tape, Tube taping, Tray taping, Bulk taping, Frame taping, Carrier tape development, Process development, Machine selection incl. design support, trial runs, acceptance (design acceptance,
- Materials
- Kapton, Polyimide, Taping into blister tape (tape & reel), Tube taping, Tray taping, Drying and dry-pack packaging, Kapton and polyimide
- Certificates
- ISO 9001:2015, IATF 16949:2016, ISO 9001, IATF 16949
- Founded
- 1997
- Industries
- Automotive industry, Mechanical engineering, Medical technology, Aerospace and aviation technology, Industrial and consumer electronics, Telecommunications
- 01
Project management and consulting
- 02
Carrier tape and process development
- 03
Processing (cutting, bending, crimping, THT to SMD)
- 04
Programming (flashes, PROMs, controllers)
- 05
Drying and packaging (dry-pack)
- 06
Component measurement (2D/3D inspection, 3D profilometer)
- 07
Marking (paint, laser, label)
- 08
Taping (tube, tray, bulk, frames)
- 09
Visual inspection and selection
- 10
Documentation and shipping
Materials and Processes
Taping into blister tape (tape & reel)
Packaging of components into blister tape with optical 2D/3D inspection for SMD placement.
Tube taping
Taping of components from tubes with quickly set-up changeover kits, among others for SO, SSOP, TSSOP, MSOP and QFN.
Tray taping
Processing of JEDEC, 4" and 2" trays or waffle packs.
Drying and dry-pack packaging
Temperature- and humidity-controlled drying followed by moisture-protected packaging.
Kapton and polyimide
Used as label material within the additional services.
Locations
Kirchheim unter Teck
DEHeadquarters, production and administration
- Lot size
- Small batches to large-scale series
- Materials
- Electronic components
- Taping machines (fully automatic) with tray and tube equipment
- Fully automatic bending robot
- Pick-and-place portal with 4 Z-axes
- Fully automatic optical 2D/3D inspection
- Semi-automatic machines
- 3D profilometer
Weilheim an der Teck
DEExternal large warehouse (since 2023)
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Taping (tape & reel) into blister tapeAssembly | – | – | – | Small batches – Large-scale series | – |
| Tube tapingAssembly | – | – | – | – | – |
| Tray tapingAssembly | – | – | – | – | – |
| Bulk tapingAssembly | – | – | – | – | – |
| Frame tapingAssembly | – | – | – | – | – |
| Carrier tape developmentEngineering | – | – | – | – | – |
| Process developmentEngineering | – | – | – | – | – |
| Machine selection incl. design support, trial runs, acceptance (design acceptance,Engineering | – | – | – | – | – |
| Measurement program developmentEngineering | – | – | – | – | – |
| Project managementEngineering | – | – | – | – | – |
| Processing – cuttingMachining | – | – | – | – | – |
| Processing – bending (package-compensated, fully automatic)Forming | – | – | – | – | – |
| Processing – crimpingForming | – | – | – | – | – |
| THT (through-hole technology)Assembly | – | – | – | – | – |
| THT to SMDAssembly | – | – | – | – | – |
| Programming – flashesEngineering | – | – | – | – | – |
| Programming – PROMsEngineering | – | – | – | – | – |
| Programming – controllersEngineering | – | – | – | – | – |
| Drying and packaging – temperatureHeat treatment | – | – | – | – | – |
| Drying and packaging – temperature & humidityHeat treatment | – | – | – | – | – |
| Drying and packaging – dry-packHeat treatment | – | – | – | – | – |
| Component measurement – 2D inspectionTesting | – | – | – | – | – |
| Component measurement – 3D inspection (coplanarity, standoff, pitch and much more)Testing | – | – | – | – | – |
| Component measurement – 3D profilometerTesting | – | – | – | – | – |
| OCR and marking inspectionsTesting | – | – | – | – | – |
| Marking – paint markingSurface | – | – | – | – | – |
| Marking – laser markingSurface | – | – | – | – | – |
| Marking – label markingSurface | – | – | – | – | – |
| Visual inspection of electronic componentsTesting | – | – | – | – | – |
| Selection of componentsTesting | – | – | – | – | – |
| Additional services: pressing on placement aids, Kapton and polyimide labels, punching andAssembly | – | – | – | – | Kapton, Polyimide |
| Procurement and/or production of production materials (carrier tape, trays 4" or JEDEC, pick-upEngineering | – | – | – | – | – |
| Design of blister tapes with unusual dimensions as well as development of specialEngineering | – | – | – | – | – |
| Processing of JEDEC, 4" and 2" trays or waffle packs; tube changeover kits for SO 150 mil, SSOPAssembly | – | – | – | – | – |
5 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Taping machine (fully automatic) with tray and tube equipment, fully automatic optical | – | 3 | JEDEC, 4" and 2" trays or waffle packs; tube changeover kits for SO 150 mil, SSOP 209 mil, TSSOP 173 | 2024 | Kirchheim unter Teck |
| Fully automatic bending robot (package-compensated processing of parts, designed by S&P | – | 1 | – | 2021 | Kirchheim unter Teck |
| Fully automatic machines (taping/finishing of electronic components) | – | – | – | – | Kirchheim unter Teck |
| Semi-automatic machines (taping/finishing of electronic components) | – | – | – | – | Kirchheim unter Teck |
| 3D profilometer (component measurement) | – | – | – | – | Kirchheim unter Teck |
Additional services
Quality and Certifications
The quality management system is certified to ISO 9001:2015 and IATF 16949 (TÜV SÜD, each valid until 11.07.2027). Every item shipped is fully traceable through intensive quality control and complete documentation of all work steps.
| Evidence | Kirchheim unter Teck |
|---|---|
| ISO 9001 | |
| IATF 16949 |
Company History
- 1997
Founded as a GbR by Gerd Salomonsen and Andreas Plescher in Dettingen unter Teck; core business is tape-and-reel packaging including optical 3D measurement.
- 1998
Conversion to a GmbH following strong growth.
- 2000
Relocation of the company headquarters to Kirchheim unter Teck.
- 2001
Introduction of the quality management system in accordance with ISO 9001.
- 2005
Acquisition of an additional company building.
- 2007
Certification in accordance with ISO/TS 16949 for the automotive industry.
- 2014
Start of extended large-scale series production in modernized and expanded production space.
- 2017
Certification in accordance with ISO 9001:2015 and 20th company anniversary.
- 2018
Certification in accordance with IATF 16949.
- 2021
Commissioning of the first fully automatic bending robot with package-compensated processing.
- 2023
Expansion of production space and occupancy of the external large warehouse in Weilheim an der Teck.
- 2024
Investment of over €1 million in three new taping machines for medium volumes in the IC sector.